President's Award Recipients

Year Award Recipient
2018 Ms. Susan Trulli
2017 Mr. Nozad Karim
2017 Mr. Mike Gervais
2016 Mr. David C. Virissimo
Dr. Voya Markovich
Dr. Colin Johnston
For hist consistent, steadfast and dedicated leadership in developing and supporting international conferences on high temperature electronics in both the United Kingdom and the United States.
Dr. Rajen Chanchani
For his dedication to IMAPS as a volunteer leader.
Mr. Pete Elenius
For his dedication and enthusiasm in supporting the IMAPS International Conference and Exhibition on Device Packaging and providing the leadership necessary to deliver value to the members participating in the event.
Dr. Aicha Elshabini
Aicha is well known in the packaging community for over two decades and has served IMAPS in a great number of volunteer positions. Most recently we would like to thank her for her tremendous support and development of our student programs.
Dr. Phil Garrou
Through his long time experience with IMAPS and his depth of technical knowledge, Phil has continuously supported the Society’s Symposiums, conferences and workshops. His most recent contributions to the Device Packaging Conference have helped make it the premium conference for advanced packaging technology concepts.
Howard Imhof
By using his diplomatic and negotiating skills , Howard helped to bring balance between the technical and marketing sides of the Society. He laid valuable support to the ongoing efforts of an IMAPS’ One World Membership.
David Virissimo
For his tireless service to the Society through numerous leadership positions on the Executive Council, but most recently his passion and enthusiasm to further the goals of the Microelectronics Foundation.
Steve Adamson
For dedicated efforts in ensuring a successful reorganization of the IMAPS MIcroelectronics Foundation and increasing its financial resources.
Dr. Nihal Sinnadurai
For diplomacy in establishing professional relations between North American and European leaders of IMAPS, and contributions to the One World Membership.
Dr. W. Kinzy Jones
For initiating a platform of discussion between North American and European leaders of IMAPS leading to a path forward on an international basis.
Michael Ehlert
For his effort in ensuring a successful CICMT Conference and also for sharing his technical knowledge with the LTCC Standards Committee.
C. Michael Newton
For providing outstanding leadership to the Florida Chapter and establishing the Printed Devices Workshop and ensuring its continuance.
Mark Occhionero
For providing outstanding leadership to the New England Chapter, establishing and maintaining its incredible website and being IMAPS-NE's most enthusiastic cheerleader!
Lee Levine
For envisioning the possibility of a joint wire bonding Advanced Technology Workshop with SEMI at Semicon 2008 and having the persistence and persuasion to make it happen.
Ken Kuang
For envisioning the possibility of a joint Advanced Technology Workshop with the San Diego Chapter on RF and Microwave Packaging. For having the persistence of vision to execute a unique plan successfully.
Jens Mueller
Having the persistence of vision and enthusiasm to accept responsibility for the success of the first four-party CICMT 2008 Conference and having the ingenuity and integrity to make it a success in Munich, Germany.




  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic