Micross

IMAPS - International Microelectronics And Packaging Society
ACerS - American Ceramic Society

IMAPS/ACerS 14th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2018)

SUBMIT ABSTRACTS

April 18-20, 2018
University of Aveiro
Aveiro, Portugal

General Chair:
Paula Vilarinho
University of Aveiro
paula.vilarinho@ua.pt

General Co-Chair:
Robert Pullar
University of Aveiro
rpullar@ua.pt
Technical Chair:
Steve Dai
Sandia National Labs.
sxdai@sandia.gov
Technical Co-Chair:
Yongxiang Li
Shanghai Institute of Ceramics
yxli@mail.sic.ac.cn

 


ABSTRACTS DUE : November 30, 2017

SUBMIT ABSTRACT | SPEAKER INFORMATION
REGISTRATION DETAILS | HOTEL & VENUE INFORMATION
TABLETOP EXHIBITION (SOON)


Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities.

Ceramic Interconnect Track
Conventional thick and thin film ceramic technologies are being revolutionized and extended through the development of low temperature co-fired ceramics, photo patterning, and embedded passive component materials and processes. These have contributed to increased circuit density, enhanced functionality, and improved performance that are being adopted for leading edge applications in wireless and optical communications, automotive, MEMS, sensors, and energy. Data communications and the Internet are driving the demand for bandwidth, sparking demand for optical communication equipment and new interconnect and packaging applications that perform at 40 Gb/sec and beyond. In under-the-hood electronics for automotive, engine/transmission control, communications, and safety applications continue to drive the growth of ceramic interconnect technology, while collision avoidance systems are creating interest in low loss ceramic materials for frequencies approaching 100 GHz.

Ceramic Microsystems Track
Enabled by the availability of commercial ceramic, metal and embedded passives materials systems, and the rapid prototyping capabilities of the well established multilayer ceramic interconnect technology, three dimensional (3-D) functional ceramic structures are spawning new microsystems applications in MEMS, sensors, microfluidics, bio-devices, microreactors, and metamaterials. These new devices and applications exploit the ability to integrate complex 3D features and active components (e.g., valves, pumps, switches, light pipes, and reaction chambers).

In addition, the Ceramic Microsystems track of the CICMT conference targets new developments in microsystems that include fabricating 3- D micro device structures enhanced with sol-gel, advanced printing and patterning technologies, high temperature materials technologies, and emerging applications like energy harvesting. Many of these innovative applications are taking advantage of the unique ability to integrate the thermal, chemical, mechanical and electrical properties of these multicomponent ceramic-metal systems.

Special Features
• Invited keynote and international presentations on the current status ceramic technology and future system directions.

• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.

Planned Session and Paper Topics Include:

Ceramic Microsystems
Ceramic Interconnect

Markets and Applications
• MEMS Technology and Markets
• Batteries and Fuel Cells
• Biological and Medical
• Chemical and Biochemical
• Photonics
Materials and Properties
• Materials Integration & Nano-materials
• Thermal Management and Reliability
• Piezoelectric Materials

• Optoelectronics
Processing and Manufacturing
• MEMS Manufacturing Technology
• Industrial Automation and Rapid Prototyping
• Nano-technology/Integration
• High Temperature Microsystems
Devices
• Sensors and Actuators
• Micro-reactors
• Fluidic Devices
• Biomolecular and cell transport systems
• Energy Conversion systems
Characterization and Reliability
• Materials and Process Characterization
• Systems Reliability, Lifetime, and Failure Estimation
• Reliability of High-Performance Microsystems
Design, Modeling, and Simulation
• Thermal and Heat Transfer
• Computational Fluid Dynamics


Markets and Applications
• Automotive
• Aerospace
• Lighting/Solar
• Wireless/Communication
• Medical Electronics
Materials and Properties/Functions
• Dielectric and Magnetic Materials
• Embedded and Integrated Passives
• Microwave/mm wave characterization
• Zero-shrink Ceramic Systems
Processing and Manufacturing
• LTCC and Multilayer Ceramics
• Roll to Roll and Continuous Manufacturing
• Direct WRite and Drop on Demand
• Advanced Thick Film Processing
• Fine Structuring Technologies
Devices
• Circuits, antennas, and filters
• Embedded Structures & Components
• Optical Devices and Optoelectronics
Characterization and Reliability
• Characterization of Green Tapes
• Life Testing, Quality Issues
• RF performance
Design, Modeling, and Simulation
• High Frequency Design Software

• Design Rules

Integrated Ceramic Technology
 

Advanced Packaging Technology
• Next Generation Packaging Technologies
• Packaging and Integration in BioMEMS
• Packaging Issues for MEMS Devices
• Technologies for Microsystems Components and Substrates
• Packaging Standard for Microsystems
• Environmental Issues, Lead Free Systems
• Cost Reduction


Abstracts Deadline: NOVEMBER 30, 2017
Notice of Acceptance: January 5, 2018
*Full Papers Not Required - select authors will be invited to IMAPS and ACerS Journals*

Please send your 500+ word abstract electronically IMMEDIATELY, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full papers are NOT MANDATORY -- Authors wishing to publish full papers may submit their work to IMAPS or ACerS Journals for peer review. Accepted Journal papers will be assigned DOIs, archived into IMAPS new Microelectronics Research Portal (www.IMAPSource.org), and fully citable. All papers will be presented and published in English. All speakers are required to pay a reduced registration fee.

If you are having problems with the on-line submittal form, please email Brian Schieman bschieman@imaps.org.


Registration Information: (Early Registration/Hotel Deadline: March 2018) - REGISTER ONLINE SOON

Participant and student registration fees include: access to all technical sessions, access to the tabletop exhibition, meals, refreshment breaks, and one (1) DOWNLOAD of the Conference technical presentation slides. Exhibit fee includes one tabletop exhibit space, and 1 registration to work the booth/exhibition. All prices below are subject to change.

Type
Early Fee
Through 3/2018
Regular/Onsite Fee
After 3/2018
Conference Participant
SOON
SOON
Student
SOON
SOON
Tabletop Exhibit (IMAPS/ACerS Members)
SOON
SOON
Tabletop Exhibit (Non-Members)
SOON
SOON

REGISTER ONLINE SOON


Speaker Dates/Information:

  • Abstract Deadline: NOVEMBER 30, 2017
  • Speaker notification: January 5, 2018
  • Early Registration/Hotel Deadlines: March 2018
  • Speaker BIO Due: April 1, 2018
  • Technical Presentation Time: 20 minutes (15 to present; 5 for Q/A)
  • Keynote Presentation Time: 30 minutes (25 to present; 5 for Q/A)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Poster Presentations will be made on poster boards/easels approximately 3ft x 4ft. Presenters should plan accordingly. Pins/tacks will be provided for the setup. Additional poster details at: http://www.imaps.org/speakers/poster.htm.

 


Hotel Reservations & Venue Details -- DETAILS SOON

Please check back

 

 
 
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