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IMAPS - International Microelectronics And Packaging Society
ACerS - American Ceramic Society

IMAPS/ACerS 6th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2010)

OVTA
Chiba, Japan
April 18 - 21, 2010

General Co-Chairs:
Takaaki Tsurumi
Tokyo Institute of Technology
ttsurumi@ceram.titech.ac.jp
Shin-in Nichi
Konica-Minolta IJ
shinichi.nishi@konicaminolta.jp
Technical Program Co-Chairs:
Jun Akedo
AIST
akdeo-j@aist.go.jp
Amy Moll
Boise State University
amoll@boisestate.edu
Jens Müller
Technical University Ilmenau
jens.mueller@imaps.de
Program Committee:
Michael Lanagan
Pennsylvania State University
mlanagan@psu.edu
Soshu Kirihara
Osaka University
kirihara@jwri.osaka-u.ac.jp
Editor - IMAPS Journal
Fred Barlow
University of Idaho
fbarlow@uidaho.edu
Editor - ACerS Journal
Chris Apblett
Sandia National Laboratory
caapble@sandia.gov

Co-Sponsored By:
IMAPS Japan
Ceramics Society of Japan
Ferroelectric Committee of Japan (FMA)
Japan Society of Applied Physics
MRS-Japan
AIST


Technical Program PDF

Hotel Information | Transportation
Speaker Information | Tabletop Exhibit Information


Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both Microsystems and Interconnect applications in a dual-track technical program. The Ceramic Interconnect topics focus on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, defense/security, and communication industries. The Ceramic Microsystems topics focus on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both topical areas, with emphasis on material, processes, prototype development, advanced design and application opportunities.

Special Features
• Invited keynote and international presentations on the current status ceramic technology and future system directions.

• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.

Technical Program PDF

 

The 2011 IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies Conference will be held in USA.


Speaker Dates/Information:

  • Speaker notification: February 10, 2010
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)

 


Registration

Conference Registration Fees (Fees in JPY)

  Before 3/20   After 3/20
IMAPS/ACerS Member \57,500 \67,500
Non-Member \70,000 \80,000
Speaker, Chair, Chapter Officer \50,000 \60,000
Student \20,000 \30,000

Tabletop Exhibit:

IMAPS/ACerS Org. Member \45,000 \55,000
Non-Member \50,000 \60,000
Banquet (include tavel fee) \7,000 \7,000

Registration is being managed by a local travel agency in Japan. Attendees/Exhibitors will pay on-line with Visa, Mastercard or American Express only. On-site registrations will NOT be accepted with CICMT 2010 - so you MUST register before the conference begins.


Hotel Reservations

Hotel Deadline: Friday, March 19, 2010

Hotel reservations will be made during the on-line registration process. You are able to reserve rooms directly at the OVTA campus which is most convenient and inexpensive. There are a selection of other hotels near OVTA as well.

Book hotel when you register on-line at:
http://www.kingtour.com/cicmt/.


Transportation

      About 40 min by train from Tokyo Station.
        About 60 min by bus from Haneda Airport.
        OVTA itself has accommodation facility.
        Many hotels are available around OVTA.
        http://www.ovta.or.jp/en/area_7.html

 


 

Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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