IMAPS Home
Members Only
Login
About IMAPS
Events Calendar
Online Store
Membership
Chapters/Committees
Global Business Council
Industry News
Publications
Careers
IMAPS Microelectronics Foundation
Contact Us
IMAPS - International Microelectronics And Packaging Society
ACerS - American Ceramic Society
IMAPS Germany
Ilmenau University of Technology
MacroNano DKG - German Ceramics Society

IMAPS/ACerS 8th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2012)

April 16-19, 2012
Radisson Blu Hotel
Erfurt, Germany

Tabletop Exhibition & Sponsorship Information

General Co-Chairs:
Jens Müller
Technical University Ilmenau
jens.mueller@imaps.de
Rich Eitel
University of Kentucky
reitel@engr.uky.edu
Technical Program Co-Chairs:
Soshu Kirihara
Osaka University
kirihara@jwri.osaka-u.ac.jp
Marija Kosec
Jozef Stefan Institute
marija.kosec@ijs.si
Alexander Michaelis
Fraunhofer IKTS
alexander.michaelis@ikts.fraunhofer.de
Program Committee:

Andreas Roosen (University of Erlangen-Nuremberg), Heinz Osterwinter (HS Esslingen), Jörg Töpfer (FHS Jena), Thomas Rabe (BAM Berlin), Sebastian Brunner (EPCOS), Thomas Bartnitzek (Micro-Hybrid Electronic GmbH), Rubén Perrone (MSE GmbH)

Editor - IMAPS Journal
Fred Barlow
University of Idaho
fbarlow@uidaho.edu




Questions about exhibits?
Jens Müller, IMAPS Germany
jens.mueller@imaps.de | phone +49 3677 69 2606

The International Microelectronics And Packaging Society (IMAPS), The American Ceramic Society (ACerS), IMAPS Deutschland, the Institute of Micro- and Nanotechnologies MacroNano® of Ilmenau University of Technology, the Deutsche Keramische Gesellschaft (DKG) and Mikro-Nano-Thüringen e.V are cooperating in the production of the IMAPS/ACerS 8th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2012).

CICMT 2012 will bring together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect and ceramic microsystems technologies. The conference will feature ceramic technology for both Microsystems and Interconnect applications in a multi-track technical program.

CICMT will feature a focused exhibition for suppliers who support the use of this technology. There is limited exhibit space which will be allocated on a first-come, first-served basis.

Exhibiting Companies and Sponsors

Booth Nr. Exhibitor
2 EPP
13 ESL Europe
6 Mozaik Technology Ventures
8 NGK Spark Plug Europe GmbH
9 VIA-electronic GmbH
3 KARO Electronics Vertriebs GmbH
7 CERADROP
5 UNITEMP GmbH
4 cyberTECHNOLOGIES GmbH
12 HAIKU TECH EUROPE B.V.
11 CeramTec GmbH
Sponsor List
1 VIA-electronic GmbH
2 EPCOS AG, A Member of TDK-EPC Corporation 
3 DuPont (U.K.) Limited

 

Exhibition Hours -- 2 Full Days

Tuesday, April 17  --  10:00 am - 7:30 pm
Lunch, Coffee Breaks & Exhibitor Reception will be held in the Exhibit Area.

Wednesday, April 18  --  10:00 am - 4:30 pm
Lunch & Coffee Breaks will be in the Exhibit Area.

Installation Hours:
Tuesday, April 17   --  7:00 am - 10:00 am

Dismantle Hours:
Wednesday, April 18  --  4:30 pm - 7:00 pm

Tabletop Registration Fees

Payment Net VAT Gross
1 Tabletop Exhibit 1.100,00 € 209,00 € 1.309,00 €

Download Exhibition Registration Form and please fax to +49 3677 69 1204

Included With Your Registration
• one (1) draped table (approx. 1.20m x 0.4m)
• two (2) chairs

• one (1) pin board
• approx. 6m² floor space
• 230V power supply
• advertisement page in CD-ROM (Deadline: March 20)
• one (1) List of Attendees (Sent after the event)
• Two (2) full admissions for conference including:
CD-Rom with Technical Program; Coffee Breaks; Lunches and Congress Dinner

Cancellation Policy

Tabletop cancellations made before 20 March 2012 will receive a refund minus 150 € handling fee. Tabletops cancelled after 20 March 2012 will not be refunded.

Marketing Feature Available for Exhibitors

IMAPS offers all exhibitors the option of providing a one advertisement page with information about company products, services and contact information to be included in the Technical Proceedings CD-ROM. These CD-ROMs are provided to all technical conference attendees and are for sale through IMAPS to all industry professionals.

This unique feature will promote an unlimited amount of promotional material for the Exhibitor’s products and abilities much longer than just the Conference. There is no charge for this optional feature, but the deadline is firm.

Submissions must be sent electronically in one (1) file, either PDF or Word, that is easy to open, not password-protected and in a logical format. Any materials not sent in the required format or that arrive after the deadline, may not appear on the CD-ROM. Send files to bschieman@imaps.org on or before 20 March 2012.

Questions about exhibits?
Jens Müller, IMAPS Germany
jens.mueller@imaps.de | phone +49 3677 69 2606


Sponsorship

Why you should be a Sponsor of CICMT 2012?

  • CICMT is a well-known conference in the ceramics society.
  • Keep your company’s name prominent in the eyes of your customers.
  • Increase traffic to your CICMT 2012 Tabletop Exhibit.

CICMT 2012 Sponsor Benefits?

  • Your company’s name and logo prominently displayed throughout the event.
  • Specialized signage at sponsored event.
  • Recognition in various CICMT publications including the Final Program and the PLUS magazine.
  • Free advertisement page on the Conference CD-ROM

All sponsors are offered the opportunity to provide one advertisement page with information about company products, services and contact address. The deadline for submission of the pdf-file (not password-protected) is 20 March 2012. Any material arriving after the deadline may not appear on the CD-ROM. Please send files to bschieman@imaps.org before 20 March 2012.

List of Sponsoring Opportunities:

Potential sponsoring opportunities are being suggested for, but not limited to, the following items:

CD-ROM Advertisement only: 200 €
Coffee Breaks: 500 €
W-LAN Internet Access (3 days): 200 €
Lunches: 500 €
Welcome Reception: 600 €
Exhibition Reception: 600 €
Congress Dinner: 1000 €

Download Exhibition Registration Form and please fax sponsorship form to:

Prof. Jens Müller
Ilmenau University of Technology
Gustav-Kirchhoff-Str. 5
D – 98693 Ilmenau
Fax: +49 3677 / 69 1204

 

 

 

 

 

© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

<% rsCategory.Close() Set rsCategory = Nothing %>