KESTER

CICMT

IMAPS/ACerS 11th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2015)

TECHNICAL PROGRAM

April 20-23, 2015
Fraunhofer Institute Center
Winterbergstrasse 28
01277 Dresden, Germany

General Chair:
Alexander Michaelis
Fraunhofer IKTS
Alexander.Michaelis@ikts.fraunhofer.de
General Co-Chair:
Dan Krueger
Honeywell FM&T
dkrueger@kcp.com
Technical Chair:
Minoru Osada
National Institute for Materials Science, Japan
Technical Co-Chair:
Steve Dai
Sandia National Lab., USA


Local Organizing Committee:
Uwe Partsch, Fraunhofer IKTS, Germany
Markus Eberstein, Fraunhofer IKTS, Germany
Jens Müller, Ilmenau University of Technology, Germany
Jörg Töpfer, FHS Jena, Germany
Sebastian Brunner, EPCOS AG, Munich, Germany
Torsten Rabe, Federal Institute for Materials Research and Testing, Berlin, Germany

 


Technical Program

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both Microsystems and Interconnect applications in a dual-track technical program.

The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, microreactor and sensing functions. Tape casting, thick-film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on material, processes, prototype development, advanced design and application opportunities.

 

Schedule:

Monday, April 20, 2015
(afternoon)
Registration and welcome reception

Tuesday, April 21, 2015 Parallel sessions
IKTS laboratory tour
Poster session and finger food

Wednesday, April 22, 2015 Parallel sessions
Guided city tour
Congress dinner in Dresden's historic city

Thursday, April 23, 2015 Parallel sessions until noon
Lunch & wrap up

 

 

 


Registration Information: (Early Registration/Hotel Deadline: March 20, 2015)

Conference fee includes: Entrance to conference sessions and poster presentations; Entrance to the industrial exhibition; Coffee, drinks and fingerfood during the breaks; Small lunches; Welcome reception on April 20, 2015; Fraunhofer IKTS laboratory tour on April 21, 2015; Poster session and finger food on April 21, 2015; and Guided city tour and conference dinner on April 22, 2015 . All prices below are subject to change.

Type
Early Fee
Through 3/20/2015
Advance/Onsite Fee
After 3/20/2015
Member (IMAPS, ACerS, DKG)
550 Euros
650 Euros
Non-Member
650 Euros
750 Euros
Speaker, Chair
450 Euros
450 Euros
Student (valid student card)
200 Euros
200 Euros
Tabletop Exhibit (includes booth & one exhibitor person)
1.300 Euros plus 19 % VAT
Exhibitor Second Person
200 Euros
200 Euros

 

 


Exhibition Information:

Industrial Exhibition
The Conference is complemented by an industrial exhibition that offers an efficient contact platform and opportunity to learn about the latest developments.

We cordially invite you to participate as an exhibitor at the Conference.

  • Each booth is about 5 square meters in size with a table, a wall poster, a shair and on request a power supply.
  • We publish a brief company profile at this place and in the conference documents.
  • The catering during the breaks and the poster presentation will take place in the exhibition area.
  • The exhibitor fee of 1.300 Euros plus 19 % VAT includes the booth as described and the conference fee for one person.
  • For a second exhibitor person a reduced fee of 200 Euros will be charged.

 

 

 

 
CORPORATE PREMIER MEMBERS
  • Amkor
  • Canon
  • Corning
  • Fastech Synergy Philippines
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NEO Tech
  • Palomar
  • Plexus
  • Qualcomm
  • Specialty Coating Systems
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