|
Ceramic
Interconnect Technology:
The Next Generation II & Tabletop
Exhibition 2004
Exhibiting
Companies and Floorplan
Exhibiting Companies from the 2004 event:
| Exhibiting
Company |
Booth |
| American Ceramics Society (ACerS) |
10 |
| American Technical Ceramics |
24 |
| Deltech,
Inc. |
1 |
| DuPont
Microcircuit Materials |
4 |
| ESL
Electro-Science |
5 |
| Ferro EMS |
21 |
| Finetech,
Inc. |
6 |
| Haiku
Technology, Inc. |
22 |
| Heraeus
Incorporated-Circuit Materials Division |
9 |
| Hesse & Knipps,
Inc. |
17 |
| HIBRIDAS
JSC |
7 |
| Kyocera
America, Inc. |
3 |
| Modular
Devices Inc. |
12 |
| NANO-MASTER,
Inc. |
20 |
| NTK
Technologies, Inc. |
19 |
| SAES
Getters USA |
2 |
| ScanCAD
International |
14 |
| Scrantom,
Inc. - A Natel Company |
8 |
| SEFAR
America |
13 |
| Silicon
Coast Associates, Ltd. |
16 |
| Spectra-Mat
Inc. |
11 |
| SUSS
MicroTec |
18 |
| W.M.
Hague Company |
16 |
| Webcom Communications |
23 |
|
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