KESTER

IMAPS - International Microelectronics And Packaging Society
ACerS - American Ceramic Society

IMAPS/ACerS 12th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2016)

April 19-21, 2016
Sheraton Denver Downtown Hotel
Denver, Colorado 80202 - USA

 

General Chair:
Dan Krueger
Honeywell FM&T
dkrueger@kcp.com
General Co-Chair:
Minoru Osada
National Institute for Materials Science
osada.minoru@nims.go.jp
Technical Chair - USA:
Steve Dai
Sandia National Labs.
sxdai@sandia.gov
Technical Chair - Asia:
Yongxiang Li
Shanghai Institute of Ceramics
yxli@mail.sic.ac.cn
Technical Chair - Europe:
Paula Vilarinho
University of Aveiro
paula.vilarinho@ua.pt

 


PREMIER SPONSOR:
Honeywell - Premier Sponsor

Web Sponsors:

ATV Technologie GmbH
American Elements: global manufacturer of engineered & advanced technical ceramic powders & nanopowders for thin films, energy storage, optoelectronics, glass, & high temperature applications


Goal of CICMT...
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. One track concentrates on materials and processes; while the second track will be more application focused - both driven by the ceramic interconnect and microsystem needs. CICMT 2016 will feature 3 keynote speakers to start each day's program activities. In addition, this year's conference will offer more than 45 additional expert speakers from industry and academia, as well key companies on display that support these technologies, and numerous networking opportunities throughout.


Tuesday, April 19
Registration: 7:00 am – 6:30 pm
Continental Breakfast: 7:30 am – 8:30 am

Exhibit Hours: 10:00 am – 6:30 pm
Refreshment Breaks, Lunch & Reception in Exhibit Hall

Opening Remarks: 8:30 am – 8:45 am
Conference Chairs

KEYNOTE PRESENTATION: 8:45 am – 9:30 am
Lead-free Alternatives to PZT for Advanced Applications

Keynote - Wallnoefer

ABSTRACT: Lead titanate zirconate ceramics are widely used materials for actuators, sensors and other devices because of their excellent piezoelectric properties. However, the environmental and health hazards of lead is of concern. The advanced uses of PZT-type materials, for which lead-free alternative are being developed, include the following applications.
- bulk piezoelectric ceramics for sensor and actuator applications;
- high-voltage high-current capacitors based on antiferroelectric ceramics with low equivalent series resistance and high energy density;
- piezoelectic thin films for actuators used in HDD heads and sensor applications;
- PTC thermistors for elevated temperatures;
- plasma generators using the piezoelectric transformer effect, allowing surface modification and sterilization at substantially reduced size and cost.

Tailor-made materials and technologies are needed for the development of each environmentally friendly and unrestricted application.

Dr. Wolfgang Wallnoefer is in charge of the Piezoelectric Materials Development Section at TDK’s Technology Headquarters in Ichikawa, Chiba, Japan. His responsibilities include development of bulk, multilayer and thin film materials for sensors, actuators and high power electronics. He worked for 11 years at EPCOS OHG, Deutschlandsberg, Austria, now a TDK subsidiary, and has over 20 years of industry experience in piezoelectrics. He has a master’s degree in physics from Vienna University and a doctor’s degree in engineering from TU Vienna.

 

Session TA1:
Direct Write and AM Electronics
Chairs: Adam Cook, Sandia National Labs.; Soshu Kirihara, Osaka University
9:30 am – 12:15 pm

Stereolithographic Additive Manufacturing of Bulky Ceramic Components with Functionally Geometric Micropattern
Soshu Kirihara, Osaka University (Koki Nonaka, Shoichro Kisanuki, Toshihiro Nozaki)

Deformation and Consolidation of Alumina Particles - Basis for Aerosol Deposition, a Room Temperature, Solid-State Deposition Process
Pylin Sarobol, Sandia National Laboratories (Michael Chandross, William Mook, Paul Kotula, Daniel Bufford, Khalid Hattar, Brad Boyce, Jay Carroll, Aaron Hall)

