IMAPS - International Microelectronics And Packaging Society: Bringing together the entire microelectronics supply chain!


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International Conference on
Alternative Energy

Albuquerque Embassy Suites Hotel & Spa
Albuquerque, New Mexico - USA
January 16-18, 2007

Call for Abstracts
Abstracts are Still Being Accepted
(download pdf)

Sponsored by:
International Microelectronics And Packaging Society (IMAPS)
Everything in electronics between the chip and the system!

General Chair:
Roupen Keusseyan
DuPont
roupen.l.keusseyan@usa.dupont.com

Technical Co-Chair:
Xuan Wang
Intel
xuan.wang@intel.com

Technical Co-Chair:
Keith Easler
keasler@cox.net

The Energy Conference will be held at the Albuquerque Embassy Suites Hotel & Spa, Albuquerque, New Mexico; and is being sponsored by the International Microelectronics And Packaging Society (IMAPS). The Energy conference is a continuation of the past Fuel Cell Workshop and will also focus on this critical field that will be affecting every aspect of our lives worldwide. Core issues involve new technologies, materials and processes for renewable, non-renewable and innovative application of existing technologies. Incentives for research, investment and adoption are already practiced in some Asian and European countries. Following new energy policies in the US and other countries, these incentives are now available to encourage adoption, research and development of new technologies.


Energy

Solar Energy (Photovoltaics)
BioFuels and Energy from Waste
Fuel Cells
Wind Energy
Batteries and Hybrids

Thermal and Power Management
Environmental Regulations
Design for Efficiency

Materials & Reliability
Qualification Approaches
RoHS Compliance & Regulations
Outsourcing Issues
Government Policies

Bringing Together the Entire
Microelectronics Supply Chain!

IMAPS Supply Chain Pyramid


Those wishing to present a paper at the Energy Conference, please submit a 250-300 word abstract electronically, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please email Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

All abstracts submitted must represent original, previously unpublished work. The abstracts should highlight the industry, application area, design, and process/material, the submission section will aid in grouping the work within the four areas.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

No formal technical paper is required. A reproduction-ready one- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on December 15, 2006. A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All speakers are required to pay a reduced registration fee.

 

 

 


 


IMAPS-International Microelectronics And Packaging Society
and The Microelectronics Foundation
Everything in electronics between the chip and the system!
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001 | Fax: 202-548-6115 | E-mail: imaps@imaps.org

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