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IMAPS 2012 - San Diego
45th International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!
September 9 - 13, 2012
San Diego Town & Country Convention Center
San Diego, California, USA
www.imaps2012.org |
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Conference
and Exhibition:
September 11-13, 2012
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Professional
Development Courses:
September 9 - 10, 2012 |
General Chair:
Richard Sigliano
Kyocera America, Inc.
rick.sigliano@kyocera.com
Technical Chair:
Matt Nowak
Qualcomm, Inc.
mnowak@qualcomm.com
Technical Co-Chair - USA:
Martin Goetz
Northrop Grumman Corporation
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Technical Co-Chair - Europe:
Ivan Ndip
Fraunhofer IZM
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Technical Co-Chair - Asia:
Choon Lee
Amkor Technology
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The 45th International Symposium on Microelectronics will be held at the Town and Country Convention Center, San Diego, California, USA, and is being organized by the International Microelectronics And Packaging Society (IMAPS). The IMAPS Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The 45th Symposium on Microelectronics will cover three tiers of electronics: Systems and Applications; Design and related measurements; and Materials, Process and Reliability. IMAPS 2012 will feature 5-6 technical tracks that span the two and a half days of sessions on: 3D IC/Packaging; Modeling, Design & Reliability; Next Generation Materials; Advanced Technologies; Advanced Packaging; Assembly and Packaging; as well as Invited/Translated Sessions and an Interactive/Academic Poster Session.
Sessions are being planned and abstracts will be considered on the topics listed below. Abstracts are rated by the technical committee members and are selected into the sessions by the session chairs appointed by the technical committee. Authors should identify their preferred session (topical area) when submitting their abstracts. Abstracts should highlight the major contributions of the work in one or more of these areas. All abstracts submitted must represent original, previously unpublished work.
| Industries Represented |
• Consumer, Portable and Wireless
• Biomedical
• Telecom
• Defense and Security
• Computing, and Gaming
• Automotive, Industrial, Harsh Environment Electronics Applications
• Solar and Alternative Energy |
| Systems & Applications |
• Low Cost Electronics
• Outsourcing and Supply Chain Management
• Thermal Management
• System Packaging
• Power Management
• Electromagnetic Interference (EMI)
• Electrostatic Discharge (ESD) Protection
• Wireless Sensors and Energy Harvesters
• Nano-Integrated Packaging
• Microwave & RF Applications
• Photonic Packaging
• Packaging for Harsh Environments
• MEMS Packaging
• Biological and Microfluidic Packaging
• LED Packaging
• Packaging of Compound Semiconductor Devices
• Emerging Applications |
| Interactive Poster Session |
Outstanding papers will be considered for this interactive session(s). |
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| Design and Related Measurements |
• 2.5D & 3D Packaging Approaches
• 3D Simulation and Modeling
• Electrical Modeling, Signal & Power Integrity
• Mechanical Modeling and Related Metrology
• High Performance Interconnects and Boards
• Embedded and Integrated Passives
• Wafer Level Packaging / CSP
• Design for Manufacturing/Reliability/Thermal |
| Materials, Process, and Reliability |
• Flip-Chip, Copper Pillar, TSV, Wafer Thinning and Wafer Bumping
• 2.5D Silicon/Glass Interposers and 3D Direct Chip Stacking
• Polymers, Underfill/Encapsulants and Adhesives
• Advanced Materials and Novel Assembly Processes
• Thick / Thin Films
• Warpage Characterization and Mitigation
• Pb-Free Solder Materials, RoHS
• Package Reliability Testing
• Wirebonding and Stud Bumping
• Ceramic and LTCC Packaging
• Substrate Materials and Technology
• Printed and Flexible Electronics |
| "Invited" & "Translated" Sessions |
The following special sessions are being considered for IMAPS 2012 and speakers will be invited along these areas:
• Packaging in Japan (Japanese
to English translation)
• European Perspective on Electronic Packaging and System-Integration
• Microelectronics Activity in Southern California (Military, Bio-Medical, Wireless, and other topics) |
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Abstracts Due: Still Being Accepted
Notice of Acceptance: April 27, 2012
Final Manuscripts Due: June 22, 2012
Early Registration / Hotel Deadline: August 15, 2012
Please send your 250-300
word abstract electronically only using the On-line submittal form at: www.imaps.org/abstracts.htm. All Speakers are required to pay a reduced registration fee. If you need assistance with the on-line
submittal form, please email Brian Schiemant at bschieman@imaps.org or call 202-548-8715.
Special Paper Recognition - Cash Awards Offered!
Best Paper of the Symposium - One (1)
$2000 Cash Award
Outstanding Paper - Two (2) $500 Cash Awards
Best Paper of Session - top 5 considered for Best
of Symposium and Outstanding Papers.
IMAPS Microelectronics Foundation Student Paper Awards
The Foundation is offering $5000 in awards to the best papers submitted and presented by students at IMAPS 2012. |
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
Hotel Reservations (Hotel Deadline: August 15, 2012)
Reservations must be made directly with the:
Town and Country Resort and Convention Center
500 Hotel Circle North
San Diego, CA 92108
www.towncountry.com
DETAILS SOON
IMAPS cannot guarantee room availability and/or rates after the published hotel deadline. Book your rooms directly with the hotel before the deadline noted above.
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