Break in Exhibit Hall: 10:30 am – 11:15 am

Stereolithographic Additive Manufacturing of Solid Electrolyte Ceramic Sheets with Micro Emboss Pattern for All Solid Battery Application
Koki Nonaka, Joining and Welding Research Institute, Osaka University (Soshu Kirihara)

Adaption of Ceramic Thick-Film Materials for Laser Sintering in Integrated Sensor Applications
Rena Gradmann, Fraunhofer IKTS (Thomas Seuthe, Sylvia Gebhardt, Christian Vedder, Melanie Meixner, Markus Eberstein, Uwe Partsch
)

Lunch in Exhibit Hall: 12:15 pm – 1:30 pm
 

 

Session TP1A:
Thick Film/Ceramic Sensors and Application - Part 1

Chairs: Peter Uhlig, IMST; Jaroslaw Kita, University of Bayreuth
1:30 pm – 3:00 pm

Session TP2A:
Power Electronics
- Part 1
Chairs: Michael Glover, University of Arkansas; Wenli Zhang, Virginia Tech
1:30 pm – 3:00 pm

INVITED SPEAKER: Passive Wireless Gas Sensors Based on the LTCC Technique
Yongxiang Li, Shanghai Institute of Ceramics, Chinese Academy of Sciences (Mingsheng Ma, Zhifu Liu, Wei Shan, Kourosh Kalantar-zadeh)

Sensor Stack for Tian-Calvet Calorimeter Made in LTCC-Technology
Franz Schubert, Department of Functional Materials, University of Bayreuth (Jaroslaw Kita. Michael Gollner, Florian Linseis, Ralf Moos)

Fabrication, Response and Stability of Miniature Piezoresistive Force-sensing Thick-film Cantilevers
Thomas Maeder, EPFL - École Polytechnique Fédérale de Lausanne (Caroline Jacq, Stefane Caseiro, Peter Ryser)

INVITED SPEAKER: Design of a Low Inductance Power Module Based on Low Temperature Co-fired Ceramic
Atanu Dutta, University of Arkansas (Simon Ang)

INVITED SPEAKER: Multilayer Ferrite Inductor Substrate for Ceramic-Based High Current Point-of-Load (POL) Converter
Wenli Zhang, Virginia Tech (Yipeng Su, Fred Lee)

LTCC Breakdown Voltage Investigation
Leszek Golonka, Wroclaw University of Technology (Mateusz Dorczynski, Wiktoria Fabinska, Henryk Roguszczak)

Break in Exhibit: 3:00 pm – 3:45 pm

Session TP1B:
Thick Film/Ceramic Sensors and Application - Part 2

Chairs: Leszek Golonka, Wroclaw University; Jun Akedo, AIST
3:45 pm – 5:15 pm

Session TP2B:
Power Electronics - Part 2

Chairs: Thomas Maeder, EPFL; Robert Pullar; Aveiro
3:45 pm – 5:15 pm

Evaluation of Screen-printable Type S Thermocouples on Different Ceramic Substrates
Jaroslaw Kita, Department of Functional Materials, University of Bayreuth (Sven Wiegärtner, Alistair Prince, Peter Weigand, Ralf Moos)

Solutions for Thermally Mismatched Brazing Operations for Ceramic Tokamak Magnetic Sensor
Caroline Jacq, EPFL - École Polytechnique Fédérale de Lausanne (Thomas Maeder, Matthieu Toussaint, Benoit Ellenrieder, Phillip Windischhofer, Xinyue Jiang, Duccio Testa, Peter Ryser)

LTCC-based Pressure Sensors for Elevated Operation Temperatures Up to 300°C
Uwe Partsch, Fraunhofer IKTS (Wolfgang Dürfeld, Adrian Goldberg, Jochen Schilm, Christian Freytag)

The Design and Evaluation of an Integrated Wirebond-less Power Module (IWPM) using a Low Temperature Co-fired Ceramic Interposer
Sayan Seal, University of Arkansas

Advanced DBC - Highly Reliable and Conductive Copper Ceramic Substrates
Mark Challingsworth, Paul Gundel, Heraeus Deutschland GmbH & Co. KG (Anton Miric, Kai Herbst, Melanie Bawohl, Jessica Reitz, Christina Modes, Gabriel Zier, Ilias Nikolaidis)

Design of High Voltage Ceramic and Glass Capacitors for Pulse Forming Networks
Harlan Brown-Shaklee, Sandia National Laboratories (Adam Cook, Terry Garino, Paul Clem, Raegan Johnson, Rudeger H.T. Wilker)

Reception in Exhibit Hall: 5:15 pm - 6:30 pm

 


Wednesday, April 20

Registration: 7:00 am – 6:00 pm

Continental Breakfast: 7:30 am – 8:30 am

Exhibit Hours: 10:00 am – 4:00 pm
Refreshment Breaks & Lunch in Exhibit Hall

KEYNOTE PRESENTATION: 8:30 am – 9:15 am
LTCC in the Field of Tension Between Academic Research and Industrial Application

Keynote - Bechtold

ABSTRACT: LTCC Technology today is a well established technogly with a global market share of about 1,50 Bn US$ in 2014 (ZVEI Jahresbericht 2015). In comparison with monolithic integrated circuits, PCB and ceramic printed boards it is the smallest market of electronic circuits with about 0,5% of the total Value for electronic circuits.Compared to its small market size, LTCC technology is well established in the academic research area worldwide, indicating a significant unbalance between the RTD efforts spent and the industrial outcome visible.

This presentation shows an in depth excerpt of the State of the Art LTCC technology in academic research and compares the outcome of the research work with the state of Art: LTCC technology in industrial electronic applications. Furthermore, it shows a market analyses considering the the ups and downs of several high volume applications, the actual status on the market, the trends and perspectives as well as obstacles on the market and the roll of LTCC as an enabler for innovation.

In the second part it analyses the Market driving forces and expectations from the market and gives an overview about the infrastructure on the market, the development chain, the different roles of SMEs and large entities acting as LTCC Foundries.

Finally, the impact of LTCC research to scientific education and market success will be analysed and Consequences to enhance the industrial outcome of the research activities discussed.

Franz Bechtold earned a Diploma of Mineralogy form the University of Erlangen 1985 His professional experience includes: 10 years of Microelectronic engineering in the area of Hybrids and Microsystem until 1997; and Coordinator of National and European RTD projects on microsystems and sensors. His business experience: Founder of VIA electronic GmbH in Hermsdorf, Germany 1997 and president of the company since that time; and Co-founder of the start-up VIA optronics GmbH in Hermsdorf 2004.He has numerous publications and presentations in the field of Ceramic Microsystems and sensors including best paper awards and invited papers and several Patents in the field of Ceramic Microsystems.

Session WA1:
LTCC Integration and Materials I
Chairs: Ken Peterson, Sandia National Labs.; Yoshihiko Imanaka, Fujitsu
9:15 am – 12:30 pm
Session WA2:
Microsystem Applications
Chairs: Martin Opperman, Airbus; Mario Ricardo Gongora-Rubio, Instituto de Pesquisas Tecnológicas do Estado de São Paulo; Sebastian Brunner, EPCOS OHG
9:15 am – 12:30 pm

Design and Fabrication of Ceramic Microsystem Utilizing Glow Discharge for Analysis of Liquid Mixtures
Jan Macioszczyk, Wroclaw University of Technology (Monika Lenartowicz, Karol Malecha, Leszek Golonka)

Fabrication of LTCC Micro-fluidic Devices For Wireless Lab-On-Chip Applications
Dorra Bahloul, ÉTS (École de Technologie Supérieure) (Achraf Ben Amar, Hung Cao, Ammar Kouki)

INVITED SPEAKER: High Resolution LTCC Laser Processing in the Green and Fired State for Future Technologies
Nam Gutzeit, TU Ilmenau (Tilo Welker, Karl-Heinz Drüe, Jens Müller)

INVITED SPEAKER: Investigations of Metal Systems in a Silicon Ceramic Composite Substrate for Electrical and Thermal Contacts as well as Associated Mounting Aspects
Michael Fischer, TU Ilmenau, IMN MacroNano® (Tilo Welker, Bianca Leistritz, Sebastian Gropp, Christoph Schaeffel, Martin Hoffmann, Jens Müller)

