Micross

Call For Abstracts and Announcements

ATTENTION! IMAPS wants you to know about some very exciting events that are coming up, whether you would like to submit an abstract or attend, please take a few minutes to review this information. Should you decide to submit an abstract or want more information, please specify the meeting, since there are many options:

Chair/Speaker Roles and Responsibilities | PDC Submissions


 

IMAPS/ACerS 14th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2018)
ABSTRACT DEADLINE Extended: January 31, 2018
Meeting Date: April 18-20, 2018
Meeting Location: University of Aveiro - Portugal

IMAPS International Conference and Exhibition on High Temperature Electronics (HiTEC 2018)
ABSTRACT DEADLINE Extended: February 16, 2018
Meeting Date: May 8-10, 2018
Meeting Location: Hotel Albuquerque Albuquerque, New Mexico - USA

IMAPS 2018 - PASADENA (51st International Symposium on Microelectronics)
ABSTRACT DEADLINE: January 31, 2018
Meeting Date: October 8-11, 2018
Meeting Location: Pasadena Convention Center, Pasadena, California - USA

Topical Workshop & Tabletop Exhibition on WIRE BONDING
ABSTRACT DEADLINE: March 30, 2018
Meeting Date: October 8, 2018
Meeting Location: Pasadena Convention Center, Pasadena, California - USA
**Co-located with IMAPS 2018

 

 

 

MORE SOON

Closed Calls
The abstract cut-off dates are occasionally extended. To find out whether abstracts are still being accepted on the meetings below contact Brian Schieman by E-Mail: bschieman@imaps.org or by Phone at 412-368-1621.

 

 

International Conference on DEVICE PACKAGING (DPC 2018)
Meeting Date: March 5-8, 2018
Meeting Location: WeKoPa Resort, Fountain Hills, Arizona - USA

 

 

 


Get involved submit an abstract of your work!

Submit your abstracts online at:  http://www.imaps.org/abstracts.htm

 

 
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