Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both Microsystems and Interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, de-fense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sens-ing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on material, processes, prototype development, advanced design and application opportunities.

Ceramic Interconnect Track
Ceramic Interconnect technology has a long history of meeting the requirements of the most demanding applications. Conventional thick and thin film ceramic technologies are being revolutionized and extended through the development of low temperature co-fired ceramics, photo patterning, and embedded passive component materials and processes. These have contributed to increased circuit density, enhanced functionality, and improved performance that are being adopted for leading edge applications in wireless and optical communications, automotive, MEMS, sensors, and energy. Data communications and the Internet are driving the demand for bandwidth, sparking demand for optical communication equipment and new interconnect and packaging applications that perform at 40 Gb/sec and beyond. In under-the-hood electronics for automotive, engine/transmission control, communications, and safety appli-cations continue to drive the growth of ceramic interconnect technology, while collision avoidance systems are creating interest in low loss ceramic materials for frequencies approaching 100 GHz.

Ceramic Microsystems Track
Enabled by the availability of commercial ceramic, metal and embedded passives materials systems, and the rapid prototyp-ing capabilities of the well established multilayer ceramic interconnect technology, three dimensional (3-D) functional ceramic struc-tures are spawning new microsystems applications in MEMS, sensors, microfluidics, bio-devices, microreactors and microenergy. These new devices and applications exploit the ability to make microchannels and embed fluidic device functions (e.g., valves, pumps, switches, light pipes, and reaction chambers).

In addition, the Ceramic Microsystems track of the CICMT conference targets new developments in microsystems that in-clude fabricating 3-D micro device structures enhanced with sol-gel, advanced printing and patterning technologies, high temperature materials technologies, and emerging applications like energy harvesting. Many of these innovative applications are taking advantage of the unique ability to integrate the thermal, chemical, mechanical and electrical properties of these multicomponent ceramic-metal systems.

Special Features
• Invited keynote and international presentations on the current status ceramic technology and future system directions.
• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.

Planned Session and Paper Topics Include:

Ceramic Microsystems	Ceramic Interconnect
Markets and Applications • MEMS Technology and Markets • Energy and Fuel Cells • Biological and Medical • Chemical and Biochemical • Photonics Materials and Properties • Materials Integration & Nano-materials • Thermal Management and Reliability • Piezoelectric Materials • Optoelectronics Processing and Manufacturing • MEMS Manufacturing Technology • Industrial Automation and Rapid Prototyping • Nano-technology/Integration • High Temperature Microsystems Devices • Sensors and Actuators • Micro-reactors • Fluidic Devices • Biomolecular and cell transport systems • Energy Conversion systems Characterization and Reliability • Materials and Process Characterization • Systems Reliability, Lifetime, and Failure Estimation • Reliability of High-Performance Microsystems Design, Modeling, and Simulation • Thermal and Heat Transfer • Computational Fluid Dynamics	Markets and Applications • Automotive • Aerospace • Wireless/Communication • Medical Electronics Materials and Properties/Functions • Dielectric and Magnetic Materials • Embedded and Integrated Passives • Microwave/mm wave characterization • Zero-shrink Ceramic Systems Processing and Manufacturing • Green Tape Manufacturing • Multilayer Ceramics - Via and Pattern Generation - Metallization Processes - Lamination - Binder Burnout and Co-Firing • Laser trimming and deposition • Advanced Thick Film Processing • Fine Structuring Technologies • Rapid Prototyping Devices • Circuits, antennas, and filters • Embedded Structures & Components • Optical Devices and Optoelectronics Characterization and Reliability • Characterization of Green Tapes • Life Testing, Quality Issues • RF performance Design, Modeling, and Simulation • High Frequency Design Software • Design Rules
Integrated Ceramic Technology
Advanced Packaging Technology • Next Generation Packaging Technologies • Packaging and Integration in BioMEMS • Packaging Issues for MEMS Devices • Technologies for Microsystems Components and Substrates • Packaging Standard for Microsystems • Environmental Issues, Lead Free Systems • Cost Reduction

Abstract Cut-off Date: December 12, 2008
Notice of Acceptance: December 19, 2008
Final Manuscripts Due: February 20, 2009

Please send your 250-300 word abstract electronically only by December 12, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. All papers will be presented and published in English. All speakers are required to pay a reduced registration fee.

If you are having problems with the on-line submittal form, please email Jackki Morris-Joyner jmorris@imaps.org or call 1-305-382-8433 (USA).

The 2010 IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies Conference will be held in Japan.

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Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check at the ATW/Conference. The selected student must attend the event to present his or her work and receive the award.

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Speaker Dates/Information:

• Abstract Deadline: December 12, 2008
• Speaker notification: December 19, 2008
• Final Manuscripts for Proceedings due: February 20, 2009
• Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)

 

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Hotel Reservations

The Curtis
1405 Curtis Street
Denver, CO 80202

Phone Reservations: (800) 525 6651
Online Reservations: www.thecurtis.com (Enter dates on homepage, then on the next screen enter “Rate Code” GRPIMP)

Rates: $199/night standard, $229/night upgraded
Cut off date: Friday, March 20, 2009