IMAPS - 2010 Advance Technology Workshop on RF and Microwave Packaging

RF and Microwave Packaging Workshop Focus:
The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

Abstracts are being requested in the following areas:

Emerging Technologies	New Design/Materials	New Applications
60 GHz Personal Area Network (PAN) Short wave IR packaging Nanopackaging 3D RF/MW New and disruptive technology EMI shielding for RF/MW packaging Wafer Level Packaging for Microwave and MMwave Applications Packaging Issues for Wide Band Gap Semiconductors SIP	New power amplifier design beyond LDMOS Thermal management New Uncooled IR sensors Plastic RF/MW packaging Lead free RF MEMS	Military / Space Optoelectronics (night vision, thermal weapon sight, etc.) High Power Electronics Space/Extreme Environments MEMS/NEMS Biomedical Telecommunications Reliability MMIC Automotive High Speed Electronics

Awards will be given in the following categories: Best ATW Paper; Best Session Papers; and Best Student Paper.

Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later May 28, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm.

Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than August 6, 2010. All abstracts submitted must represent original, previously unpublished work. The abstracts should highlight the substrate advancements, materials processing/reliability, design, packaging issues and application. The submission section will aid in grouping the work within these three areas.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

All Speakers are required to pay a reduced registration fee and are required to attend the entire Workshop to maximize opportunities for interaction with registered attendees. All authors and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers.

Submit Abstract(s)

Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check at the ATW/Conference. The selected student must attend the event to present his or her work and receive the award.

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, receptions, refreshment breaks, an Abstract Book and one (1) CD-Rom of the presentations. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships.

Hotel Reservations: (Hotel Deadline: August , 2010)
Reservation must be made directly with the:

Crowne Plaza San Diego
2270 Hotel Circle North
San Diego, California 92108
Phone: 800-882-0858.
www.cp-sandiego.com

Please reference International Microelectronics And Packaging Society when making reservations by phone.