Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both Microsystems and Interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, de-fense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sens-ing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on material, processes, prototype development, advanced design and application opportunities.
Ceramic Interconnect
Track
Ceramic Interconnect technology has a long history of meeting the requirements of the most demanding applications. Conventional thick and thin film ceramic technologies are being revolutionized and extended through the development of low temperature co-fired ceramics, photo patterning, and embedded passive component materials and processes. These have contributed to increased circuit density, enhanced functionality, and improved performance that are being adopted for leading edge applications in wireless and optical communications, automotive, MEMS, sensors, and energy. Data communications and the Internet are driving the demand for bandwidth, sparking demand for optical communication equipment and new interconnect and packaging applications that perform at 40 Gb/sec and beyond. In under-the-hood electronics for automotive, engine/transmission control, communications, and safety appli-cations continue to drive the growth of ceramic interconnect technology, while collision avoidance systems are creating interest in low loss ceramic materials for frequencies approaching 100 GHz.
Ceramic Microsystems
Track
Enabled by the availability of commercial ceramic, metal and embedded passives materials systems, and the rapid prototyp-ing capabilities of the well established multilayer ceramic interconnect technology, three dimensional (3-D) functional ceramic struc-tures are spawning new microsystems applications in MEMS, sensors, microfluidics, bio-devices, microreactors and microenergy. These new devices and applications exploit the ability to make microchannels and embed fluidic device functions (e.g., valves, pumps, switches, light pipes, and reaction chambers).
In addition, the Ceramic Microsystems track of the CICMT conference targets new developments in microsystems that in-clude fabricating 3-D micro device structures enhanced with sol-gel, advanced printing and patterning technologies, high temperature materials technologies, and emerging applications like energy harvesting. Many of these innovative applications are taking advantage of the unique ability to integrate the thermal, chemical, mechanical and electrical properties of these multicomponent ceramic-metal systems.
Special Features
•
Invited keynote and international presentations on the current status ceramic technology and
future system directions.
•
A focused exhibition for suppliers who support the use
of the technologies.
•
A technical poster session to promote student participation.
• Social events to promote new contacts.
Planned Session
and Paper Topics Include:
Ceramic
Microsystems |
Ceramic
Interconnect |
Markets and Applications
• MEMS Technology and Markets
• Energy and Fuel Cells
• Biological and Medical
• Chemical and Biochemical
• Photonics
Materials and Properties
•
Materials Integration & Nano-materials
• Thermal Management and Reliability
• Piezoelectric Materials
• Optoelectronics
Processing and Manufacturing
• MEMS Manufacturing Technology
• Industrial Automation and Rapid Prototyping
• Nano-technology/Integration
• High Temperature Microsystems
Devices
• Sensors and Actuators
• Micro-reactors
• Fluidic Devices
• Biomolecular and cell transport systems
• Energy Conversion systems
Characterization and Reliability
• Materials and Process Characterization
• Systems Reliability, Lifetime, and Failure Estimation
• Reliability of High-Performance Microsystems
Design, Modeling, and Simulation
• Thermal and Heat Transfer
• Computational Fluid Dynamics
|
Markets and Applications
• Automotive
• Aerospace
• Wireless/Communication
• Medical Electronics
Materials and Properties/Functions
• Dielectric and Magnetic Materials
• Embedded and Integrated Passives
• Microwave/mm wave characterization
• Zero-shrink Ceramic Systems
Processing and Manufacturing
• Green Tape Manufacturing
• Multilayer Ceramics
- Via and Pattern Generation
- Metallization Processes
- Lamination
- Binder Burnout and Co-Firing
• Laser trimming and deposition
• Advanced Thick Film Processing
• Fine Structuring Technologies
• Rapid Prototyping
Devices
• Circuits, antennas, and filters
•
Embedded Structures & Components
• Optical Devices and Optoelectronics
Characterization and Reliability
• Characterization of Green Tapes
• Life Testing, Quality Issues
• RF performance
Design, Modeling, and Simulation
• High Frequency Design Software
• Design Rules
|
Integrated
Ceramic Technology |
|
Advanced
Packaging Technology
• Next Generation Packaging Technologies
• Packaging and Integration in BioMEMS
• Packaging Issues for MEMS Devices
• Technologies for Microsystems Components and Substrates
• Packaging Standard for Microsystems
• Environmental Issues, Lead Free Systems
• Cost Reduction
|
Abstract Cut-off Date: November 12, 2010
Notice of Acceptance: January 7, 2011
Final Manuscripts Due: February 11, 2011
Please send your 250-300 word abstract electronically only by November 12, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm. All papers will be presented and published in English. All speakers are required to pay a reduced registration fee.
If you are
having problems with the on-line submittal form, please
email Jackki Morris-Joyner jmorris@imaps.org or
call 1-305-382-8433 (USA).
The 2012 IMAPS/ACerS International Conference and Exhibition on
Ceramic Interconnect and Ceramic Microsystems Technologies Conference
will be held in Europe.
Student Competition sponsored by The Microelectronics Foundation:
| The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check at the ATW/Conference. The selected student must attend the event to present his or her work and receive the award. |
|
Speaker Dates/Information:
-
Abstract Deadline: November 12, 2010
-
Speaker notification: January 7, 2011
-
Final Manuscripts for Proceedings due: February 11, 2011
-
Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
Hotel Reservations
DETAILS AVAILABLE SOON
The Westgate Hotel
San Diego, California - USA
