Call For Abstracts and Announcements

ATTENTION! IMAPS wants you to know about some very exciting events that are coming up, whether you would like to submit an abstract or attend, please take a few minutes to review this information. Should you decide to submit an abstract or want more information, please specify the meeting, since there are many options:

Chair/Speaker Roles and Responsibilities | PDC Submissions



International Conference on High Temperature Electronics Network (HiTEN 2017)
Meeting Date: July 10-12, 2017
Meeting Location: Queens' College, Cambridge - United Kingdom

IMAPS 2017 - Raleigh (50th International Symposium on Microelectronics)
Meeting Date: October 9-12, 2017
Meeting Location: Raleigh Convention Center, Raleigh, North Carolina - USA

Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging 2017
Abstracts Deadline: March 31, 2017
Meeting Date: June 15, 2017
Meeting Location: Binghamton University | Center of Excellence Building 85 Murray Hill Road Vestal, New York 13850 - USA

IMAPS Workshop on RF and Microwave Packaging (RaMP 2017 - France)
Abstract Deadline Extended: February 24, 2017
Meeting Date: April 26-27, 2017
Meeting Location: Espace Saint-Martin PARIS - FRANCE


Closed Calls
The abstract cut-off dates are occasionally extended. To find out whether abstracts are still being accepted on the meetings below contact Brian Schieman by E-Mail: or by Phone at 412-368-1621.


13th International Conference and Exhibition on Device Packaging
Meeting Date: March 6-9, 2017
Meeting Location: WeKoPa Resort, Fountain Hills, Arizona - USA

13th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2017)
Meeting Date: April 19-21, 2017
Meeting Location: Todai-ji Museum Nara - Japan


Get involved submit an abstract of your work!

Submit your abstracts online at:


  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems