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IMAPS - International Microelectronics And Packaging Society
ACerS - American Ceramic Society
IMAPS Germany
DKG - German Ceramics Society

IMAPS/ACerS 4th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2008)

April 21-24, 2008
Holiday Inn - City Centre
Munich, Germany

General Co-Chairs:
Technical Program Co-Chairs:

Christian Hoffman
EPCOS OHG
christian.hoffmann@epcos.com

Michael Lanagan
Penn State University
mlanagan@psu.edu

Andreas Roosen
University of Erlangen - Nuremberg
andreas.roosen@ww.uni.erlangen.de

Amy Moll
Boise State University
amoll@boisestate.edu

Jun Akedo
AIST
akdeo-j@aist.go.jp

Local Organizing Committee :

Markus Blumenberg (DKG), Christian Hoffmann (EPCOS OHG), Jens Müller (TU Ilmenau), Heinz Osterwinter (HS Esslingen),
Andreas Roosen (University of Erlangen-Nuremberg)



CICMT 2008 Exhibiting Companies
As of February 6, 2008

For more information about exhibiting, visit www.cicmt.org or contact:
Jens Müller, IMAPS Germany
jens.mueller@imaps.de
phone +49 3677 69 3381

EPP GmbH
Kulicke & Soffa Europe GmbH
KOA Europe GmbH
Dr. Tresky AG
Unitemp GmbH & TPT Hickmann GbR
RHe Microsystems GmbH
ESL Europe
TU Ilmenau, MacroNano® Center for Innovation Competence
Agilent Technologies
Micro Systems Engineering GmbH
Koenen GmbH – HighTech Screens
Hesse & Knipps GmbH
Barry Industries Inc.
Mozaik Technology Ventures LTD
HaikuTech Europe B.V.

Pre-registered Companies:
NAMICS Europe GmbH
DuPont Microcircuit Material

Sponsors:
Micro Systems Engineering GmbH
KOA Europe GmbH

 

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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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