IMAPS/ACerS 14th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2018)


April 18-20, 2018
University of Aveiro
Aveiro, Portugal

General Chair:
Paula Vilarinho
University of Aveiro

General Co-Chair:
Robert Pullar
University of Aveiro
Technical Chair:
Steve Dai
Sandia National Labs.
Technical Co-Chair:
Yongxiang Li
Shanghai Institute of Ceramics

Session Organizers:
Jorg Topfer, Jena University; Jens Muller, TU Ilmenau; Soshu Kirihara, Osaka University; Steve Dai, Sandia National Labs; YongXiang Li, Shanghai Institute of Ceramics;
Martin Letz, Schott AG; Marcus Eberstein, Epcos/TDK; Hsing-I Hsiang, National Univ Taiwan; Masahiro Yoshimura, National Cheng Kung Univ;
Minoru Osada, National Institute for Material Science; Tsukuba Peter Petrov, Department of Materials at Imperial College London; Dan Krueger, Honeywell


Questions about CICMT 2018: demac-cicmt2018@ua.pt


Thank you to our MEDIA SPONSOR:
Media Sponsor: Micromachines

CICMT 2018 "Special Session" topics to include:

  • Additive manufacturing / 3D printing
  • Emerging Technologies (4G/ 5G/ Car-Car Comms/ Automatic cars (ADAS))
  • Ferrites
  • Ferroics (ferroelectrics / piezoelectrics / multiferoics)
  • Flexible Electronics
  • Low Temperature Sintering Processes / ULTCC
  • MHz, GHz and THz for Communications, Sensors and Devices
  • Microfluidics and Lab-on-a-chip
  • Processing and Fabrication / LTCC

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities.

Ceramic Interconnect Track
Conventional thick and thin film ceramic technologies are being revolutionized and extended through the development of low temperature co-fired ceramics, photo patterning, and embedded passive component materials and processes. These have contributed to increased circuit density, enhanced functionality, and improved performance that are being adopted for leading edge applications in wireless and optical communications, automotive, MEMS, sensors, and energy. Data communications and the Internet are driving the demand for bandwidth, sparking demand for optical communication equipment and new interconnect and packaging applications that perform at 40 Gb/sec and beyond. In under-the-hood electronics for automotive, engine/transmission control, communications, and safety applications continue to drive the growth of ceramic interconnect technology, while collision avoidance systems are creating interest in low loss ceramic materials for frequencies approaching 100 GHz.

Ceramic Microsystems Track
Enabled by the availability of commercial ceramic, metal and embedded passives materials systems, and the rapid prototyping capabilities of the well established multilayer ceramic interconnect technology, three dimensional (3-D) functional ceramic structures are spawning new microsystems applications in MEMS, sensors, microfluidics, bio-devices, microreactors, and metamaterials. These new devices and applications exploit the ability to integrate complex 3D features and active components (e.g., valves, pumps, switches, light pipes, and reaction chambers).

In addition, the Ceramic Microsystems track of the CICMT conference targets new developments in microsystems that include fabricating 3- D micro device structures enhanced with sol-gel, advanced printing and patterning technologies, high temperature materials technologies, and emerging applications like energy harvesting. Many of these innovative applications are taking advantage of the unique ability to integrate the thermal, chemical, mechanical and electrical properties of these multicomponent ceramic-metal systems.

Other Features in planning:
• Invited keynote and international presentations on the current status ceramic technology and future system directions.

• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.

Planned Session and Paper Topics Include:

Ceramic Microsystems
Ceramic Interconnect

Markets and Applications
• MEMS Technology and Markets
• Batteries and Fuel Cells
• Biological and Medical
• Chemical and Biochemical
• Photonics
Materials and Properties
• Materials Integration & Nano-materials
• Thermal Management and Reliability
• Piezoelectric Materials

• Optoelectronics
Processing and Manufacturing
• MEMS Manufacturing Technology
• Industrial Automation and Rapid Prototyping
• Nano-technology/Integration
• High Temperature Microsystems
• Sensors and Actuators
• Micro-reactors
• Fluidic Devices
• Biomolecular and cell transport systems
• Energy Conversion systems
Characterization and Reliability
• Materials and Process Characterization
• Systems Reliability, Lifetime, and Failure Estimation
• Reliability of High-Performance Microsystems
Design, Modeling, and Simulation
• Thermal and Heat Transfer
• Computational Fluid Dynamics

Markets and Applications
• Automotive
• Aerospace
• Lighting/Solar
• Wireless/Communication
• Medical Electronics
Materials and Properties/Functions
• Dielectric and Magnetic Materials
• Embedded and Integrated Passives
• Microwave/mm wave characterization
• Zero-shrink Ceramic Systems
Processing and Manufacturing
• LTCC and Multilayer Ceramics
• Roll to Roll and Continuous Manufacturing
• Direct WRite and Drop on Demand
• Advanced Thick Film Processing
• Fine Structuring Technologies
• Circuits, antennas, and filters
• Embedded Structures & Components
• Optical Devices and Optoelectronics
Characterization and Reliability
• Characterization of Green Tapes
• Life Testing, Quality Issues
• RF performance
Design, Modeling, and Simulation
• High Frequency Design Software

• Design Rules

Integrated Ceramic Technology

Advanced Packaging Technology
• Next Generation Packaging Technologies
• Packaging and Integration in BioMEMS
• Packaging Issues for MEMS Devices
• Technologies for Microsystems Components and Substrates
• Packaging Standard for Microsystems
• Environmental Issues, Lead Free Systems
• Cost Reduction

Abstracts Due IMMEDIATELY (Program being developed)
Notice of Acceptance: February 15, 2018
*Full Papers Not Required - select authors will be invited to IMAPS and ACerS Journals*

Please send your 500+ word abstract electronically IMMEDIATELY, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full papers are NOT MANDATORY -- Authors wishing to publish full papers may submit their work to IMAPS or ACerS Journals for peer review. Accepted Journal papers will be assigned DOIs, archived into IMAPS new Microelectronics Research Portal (www.IMAPSource.org), and fully citable. All papers will be presented and published in English. All speakers are required to pay a reduced registration fee.

