Wire Bonding Workshop Focus:
The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. The workshop has been specifically organized to allow for the presentation and debate of leading edge Wire Bonding Technology and Applications.
- Copper Ball Bonding and Bumping
- Cu/Low-K Processes and Materials
- Stacked Die and 3D Packaging
- Wire Bonding and Bumping
- Novel Packaging and Design
- Heavy Wire Bonding
- Failure Analysis and Reliability
- Electromigration and Interfacial Adhesion
- Testing and Probing Challenges
- Simulation and Modeling
Those wishing to present a paper at the Wire Bonding Topical Workshop must submit a 200-300 word abstract electronically by April 30, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than June 18, 2010.
Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.
The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form; will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check at the ATW/Conference. The selected student must attend the event to present his or her work and receive the award. The Foundation will return the registration fee for the winner. The winner must pay for travel and lodging expenses.
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
All Speakers are required to pay a reduced registration fee and are required to attend the entire event.
Submit Abstract(s)
