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IMAPS - International Microelectronics And Packaging Society
ACerS - American Ceramic Society

IMAPS/ACerS 9th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2013)

April 23-25, 2013
Buena Vista Palace Hotel & Spa
Orlando, FL - USA

Abstract Deadline: November 2, 2012
Early Registration/Hotel Deadline: March 22, 2013

General Co-Chairs:
Rich Eitel
University of Kentucky
Sushu Kirihara
Osaka University
Technical Program Co-Chairs:
Co-Chair - USA:
Dan Krueger
Honeywell FM&T

Co-Chair - USA:
Donald Plumlee
Boise State University
Co-Chair - Europe:
Alexander Michaelis
Fraunhofer IKTS
Co-Chair Asia:
Longtu Li
Tsinghua University
Program Committee:

Paul Clem, Mike Lanagan, Andreas Roosen, Ken Peterson, Joerg Toepfer, Torsten Rabe, Leszek Golonka, Jens Muller, Hsing-I Hsiang

Editor - IMAPS Journal
John Pan
California Polytechnic University
Editor - ACerS Journal
Antonio Feteira
Sheffield Hallam University


Early Registration/Hotel Deadline: March 22, 2013

Tabletop Exhibition

Questions about exhibits?
Brian Schieman, IMAPS | phone 202-548-8715

The International Microelectronics and Packaging Society (IMAPS) and the American Ceramic Society (ACerS) are again cooperating in the production of the IMAPS/ACerS Ninth International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2013).

CICMT 2013 will feature a tabletop exhibition with the tables located around the perimeter of the lunch/break rooms - just outside the doors to our session rooms.  All meals and breaks will be in the exhibit area, and we will maximize break times so attendees can network with the exhibitors. The venue in 2013 will accommodate a maximum of 20 tabletops. The tabletop space is expected to SELL OUT quickly.

New This Year! All exhibiting companies will be given the opportunity to present a brief (2-3 minute maximum - TBD) introduction to their company and product portfolio during the technical symposia.

Additionally, CICMT 2013 will bring together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect and ceramic microsystems technologies. The Ceramic Interconnect topics focus on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, defense/ security, and communication industries.

The Ceramic Microsystems topics focus on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfl uidic, optical, micro-reactor and sensing functions. Tape casting, thick fi lm hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on material, processes, prototype development, advanced design and application opportunities.

Special Features:

  • Invited keynote and international presentations.
  • An exhibition for suppliers who support the use of the technologies.
  • A technical poster session to promote student participation.

Exhibition Hours -- 2 Days

Tuesday, April 23  --  10:00 am - 6:00 pm
Lunch, Refreshment Breaks & Exhibitor Reception will be held in the Exhibit Area.

Wednesday, April 24  --  10:00 am - 4:00 pm
Lunch & Refreshment Breaks will be in the Exhibit Area.

Installation Hours:
Tuesday, April 23   --  7:00 am - 10:00 am

Dismantle Hours:
Wednesday, April 24  --  4:00 pm - 8:00 pm

2013 Exhibiting Companies

The following companies will be on display at CICMT 2013:

Exhibiting Company Contact Booth Number
Richard Amigh
Henry Stenger
Aldrin Tan
Takeshi Mitsuoka
Beth Brownell
Tania Keefe
Christopher Mosher
Janet Lykowski
Kristian Guidi

Reserve Tabletop On-line

Tabletop Registration Fees

Tabletop Registration Fees

Membership Status Through 3/22/13 After 3/22/13
IMAPS/ACerS Corporate Member $550 per tabletop $650 per tabletop
Non-Corporate Member $700 per tabletop $800 per tabletop

IMAPS reserves the right to refuse any potential exhibitor or advertiser should IMAPS
deem the promotion of a company or organization inappropriate for any reason.

Reserve Tabletop On-line

Included With Your Registration
• one (1) six foot draped table
• two (2) chairs
• carpeting
• one (1) Technical Proceedings CD-Rom
• one (1) List of Attendees (Sent after the event)
• Two (2) Booth Personnel Registrations

Registrations for the full conference are not included, but are available at an additional cost.

Housing Information:

Buena Vista Palace Hotel & Spa
1900 Buena Vista Dr
Lake Buena Vista, FL 32830 - USA

Standard Single/Double: $155/night + tax and fees
Triple: $175/night + tax and fees
Quad: $195/night + tax and fees

On-Line Reservations

Phone Reservations: 1-866-397-6516
When calling, mention: IMAPS Annual Symposium/ CICMT Conference

Cancellation Policy

Booth cancellations made before 3/22/13 will receive a refund minus $100 handling fee. Booths cancelled after 3/22/13 will not be refunded.

Marketing Feature Available for Exhibitors

IMAPS offers all exhibitors the option of providing a one advertisement page with information about company products, services and contact information to be included in the Technical Proceedings CD-ROM. These CD-ROMs are provided to all technical conference attendees and are for sale through IMAPS to all industry professionals.

This unique feature will promote an unlimited amount of promotional material for the Exhibitor’s products and abilities much longer than just the Conference. There is no charge for this optional feature, but the deadline is firm.

Submissions must be sent electronically in one (1) file, either PDF or Word, that is easy to open, not password-protected and in a logical format. Any materials not sent in the required format or that arrive after the deadline, may not appear on the CD-ROM. Send files to on or before March 22, 2013.

Questions about exhibits?
Brian Schieman, IMAPS | phone 202-548-8715

Reserve Tabletop On-line




© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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