If you are having problems with the on-line submittal form, please email Brian Schieman bschieman@imaps.org.

Questions about CICMT 2018: demac-cicmt2018@ua.pt

Registration Information: (Early Registration/Hotel Deadline: 28 February 2018) - REGISTER ONLINE

Participant and student registration fees include: access to all technical sessions, access to the tabletop exhibition, meals, refreshment breaks, and one (1) DOWNLOAD of the Conference technical presentation slides. Exhibit fee includes one tabletop exhibit space, and 1 registration to work the booth/exhibition. All prices below are subject to change.

Early Fee
Through 28/2/2018
Regular/Onsite Fee
After 28/2/2018

Conference Participant




Tabletop Exhibit
If you decide to join our meeting just as an Exhibitor, a Table Exhibit will be available and will be displayed in a significant place next to session rooms, where numerous activities of the event will take place, specifically the poster sessions, and the coffee breaks. The Table Exhibit will include one table (approx. 1.20m x 0,4m), 2 chairs. The cost of table exhibit is € 1000 for the three days of the event. One full registration for the conference is included, with access to Coffee Breaks, Lunches, Gala Dinner and Social Events. The List of Attendees will be sent after the event. Also available the opportunity to provide one advertisement page with information about company products, services and contacts. The deadline for submission of the pdf-file (not password-protected) is 18 March 2018. Any material arriving after the deadline may not appear on the Book of Abstracts. Please send files to demac-cicmt2018@ua.pt before 18 March 2018.

Exhibition Hours
• April 18 -- 09:00 am - 6:00 pm Coffee Breaks & Exhibitor Reception will be held in the Exhibit Area.
• April 19 -- 09:00 am - 6:00 pm Coffee Breaks will be in the Exhibit Area.
• April 20 -- 09:00 am - 2:00 pm Coffee Breaks will be in the Exhibit Area.
• Installation Hours: April 17 --2:00 pm - 6:00 pm
• Dismantle Hours: April 20 -- 2:00 pm - 7:00 pm


- Regular Sponsor - Companies that offer support for the amount of 1500 €.

1 Table Exhibit include one table (approx. 1.20m x 0,4m),
2 chairs in a place next to session rooms - 2 Participation Passes (2 full registration) at the congress, entitled to all the benefits offered to participants, including coffee breaks and lunches, conference bag with program and Abstracts book, welcome cocktail, gala dinner and social activities.
- An A4 page ad in the program and the Abstracts book.
- Sponsor logo will be placed on the conference bag
- The sponsor's advertisement / logo will be placed on the conference homepage with a link to the sponsor's home page;
- The logo will appear in prominent places in the conference spaces;
- Availability of time for oral presentation throughout the event;
Publicity material of the company can be placed free of charge in the folder offered to the participants.

- Specific Sponsor - Companies that promote specific items and events during the meeting.
• Conference welcome cocktail - € 500
• Conference Gala Dinner - 1000 €
• Conference Lunches - 750 €
• Conference Coffee Breaks - 500 €



Speaker Dates/Information:

  • Abstract Deadline: JANUARY 31, 2018
  • Speaker notification: February 15, 2018
  • Early Registration/Hotel Deadlines: March 2018
  • Speaker BIO Due: April 1, 2018
  • Technical Presentation Time: 20 minutes (15 to present; 5 for Q/A)
  • Keynote Presentation Time: 30 minutes (25 to present; 5 for Q/A)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Poster Presentations will be made on poster boards/easels approximately 3ft x 4ft. Presenters should plan accordingly. Pins/tacks will be provided for the setup. Additional poster details at: http://www.imaps.org/speakers/poster.htm.


Hotel Reservations & Venue Details -- Rate Valid Until 29/12/2017


Melia Ria Hotel & Spa - http://www.meliaria.com / melia.ria@meliaportugal.com

Send an email with your reservation details:

Name, Check-in and Check-out information

The Reservation Code is CICMT 2018
Standard single room: € 80,00 / night (VAT included)
Standard twin / double room: € 90,00 / night (VAT included)

- Board: Bed and Breakfast
- Free internet access (wireless connection)

Reservations must be made directly by the participants by email (melia.ria@meliaportugal.com) or by telephone (+351 234 401 000), mentioning the event in which they will participate.

Any reservation made through any other means (eg online booking sites) will be applied to the rate indicated by the site, not the special rate that we now inform, even if it says in the reservation comments that the guest will participate in a University event of Aveiro. If you wish, please let us know the name of the Symposium

Reserve must be paid directly by the participants
- Rate valid until 29/12/2017
- Confirmation of reservations subject to hotel availability

Additional Hotel Options:

Imperial Hotel - http://www.hotelimperial.pt/
Jardim Hotel - http://www.hoteljardim.pt/pt-pt
Afonso V Hotel - http://www.hotelafonsov.pt/pt-pt/


  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems