Honeywell

Call For Abstracts and Announcements

ATTENTION! IMAPS wants you to know about some very exciting events that are coming up, whether you would like to submit an abstract or attend, please take a few minutes to review this information. Should you decide to submit an abstract or want more information, please specify the meeting, since there are many options:

Chair/Speaker Roles and Responsibilities | PDC Submissions


 

 

 

Advanced Technology Workshop and Tabletop Exhibit on Advanced Packaging for Medical Microelectronics
ABSTRACT DEADLINE Extended to: October 31, 2018
Meeting Date: January 22-23, 2019
Meeting Location: Handlery Hotel, San Diego, California - USA

IMAPS/ACerS 15th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2019)
ABSTRACT DEADLINE: November 30, 2018
Meeting Date: April 17-19, 2019
Meeting Location: Shanghai, China

Device Packaging
ABSTRACT DEADLINE: October 26, 2019
Meeting Date: March 4-7, 2019
Meeting Location: WeKoPa Resort, Fountain Hills, Arizona - USA

IMAPS 2019 - BOSTON (52nd International Symposium on Microelectronics)
ABSTRACT DEADLINE: January 31, 2019
Meeting Date: September 30-October 3, 2019
Meeting Location: Hynes Convention Center, Boston, Massachusetts - USA

IMAPS International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2019)
ABSTRACT DEADLINE: January 31, 2019
Meeting Date: July 8-10, 2019
Meeting Location: St. Anne’s College in the University of Oxford, Oxford, United Kingdom

IMAPS 2019 - BOSTON (52nd International Symposium on Microelectronics)
Meeting Date: September 30 - October 3, 2019
Meeting Location: Hynes Convention Center, Boston, Massachusetts- USA

 

 

 

MORE SOON

Closed Calls
The abstract cut-off dates are occasionally extended. To find out whether abstracts are still being accepted on the meetings below contact Brian Schieman by E-Mail: bschieman@imaps.org.

 

Advanced Technology Workshop and Tabletop Exhibit on Thermal Management
Meeting Date: November 6-8, 2018
Meeting Location: Toll House Hotel, Los Gatos, California - USA

 

 

 

 

 

 

 


Get involved submit an abstract of your work!

Submit your abstracts online at:  http://www.imaps.org/abstracts.htm

 

 
CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems