IMAPS/ACerS
4th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies (CICMT 2008)
April
21-24, 2008
Holiday Inn - City Centre
Munich, Germany
General
Co-Chairs: |
Technical
Program Co-Chairs: |
Christian Hoffman
EPCOS OHG
christian.hoffmann@epcos.com
Michael Lanagan
Penn State University
mlanagan@psu.edu
|
Andreas
Roosen
University of Erlangen - Nuremberg
andreas.roosen@ww.uni.erlangen.de
Amy Moll
Boise State University
amoll@boisestate.edu
Jun Akedo
AIST
akdeo-j@aist.go.jp
|
Local Organizing Committee : |
Markus Blumenberg (DKG), Christian Hoffmann (EPCOS OHG), Jens Müller (TU Ilmenau), Heinz Osterwinter (HS Esslingen),
Andreas Roosen (University of Erlangen-Nuremberg) |
For more information about exhibiting, visit www.cicmt.org or contact:
Jens Müller, IMAPS Germany
jens.mueller@imaps.de
phone +49 3677 69 3381
EPP GmbH
Kulicke & Soffa Europe GmbH
KOA Europe GmbH
Dr. Tresky AG
Unitemp GmbH & TPT Hickmann GbR
RHe Microsystems GmbH
ESL Europe
TU Ilmenau, MacroNano® Center for Innovation Competence
Agilent Technologies
Micro Systems Engineering GmbH
Koenen GmbH – HighTech Screens
Hesse & Knipps GmbH
Barry Industries Inc.
Mozaik Technology Ventures LTD
HaikuTech Europe B.V.
Pre-registered Companies:
NAMICS Europe GmbH
DuPont Microcircuit Material
Sponsors:
Micro Systems Engineering GmbH
KOA Europe GmbH
