KESTER

Call For Abstracts and Announcements

ATTENTION! IMAPS wants you to know about some very exciting events that are coming up, whether you would like to submit an abstract or attend, please take a few minutes to review this information. Should you decide to submit an abstract or want more information, please specify the meeting, since there are many options:

Chair/Speaker Roles and Responsibilities | PDC Submissions


Topical Workshop on Additive Manufacturing (Huntsville)
ABSTRACT DEADLINE: July 12, 2017
Meeting Date: September 13-14, 2017
Meeting Location: Jackson Center, Huntsville, Alabama - USA

Topical Workshop and Tabletop Exhibition on Thermal Management
ABSTRACT DEADLINE: August 9, 2017
Meeting Date: November 7-9, 2017
Meeting Location: Toll House Hotel, Los Gatos, California - USA

International Conference on DEVICE PACKAGING (DPC 2018)
ABSTRACT DEADLINE: October 18, 2017
Meeting Date: March 5-8, 2018
Meeting Location: WeKoPa Resort, Fountain Hills, Arizona - USA

 

 

 

MORE SOON

Closed Calls
The abstract cut-off dates are occasionally extended. To find out whether abstracts are still being accepted on the meetings below contact Brian Schieman by E-Mail: bschieman@imaps.org or by Phone at 412-368-1621.

 

International Conference on High Temperature Electronics Network (HiTEN 2017)
Meeting Date: July 10-12, 2017
Meeting Location: Queens' College, Cambridge - United Kingdom

IMAPS 2017 - Raleigh (50th International Symposium on Microelectronics)
Meeting Date: October 9-12, 2017
Meeting Location: Raleigh Convention Center, Raleigh, North Carolina - USA

Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging 2017
Meeting Date: June 15, 2017
Meeting Location: Binghamton University | Center of Excellence Building 85 Murray Hill Road Vestal, New York 13850 - USA

 

 


Get involved submit an abstract of your work!

Submit your abstracts online at:  http://www.imaps.org/abstracts.htm

 

 
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