Call For Abstracts and Announcements

ATTENTION! IMAPS wants you to know about some very exciting events that are coming up, whether you would like to submit an abstract or attend, please take a few minutes to review this information. Should you decide to submit an abstract or want more information, please specify the meeting, since there are many options:

Chair/Speaker Roles and Responsibilities | PDC Submissions


International Conference on DEVICE PACKAGING (DPC 2018)
ABSTRACT DEADLINE: October 18, 2017
Meeting Date: March 5-8, 2018
Meeting Location: WeKoPa Resort, Fountain Hills, Arizona - USA

2018 Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics
ABSTRACT DEADLINE: October 31, 2017
Meeting Date: January 23-24, 2018
Meeting Location: Handlery Hotel, San Diego, California - USA

IMAPS/ACerS 14th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2018)
ABSTRACT DEADLINE: November 30, 2017
Meeting Date: April 18-20, 2018
Meeting Location: University of Aveiro - Portugal

IMAPS International Conference and Exhibition on High Temperature Electronics (HiTEC 2018)
ABSTRACT DEADLINE: January 22, 2018
Meeting Date: May 8-10, 2018
Meeting Location: Hotel Albuquerque Albuquerque, New Mexico - USA





Closed Calls
The abstract cut-off dates are occasionally extended. To find out whether abstracts are still being accepted on the meetings below contact Brian Schieman by E-Mail: bschieman@imaps.org or by Phone at 412-368-1621.



IMAPS 2017 - Raleigh (50th International Symposium on Microelectronics)
Meeting Date: October 9-12, 2017
Meeting Location: Raleigh Convention Center, Raleigh, North Carolina - USA

Topical Workshop and Tabletop Exhibition on Thermal Management
Meeting Date: November 7-9, 2017
Meeting Location: Toll House Hotel, Los Gatos, California - USA




Get involved submit an abstract of your work!

Submit your abstracts online at:  http://www.imaps.org/abstracts.htm


  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems