IMAPS Home
Members Only
Login
About IMAPS
Events Calendar
Online Store
Membership
Chapters/Committees
Global Business Council
Industry News
Publications
Careers
IMAPS Microelectronics Foundation
Contact Us
IMAPS - International Microelectronics And Packaging Society
ACerS - American Ceramic Society
IMAPS Germany
Ilmenau University of Technology
MacroNano DKG - German Ceramics Society

IMAPS/ACerS 8th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2012)

April 16-19, 2012
Radisson Blu Hotel
Erfurt, Germany

Early Registration Deadline: March 2, 2012

General Co-Chairs:
Jens Müller
Technical University Ilmenau
jens.mueller@imaps.de
Rich Eitel
University of Kentucky
reitel@engr.uky.edu
Technical Program Co-Chairs:
Soshu Kirihara
Osaka University
kirihara@jwri.osaka-u.ac.jp
Marija Kosec
Jozef Stefan Institute
marija.kosec@ijs.si
Alexander Michaelis
Fraunhofer IKTS
alexander.michaelis@ikts.fraunhofer.de
Program Committee:
Andreas Roosen (University of Erlangen-Nuremberg), Heinz Osterwinter (HS Esslingen), Jörg Töpfer (FHS Jena), Thomas Rabe (BAM Berlin), Sebastian Brunner (EPCOS), Thomas Bartnitzek (Via Electronic GmbH), Rubén Perrone (MSE GmbH)
Editor - IMAPS Journal
Fred Barlow
University of Idaho
fbarlow@uidaho.edu
Editor - ACerS Journal
TBD


Register On-Line | Hotel Information | Speaker Information
Tabletop Exhibit Information | Reserve Booth On-line | 2012 Exhibitors


Technical Program and Exhibit Details On-line in January

Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both Microsystems and Interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on material, processes, prototype development, advanced design and application opportunities.

Abstracts Due November 18, 2011
Notice of Acceptance: January 13, 2012
Final Manuscripts Due: February 29, 2012

The speaker notification is postponed to January 13 due to the extended abstract submission deadline and the ongoing review process of the more than 120 abstracts.

If you have questions about the technical program, please email Jackki Morris-Joyner jmorris@imaps.org or call 1-305-382-8433 (USA).

 


Speaker Dates/Information:

  • Abstract Deadline Extended: November 18, 2011 (CLOSED)
  • Speaker notification: January 13, 2012
  • Final Manuscripts for Proceedings CD-ROM due: February 29, 2012
  • Technical Presentation Time: 20 minutes (15 to present; 5 for Q/A)
  • Keynote Presentation Time: 30 minutes (25 to present; 5 for Q/A)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)

 


Hotel Reservations (Hotel Deadline: March 2, 2012)

Radisson Blu Hotel
Juri-Gagarin-Ring 127
D-99084 Erfurt, Germany

Standard Single: 92,90€ and Standard Double: 114,40€ (price includes breakfast, VAT and city tax).
Other room categories are available on request.

Phone: +49 (361) 55 10 0
Fax: +49 (361) 55 10 210
E-mail: info.erfurt@radissonblu.com
www.radissonblu.com/hotel-erfurt

Reservation code: CICMT
Important note: in order to get the reduced room rate, bookings should be made by phone or e-mail

 

 

© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

<% rsCategory.Close() Set rsCategory = Nothing %>