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Advanced Technology Workshop and Tabletop Exhibition on
RF and Microwave Packaging

February 7-9, 2012
The Crowne Plaza San Diego
2270 Hotel Circle North
San Diego, CA 92108-2810

Abstracts Deadline Extended: December 16, 2011

Organizing Committee:

General Chair
Ken Kuang
Torrey Hills Technologies, LLC
kkuang@torreyhillstech.com
General Co-Chair
Susan Trulli
Raytheon RD Components
susan_c_trulli@raytheon.com

Technical Co-Chair:
Michel de Langen
NXP Semiconductors
michel.de.langen@nxp.com

Technical Co-Chair:
Sean Cahill
BridgeWave Communications
SeanC@Bridgewave.com

Advisory Committee:

Steve Adamson, Asymtek, Inc.
Ron Barnett, National Instruments
Carl Edwards, Space Micro, Inc.
Aicha Elshabini, University of Idaho
Bill Ishii, Torrey Hills Technologies, LLC
Wally Johnson, Coorstek, Inc.
Iris Labadie, Kyocera America, Inc.
Charles Lin, Bridge Semiconductor, Taiwan
Walt Napoleon, KL Marketing

David Shields, Component Surfaces, Inc.
Ziliang Wang, Nanjing Electronics Device Institute
Mumtaz Bora, Peregrine Semiconductor

Kai Cheng, Nanjing Guosheng Electronics
Mark Eblen, Kyocera America
Guosheng Jiang, China Central South Univ.
Mark Tomei, Kyocera America, Inc.
David Virissimo, SPM
Danny Zhu, Jiangsu Dingqi Sci. & Tech. Co. Ltd


Premier Sponsors:

Palomar Technologies - Premier Sponsor
ANSYS - Premier Sponsor


RF and Microwave Packaging Workshop Focus:

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

The 2012 Workshop will feature two exciting keynote speakers:


Dr. Renzhe Zhao
Chief Specialist of Electronics Material, Huawei Technologies
Dr. Zhao will share how Huawei sees the electronic material needs in the future.

Sean Cahill
VP, Technology, BridgeWave Communications, Inc.
He will share how to leverage government programs to develop new packaging technology.

Sessions are being planned and abstracts are being requested in the following areas:

Emerging Technologies

New Design/Materials

New Applications

  • 60 GHz Personal Area Network (PAN)
  • Short wave IR packaging
  • Nanopackaging
  • 3D RF/MW
  • New and disruptive technology
  • EMI shielding for RF/MW packaging
  • Wafer Level Packaging for Microwave and MMwave Applications
  • Packaging Issues for Wide Band Gap Semiconductors
  • SIP
  • New power amplifier design beyond LDMOS
  • Thermal management
  • New Uncooled IR sensors
  • Plastic RF/MW packaging
  • Lead free
  • RF MEMS
  • Military / Space
  • Optoelectronics (night vision, thermal weapon sight, etc.)
  • High Power Electronics
  • Space/Extreme Environments
  • MEMS/NEMS
  • Biomedical
  • Telecommunications
  • Reliability
  • MMIC
  • Automotive
  • High Speed Electronics

Awards will be given in the following categories: Best ATW Paper; Best Session Papers; and Best Student Paper.

Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than December 16, 2011, using the on-line submittal form at: www.imaps.org/abstracts.htm.

No formal technical paper is required. A reproduction-ready 2-page extended abstract with figures and graphs included, if necessary will be required for the abstract booklet on January 6, 2012.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

All Speakers are required to pay a reduced registration fee and are required to attend the entire Workshop to maximize opportunities for interaction with registered attendees.  All authors and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers.


Submit Abstract(s)



Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at a total of $1,500 in awards checks at the ATW/Conference. The selected student(s) must attend the event to present his or her work and receive the award.

In addition, the RF/Microwave Workshop was selected by the Foundation as a 2012 "Regional Contest" site. The Foundation is awarding 3 students with the "best presentations" of the workshop: $750 (1st place), $500 (2nd), and $250 (3rd). The first place winner will also be invited to submit their paper for IMAPS Annual Symposium - IMAPS 2012 in San Diego. The Foundation will cover the first place regional contest winner's travel to symposium as well as registration fees to allow them to compete at our annual Symposium for the higher society Awards. We are opening this first regional contest to ALL Southern California Universities.

The Microelectronics Foundation


Registration Information:(Early Registration Deadline: January 7, 2012)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, receptions, refreshment breaks, an Abstract Book and one (1) CD-Rom of the presentations. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 1/7/12
Advance/Onsite Fee
After 1/7/12
IMAPS Member
$550
$650
Non-Member
$675
$775
Speaker
$400
$500
Chair
$400
$500
Student
$200
$300
Chapter Officer
$400
$500
Tabletop Exhibit (Member)
$675
$775
Tabletop Exhibit (Non-Member)
$775
$875
Premier Sponsorship (Includes Tabletop)
$1200
$1200
Event Sponsorship (Tabletop not included)
$500
$500

Register On-line


Speaker Dates/Information:

  • Abstracts Deadline: December 16, 2011
  • Speaker Notifications Sent: December 15, 2011
  • Extended Abstract or Presentation Material due: January 6, 2012
  • Early Registration and Hotel Deadlines: January 7, 2012
  • Powerpoint/Presentation file for CD-Rom due not later than: February 9, 2012
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Hotel Reservations: (Hotel Deadline: January 7, 2012)
Reservation must be made directly with the:

Crowne Plaza San Diego
2270 Hotel Circle North
San Diego, California 92108

Phone: 800-882-0858.
www.cp-sandiego.com

Single/Double: $125/night + Tax

Please reference International Microelectronics And Packaging Society when making reservations by phone.

 


Premier Sponsors:

Palomar Technologies - Premier Sponsor

ANSYS - Premier Sponsor


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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001