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Announcement and Call for Abstracts
Advanced Technology Workshop on
RF and Microwave Packaging
September 16-18, 2008
The Crowne Plaza San Diego
2270 Hotel Circle North
San Diego, CA 92108-2810
IMAPS SoCal Golf Tournament the morning of September 16, 2008
Abstract Deadline: June 13, 2008
Organizing Committee: |
General Chair
Ken Kuang
Torrey Hills technologies, LLC
kkuang@torreyhillstech.com |
Technical Co-Chair:
Franklin Kim
Kyocera America, Inc.
franklin.kim@kyocera.com |
Technical Co-Chair:
Sean Cahill
BridgeWave
SeanC@Bridgewave.com |
Advisory Committee(alphabetical order): |
Steve Adamson, Asymtek, Inc.
Mumtaz Bora, Kyocera Wireless Corporation
Ron Barnett, Giga-tronics/Ascor Incorporated
Carl Edwards, Space Micro, Inc.
Mark Eblen, Kyocera America, Inc.
Aicha Elshabini, University of Idaho
Murat Goksel, Space Micro, Inc.
Bill Ishii, Torrey Hills Technologies, LLC |
Guosheng Jiang, China Central South University
Wally Johnson , Coorstek, Inc.
Ho Young Kim, General Optechs
Iris Labadie, Kyocera America, Inc.
Lee Levine, IMAPS VP of Technology
Junkun Ma, Southeastern Louisiana University
Tricia McGough, Norstar Group
Walt Napoleon, KL Marketing |
David Shields, Component Surfaces, Inc.
Ron Thiel, retired
Mark Tomei, Kyocera America, Inc.
David Virissimo, SPM
Ziliang Wang, Nanjing Electronics Device Institute
David Zhang, GTSI Corporation
Danny Zhu, Jiangsu Dingqi Sci. & Tech. Co. Ltd |
RF and Microwave Packaging Workshop Focus:
The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.
Abstracts are being requested in the following areas:
| Emerging Technologies |
New Design/Materials |
New Applications |
- 60 GHz Personal Area Network (PAN)
- Short wave IR packaging
- Nanopackaging
- 3D RF/MW
- New and disruptive technology
- EMI shielding for RF/MW packaging
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- New power amplifier design beyond LDMOS
- Thermal management
- New IR sensors without cooling
- Plastic RF/MW packaging
- Lead free
- RF MEMS
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- High Power Electronics
- Military / Space / Extreme Environments
- MEMS/NEMS
- Biomedical
- Telecommunications
- MMIC
- Automotive
- SIP
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Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later June 13, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than July 25, 2008.
Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
All Speakers are required to pay a reduced registration fee and are required to attend the entire event.
Submit Abstract(s)
Speaker Dates/Information:
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Abstract due: June 13, 2008
- Speaker Notification/Confirmation emailed: June 20, 2008
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Extended Abstract or Presentation Material due: July 25, 2008
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Powerpoint/Presentation file for CD-Rom due not later than: September 18, 2008
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Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
- Technical Presentation Time: 25 minutes (20 to present; 5 for Q&A)
Hotel Reservations (Hotel Deadline: August 22, 2008)
Reservation must be made directly with the:
Crowne Plaza San Diego
2270 Hotel Circle North
San Diego, California 92108
Phone: 800-882-0858.
www.cp-sandiego.com
$131 Single/Double
Please reference International Microelectronics And Packaging Society when making reservations by phone.
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