Break in Exhibit Hall: 10:15 am – 11:00 am

MEMS Fabrication on LTCC Substrates for RF Applications: Challenges and Perspectives
Dorra Bahloul, ÉTS (École de Technologie Supérieure) (Achraf Ben Amar, Ammar Kouki)

Silver Pastes with Adjusted Glass Composition for Warpage-free LTCC
Markus Eberstein, Fraunhofer IKTS (Markus Pohl, Rena Gradmann, Beate Capraro, Uwe Partsch)

LTCC 3D Micromixers for O/W Microemulsion Generation
Houari Cobas Gomez, Instituto de Pesquisas Tecnológicas do Estado de São Paulo (IPT), Núcleo de Bionanomanufatura (Bianca Oliveira Agio, Jéssica Gonçalves da Silva, Adriano Marim de Oliveira, Kleber Lanigra Guimaraes, Marcio Rodrigues da Cunha, Mario Ricardo Gongora-Rubio)

LTCC 3D Flow Focalization Device for Liquid-Liquid Partial Solvent Extraction
Houari Cobas Gomez, IPT (Bianca Oliveira Agio, Jéssica Gonçalves da Silva, Jocasta Mileski Machado, Francisco Jorge Soares de Oliveira, Mario Ricardo Gongora-Rubio)

Fabrication of an RF-MEMS-Switch on a Hybrid SiCer Substrate
Sebastian Gropp, IMN MacroNano®, TU Ilmenau (M. Fischer, J. Müller, M. Hoffmann, IMN MacroNano®, TU Ilmenau; A. Frank, C. Schäffel, IMMS Institut für Mikroelektronik- und Mechatronik-Systeme GmbH)

Integrated Microchannel Cooling for Power Electronic Modules
Wenli Zhang, Virginia Tech (Fengchang Yang, Rui Qiao, Dushan Boroyevich)

Lunch in Exhibit Hall: 12:30 pm – 1:30 pm

Session WP1:
LTCC Integration and Materials II

Chair: Howard Imhof, Silicon Valley Materials Technology Corp
1:30 pm – 3:00 pm

Session WP2:
Piezoelectric Materials and Applications

Chairs: Paul Clem, Sandia National Labs.; Dennis Eichorst, Honeywell FM&T
1:30 pm – 2:30 pm

Novel Glass-free LTCC Material Co-fired with Copper-Electrodes
Yasutaka Sugimoto, Murata Manufacturing Co.,Ltd. (Tsuyoshi Katsube, Machiko Motoya, Yuki Takemori, Yoichi Moriya, Kazuo Kishida, Takahiro Takada, Nobuhiko Tanaka)

The Effect of Firing Temperature on Structure and Electrical Properties in Low Temperature Co-fired Ceramics
James Walker, Ferro Corporation (Jeff Holthus, Jim Henry, Bradford Smith, Ed Graddy)

LTCC Thick Film Process Characterization
Michael Girardi, Honeywell FM & T (K. Peterson, P. Vianco, J. Kupferschmidt, D. Whitlock)

Giant Piezoelectric Response (d33) in (K0.45Na0.55)0.96Li0.04NbO3 Lead-free Single Crystals
Yongxiang Li, Shanghai Institute of Ceramics, Chinese Academy of Sciences (Jie Yang, Faqiang Zhang, Qunbao Yang, Zhifu Liu, Yun Liu, Qiming Zhang)

High Performance Multilayer Piezoelectric and Magnetoelectric Textured Ceramics
Yongke Yan, Virginia Tech (Shashank Priya)

Break in Exhibit Hall: 3:00 pm – 4:00 pm
(Exhibits End at Conclusion of Break)

Session WP3:
Ceramic Nanomaterials and Nanostructuring

Chair: Markus Eberstein, Fraunhofer IKTS; Mark Challingsworth, Heraeus
4:00 pm – 5:30 pm

Session WP4:
High Temperature Electronics

Chair: Minoru Osada, National Institute for Materials Sciences; Uwe Partsch, Fraunhofer IKTS
4:00 pm – 5:30 pm

INVITED SPEAKER: Material Integration for Flexible Electronics for Energy Application Using Nanoparticulated Dense and Stress-Free Ceramic Thick Film
Yoshihiko Imanaka, Fujitsu Laboratories Ltd.

INVITED SPEAKER: Flexible Thin Film Coating by Photo-assisted Chemical Solution Process
Tetsuo Tsuchiya, National Institute of Advanced Industrial Science and Technology (AIST) (T.Nakajima, I.Yamaguchi, H. Matsui)

High Dielectric Constant and Capacitance in Ultrasmall (2.5 nm) SrHfO3 Perovskite Nanoparticles Produced from a Low Temperature Non-aqueous Sol-gel Route
Robert Pullar, University of Aveiro / CICECO - Aveiro Institute of Materials (Mohamed Karmaoui, E.Venkata Ramana, David Tobaldi, Luc Lajaunie, Manuel. Graça, Raul Arenal, Maria Seabra, João Labrincha)

INVITED SPEAKER: Substituted Ferrites for Use as Electromagnetic Shields in Re-Entry Spacecraft
Robert Pullar, University of Aveiro / CICECO - Aveiro Institute of Materials (Francisco Carvalho, Antonio Migliano)

INVITED SPEAKER: High-temperature Dielectric Materials from Atomically-thin Perovskites
Minoru Osada, National Institute for Materials Scicence

A Unified ASIC and LTCC Module Design Kit for High Temperature High Density Circuits
Jim Holmes, Ozark Integrated Circuits, Inc. (Michael Glover, University of Arkansas High Density Electronics Center; A. Matt Francis, Ozark Integrated Circuit, Inc.)

Networking/Social Evening at Rock Bottom Restaurant and Brewery
Sponsored by the IMAPS Rocky Mountain Chapter!
Begins at 6:00pm

Located a half mile down the 16th Street pedestrian mall from the Sheraton, it is a short walk or an even faster ride on the free tram. IMAPS will have use of the semi-private ½ pool bar, featuring beer tastings and a brewery tour for everyone with the meal. This space includes:

• Appetizer & dinner buffets options (Details Soon)
• 2+ pool/billiards tables
• Digital Touch Tunes jukebox
• 3 brand new flat screen TVs

• Beer Tastings
• Brewery Tour|

**SPACE LIMITED - ATTENDEES MUST RSVP FOR A SEAT**
$10 Registration Fee
REGISTER ONLINE

 

Thursday, April 21
Registration: 7:00 am – 11:00 am

Continental Breakfast: 7:30 am – 8:30 am

KEYNOTE PRESENTATION: 8:30 am – 9:15 am
Leveraging Glass for Advanced Packaging and IoT

Keynote - Shorey

ABSTRACT: Glass has a number of properties that make it very attractive for Advanced Packaging applications. Some of these important attributes include low loss electrical performance at high frequencies, opportunities to leverage economies of scale through panel processing, novel solutions enabled by glass forming techniques and others. In this talk we will highlight a number of ways that glass is being leveraged for next generation products as well as a discussion of opportunities for future advancements through next generation materials.

Dr. Aric Shorey is a Commercial Technology Manager for the Semiconductor Glass Products program at Corning, Incorporated. He has BS/MS in Mechanical Engineering and a PhD in Materials Science – all from the University of Rochester in Rochester, New York. He has spent the majority of his career leading development activities and Program Management for next generation process and technology development. This includes material’s characterization, precision finishing and metrology for the telecommunications, precision optics and semiconductor industries.

Session THA1:
Microsystem Material and Properties
Chairs: Paula Maria Vilarinho, Aveiro; J. Ambrose Wolf, KCP Honeywell FM&T
9:15 am – 12:00 pm
Session THA2:
RF Packaging and Devices
Chairs: Jens Mueller, University of Illmenau; Jerry Aguirre, Kyocera America
9:15 am – 12:00 pm

INVITED SPEAKER: Factors that Affect the Performance of Sputter-deposited Thin Film Capacitors on LTCC Substrates
James Claypool, Missouri S&T (Matthew O'Keefe, Wayne Huebner, MST; J. Ambrose Wolf, KCP Honeywell FM&T)

INVITED SPEAKER: Novel Dielectric Materials for Passive Integration and Electronic Packaging Applications
Hong Wang, Xi'an Jiaotong University

Integration of Substituted M-type Ferrites in LTCC Microwave Modules
Joerg Toepfer, Ernst-Abbe Hochschule Jena (S. Bierlich, F. Gellersen, A. Jacob)

A Comparative Study on Four Different Transmission Lines in LTCC for 60 GHz Applications
Aria Isapour, École de Technologie Supérieure (Dorra Bahloul, Ammar Kouki)

Break in Foyer: 10:15 am – 10:30 am

Thermodynamic Analysis of Physical Vapor Deposited (PVD) Inorganic Thin Films on Low Temperature Cofired Ceramic (LTCC)
Carol Putman, Honeywell FM&T (Rachel Cramm Horn, Ambrose Wolf, Daniel Krueger)

Wire-bondable Multilayer Ceramic Capacitors
Zhifu Liu, Shanghai Institute of Ceramics, Chinese Academy of Sciences (Yan Gu, Yongxiang Li, Yilong Feng, Junfeng Yang, Yan Zhuang)

Comparison of Oxygen Sensor Performance Using Precious Metal and Precious Metal Core-Shell Conductors
Richard Stephenson, Silicon Valley Materials Technology Corp (Howard Imhof)

Microwave Filter Design Optimized for Ceramic Multilayer Technique
Peter Uhlig, IMST GmbH (Jürgen Kassner, Andreas Lauer)

Microwave Characterization of a Thick Film System for Hybrid Packaging Applications
Bradley Thrasher, DuPont Microcircuit Materials

RF Sensor Modules - Needs for Multifunctional Architectures
Martin Oppermann, Airbus Defence and Space GmbH (Felix Thurow)

Closing Remarks: 12:00 pm



REGISTER ONLINE | REGISTRATION DETAILS


Registration Information:(Early Registration/Hotel Deadline: March 23, 2016)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, access to the tabletop exhibition, meals, refreshment breaks, and one (1) Proceedings DOWNLOAD. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 3/23/2016
Advance/Onsite Fee
After 3/23/2016
IMAPS/ACerS Member
$600
$700
Non-Member
$750
$850
Speaker
$400
$500
Chair
$400
$500
Student
$200
$300
Chapter Officer
$400
$500
Tabletop Exhibit (Member)
$550
$650
Tabletop Exhibit (Non-Member)
$700
$800
Premier Sponsorship (Includes Tabletop & 1 Attendee)
Sponsorship of CICMT includes: 1 tabletop booth ($550+); 1 attendee for technical sessions ($400+), logo/url posted at cicmt.org, logo on program covers & insides, full-page advertisement in printed programs, opportunity to provide 1 marketing flyer for IMAPS to distribute at registration to all attendees. LIMIT of 4 Corporate Sponsors
$1500
$1500

 


Speaker Dates/Information:

  • Abstract Deadline Extended: January 15, 2016
  • Speaker notification: January 29, 2016
  • Final Manuscripts for Proceedings due: February 26, 2016
  • Early Registration/Hotel Deadlines: March 23, 2016
  • Speaker BIO Due: April 10, 2016
  • Technical Presentation Time: 20 minutes (15 to present; 5 for Q/A)
  • Keynote Presentation Time: 30 minutes (25 to present; 5 for Q/A)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Poster Presentations will be made on poster boards/easels approximately 3ft x 4ft. Presenters should plan accordingly. Pins/tacks will be provided for the setup. Additional poster details at: http://www.imaps.org/speakers/poster.htm.

 


Hotel Reservations (Hotel Deadline: March 23, 2016)

Sheraton Denver Downtown Hotel
1550 Court Place
Denver, CO 80202 - USA

Trouble booking rooms at Sheraton? IMAPS does not have an over-flow hotel block at other properties. If you have trouble booking rooms with the Sheraton, here are some other area hotels that we recommend - all within an approximate 5-minute walk from the Sheraton:

Hyatt Regency Denver at Colorado Convention Center
Holiday Inn Express Denver Downtown
Crowne Plaza
Hilton Garden Inn Denver Downtown
Homewood Suites Denver Downtown

 

 
CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • GaN Systems
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NEO Tech
  • NGK NTK
  • Palomar
  • Plexus
  • Qualcomm
  • Specialty Coating Systems