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Announcement and Call for Abstracts
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IMAPS and SEMI proudly announce an
Advanced Technology Workshop on |
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Wire Bonding
Monday, July 14, 2008
Intercontinental Hotel, San Francisco
Co-located with SEMICON West 2008
Abstract Deadline: Friday, April 18, 2008
Wire Bonding Workshop Focus:
The objective of the Wire Bonding Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of wire bond interconnections. This workshop enables discussion and presentation of the latest wire bonding technology.
- Fine pitch wire bonding
- Stacked die wire bonding and looping
- Heavy wire wedge and ribbon bonding
- Assembly processes and handling issues
- Bumping for High Brightness LEDs and Solar arrays
- Novel wire bonded packages and designs
- High Frequency wire bond packages
- Electromigration and Interfacial Adhesion
- Reliability and Testing
- Simulation and Modeling
Those wishing to present a paper at the Wire Bonding Advanced Technology Workshop must submit a 200-300 word abstract electronically by Friday, April 18, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than June 13, 2008.
Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
All Speakers are required to pay a reduced registration fee and are required to attend the entire event.
Submit Abstract(s)
Speaker Dates/Information:
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Abstract(s) due to IMAPS: April 18, 2008
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Speaker Notification/Confirmation emailed: April 30, 2008
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Extended Abstract or Presentation Material due: June 13, 2008
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Powerpoint/Presentation file for CD-Rom due not later than: July 14, 2008
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Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
- Technical Presentation Time: 25 minutes (20 to present; 5 for Q&A)
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