KESTER

IMAPS - International Microelectronics And Packaging Society
ACerS - American Ceramic Society

IMAPS/ACerS 13th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2017)

April 19-21, 2017
Todai-ji Museum
Nara, Japan

General Chair:
Minoru Osada
National Institute for Materials Science
osada.minoru@nims.go.jp

General Co-Chair:
Paula Vilarinho
University of Aveiro
paula.vilarinho@ua.pt
Technical Chair - USA:
Steve Dai
Sandia National Labs.
sxdai@sandia.gov
Technical Chair - Asia:
Yongxiang Li
Shanghai Institute of Ceramics
yxli@mail.sic.ac.cn

 


PROGRAM DOWNLOAD

SUBMIT ABSTRACT | SPEAKER INFORMATION
REGISTRATION DETAILS | HOTEL & VENUE INFORMATION


Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities.

Ceramic Interconnect
Conventional thick and thin film ceramic technologies are being revolutionized and extended through the development of low temperature co-fired ceramics, photo patterning, and embedded passive component materials and processes. These have contributed to increased circuit density, enhanced functionality, and improved performance that are being adopted for leading edge applications in wireless and optical communications, automotive, MEMS, sensors, and energy. Data communications and the Internet are driving the demand for bandwidth, sparking demand for optical communication equipment and new interconnect and packaging applications that perform at 40 Gb/sec and beyond. In under-the-hood electronics for automotive, engine/transmission control, communications, and safety applications continue to drive the growth of ceramic interconnect technology, while collision avoidance systems are creating interest in low loss ceramic materials for frequencies approaching 100 GHz.

Ceramic Microsystems
Enabled by the availability of commercial ceramic, metal and embedded passives materials systems, and the rapid prototyping capabilities of the well established multilayer ceramic interconnect technology, three dimensional (3-D) functional ceramic structures are spawning new microsystems applications in MEMS, sensors, microfluidics, bio-devices, microreactors, and metamaterials. These new devices and applications exploit the ability to integrate complex 3D features and active components (e.g., valves, pumps, switches, light pipes, and reaction chambers).

In addition, the Ceramic Microsystems track of the CICMT conference targets new developments in microsystems that include fabricating 3- D micro device structures enhanced with sol-gel, advanced printing and patterning technologies, high temperature materials technologies, and emerging applications like energy harvesting. Many of these innovative applications are taking advantage of the unique ability to integrate the thermal, chemical, mechanical and electrical properties of these multicomponent ceramic-metal systems.

Special Features
• Invited keynote and international presentations on the current status ceramic technology and future system directions.

• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.

Program PDF Download - additional details soon


 


Registration Information:(Early Registration/Hotel Deadline: March 24, 2017) - REGISTER ONLINE

Participant and student registration fees include: access to all technical sessions, access to the tabletop exhibition, meals, refreshment breaks, and one (1) Proceedings DOWNLOAD. Exhibit fee includes one tabletop exhibit space, and 1 registration to work the booth/exhibition. All prices below are subject to change.

Type
Early Fee
Through 3/24/2017
Regular/Onsite Fee
After 3/24/2017
Conference Participant
50,000 JPY
60,000 JPY
Student
20,000 JPY
25,000 JPY
Tabletop Exhibit (IMAPS/ACerS Members)
55,000 JPY
65,000 JPY
Tabletop Exhibit (Non-Members)
70,000 JPY
80,000 JPY

REGISTER ONLINE


Speaker Dates/Information:

  • Abstract Deadline: January 23, 2017
  • Speaker notification: March 7, 2017
  • Final Manuscripts for Proceedings due: APRIL 3, 2017
  • Early Registration/Hotel Deadlines: March 24, 2017
  • Speaker BIO Due: April 1, 2017
  • Technical Presentation Time: 20 minutes (15 to present; 5 for Q/A)
  • Keynote Presentation Time: 30 minutes (25 to present; 5 for Q/A)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Poster Presentations will be made on poster boards/easels approximately 3ft x 4ft. Presenters should plan accordingly. Pins/tacks will be provided for the setup. Additional poster details at: http://www.imaps.org/speakers/poster.htm.

 


Hotel Reservations & Venue Details -- REGISTER ONLINE

Todai-ji Museum (http://www.todaiji.or.jp/english/museum.html)
Details about Nara & the Museum
60 min from Kansai Airport by Train
45 min from Kyoto by Train

CICMT2017

 

 
 
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