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IMAPS - International Microelectronics And Packaging Society
ACerS - American Ceramic Society

IMAPS/ACerS 6th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2010)

OVTA
Chiba, Japan
April 18 - 21, 2010

General Co-Chairs:
Takaaki Tsurumi
Tokyo Institute of Technology
ttsurumi@ceram.titech.ac.jp
Shin-in Nichi
Konica-Minolta IJ
shinichi.nishi@konicaminolta.jp
Technical Program Co-Chairs:
Jun Akedo
AIST
akdeo-j@aist.go.jp
Amy Moll
Boise State University
amoll@boisestate.edu
Jens Müller
Technical University Ilmenau
jens.mueller@imaps.de
Program Committee:
Michael Lanagan
Pennsylvania State University
mlanagan@psu.edu
Soshu Kirihara
Osaka University
kirihara@jwri.osaka-u.ac.jp
Editor - IMAPS Journal
Fred Barlow
University of Idaho
fbarlow@uidaho.edu
Editor - ACerS Journal
Chris Apblett
Sandia National Laboratory
caapble@sandia.gov

Co-Sponsored By:
IMAPS Japan
Ceramics Society of Japan
Ferroelectric Committee of Japan (FMA)
Japan Society of Applied Physics
MRS-Japan
AIST


Early Exhibit Deadline: March 19, 2010

Questions about exhibits?
Ann Bell, IMAPS
abell@imaps.org | phone 202-548-8717

The International Microelectronics and Packaging Society (IMAPS) and the American Ceramic Society (ACerS) are again cooperating in the production of the IMAPS/ACerS Sixth International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2010).

CICMT 2010 will bring together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect and ceramic microsystems technologies.

The Ceramic Interconnect topics focus on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, defense/ security, and communication industries.

The Ceramic Microsystems topics focus on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfl uidic, optical, micro-reactor and sensing functions. Tape casting, thick fi lm hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on material, processes, prototype development, advanced design and application opportunities.

Special Features:

  • Invited keynote and international presentations.
  • An exhibition for suppliers who support the use of the technologies.
  • A technical poster session to promote student participation.

Exhibition Hours -- 2 Full Days

Tuesday, April 19  --  12:00 noon - 7:30 pm
Lunch, Refreshment Breaks & Exhibitor Reception will be held in the Exhibit Area.

Wednesday, April 20  --  10:00 am - 3:00 pm
Lunch & Refreshment Breaks will be in the Exhibit Area.

Installation Hours:
Tuesday, April 19   --  7:00 am - 11:00 am

Dismantle Hours:
Wednesday, April 20  --  3:00 pm - 8:00 pm

Tabletop Registration Fees

Tabletop Registration Fees

Membership Status Through 3/19/10 After 3/19/10
IMAPS/ACerS Corporate Member $550 per tabletop $650 per tabletop
Non-Corporate Member $700 per tabletop $800 per tabletop

IMAPS reserves the right to refuse any potential exhibitor or advertiser should IMAPS
deem the promotion of a company or organization inappropriate for any reason.

Reserve Booth On-line

Included With Your Registration
• one (1) six foot draped table
• two (2) chairs
• carpeting
• one (1) Technical Proceedings CD-Rom
• one (1) List of Attendees (Sent after the event)
• Two (2) Booth Personnel Registrations

Additional tabletop personnel are welcome at an extra cost of $50 per person. Registrations for the full conference are not included, but are available at an additional cost.

Shipments are made to the facility directly. You save money because no service contractor is involved!

OVTA
Chiba, Japan
About 40 min by train from Tokyo Station.
About 60 min by bus from Haneda Airport.
OVTA itself has accommodation facility.
Many hotels are available around OVTA.
http://www.ovta.or.jp/en/area_7.html

Cancellation Policy

Booth cancellations made before 3/20/10 will receive a refund minus $100 handling fee. Booths cancelled after 3/20/10 will not be refunded.

Marketing Feature Available for Exhibitors

IMAPS offers all exhibitors the option of providing a one advertisement page with information about company products, services and contact information to be included in the Technical Proceedings CD-ROM. These CD-ROMs are provided to all technical conference attendees and are for sale through IMAPS to all industry professionals.

This unique feature will promote an unlimited amount of promotional material for the Exhibitor’s products and abilities much longer than just the Conference. There is no charge for this optional feature, but the deadline is firm.

Submissions must be sent electronically in one (1) file, either PDF or Word, that is easy to open, not password-protected and in a logical format. Any materials not sent in the required format or that arrive after the deadline, may not appear on the CD-ROM. Send files to bschieman@imaps.org on or before March 20, 2010.

Questions about exhibits?
Ann Bell, IMAPS
abell@imaps.org | phone 202-548-8717


Reserve Booth On-line

 

 

 

© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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