Device Packaging 2019

IMAPS/ACerS 15th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2019)


April 16-19, 2019
New World Shanghai Hotel
Shanghai, China


Notice of Acceptance: January 31, 2019
Deadline of full paper submission: April 17, 2019

Questions about CICMT 2019:



CICMT 2019 Goal:
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a multi-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for extreme environments in the automotive, aerospace, lighting, solar, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Multilayer ceramic, thin film, tape casting, thick film hybrid, direct write, and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design, and application opportunities.

General Chairs:
Yongxiang Li, Shanghai Institute of Ceramics, Chinese Academy of Sciences
Ji Zhou, School of Materials Science and Engineering, Tsinghua University

Technical Chairs:
America: Steve Dai, Sandia National Laboratory
Europe: TBD
Asia: Soshu Kirihara, Osaka University

Conference Secretaries:
Brian Schieman, IMAPS
Zhifu Liu, Shanghai Institute of Ceramics, CAS
Beini Lu, Shanghai Institute of Ceramics, CAS
Feng Liu, Shanghai Institute of Ceramics, CAS

International Scientific Advisory Committee:
Steve Dai, Sandia National Laboratory
Markus Eberstein, EPCOS/TDK
Hsing-I Hsiang, National Cheng Kung University
Heli Jantunen, University of Oulu
Yoshihiko Imanaka, Fujitsu Laboratories Ltd.
Soshu Kirihara, Osaka University
Eung Soo Kim, Kyonggi University
Daniel S. Krueger, Honeywell
Martin Letz, Schott AG
Jens Müller, University of Ilmenau
Cewen Nan, Tsinghua University
Minoru Osada, National Institute for Materials Science
Uwe Partsch, Fraunhofer IKTS
Mario Ricardo Gongora Rubio, IPT-São Paulo
Jörg Töpfer, University of Applied Sciences Jena
Paula Vilarinho, University of Aveiro
Yao Xi, Tongji University
Huaiwu Zhang, Univ of Electronic Science & Tech China
Yan Zhuang, Guangzhou Institute of Communication

Local Organizing Committee:
Yang Bai, University of Science and Technology Beijing
Jianjiang Bian, Shanghai University
Xiangming Chen, Zhejiang University
Shuxiang Dong, Peiking University
Xianlin Dong, Shanghai Institute of Ceramics, CAS
Bo Li, Tsinghua University (Shenzhen Campus)
Guorong Li, Shanghai Institute of Ceramics, CAS
Zhifu Liu, Shanghai Institute of Ceramics, CAS
Rong Sun, Shenzhen Institutes of Advanced Technology, CAS
Genshui Wang, Shanghai Institute of Ceramics, CAS
Hong Wang, Southern University of Science and Technology
Xiaohui Wang, Tsinghua University
Yong Xiang, Shenzhen Eyang Tech Development Co. Ltd
Zhuo Xu, Xi’an Jiaotong University
Jianhua Yang, Shanghai Institute of Ceramics, CAS
Jiwei Zhai, Tongji University
Huarong Zeng, Shanghai Institute of Ceramics, CAS
Ruzhong Zuo, Heifei University of Technology



Planned Session and Paper Topics Include:

1. Functional materials for passive/active devices and their properties
• Microwave/mm-wave LTCC/ULTCC dielectric materials
• Ferroelectric/piezoelectric/pyroelectric/ferrite/multiferroic materials
• Sensitive ceramics/thermoelectric/electrocaloric materials
• Dielectric/ferroelectric/piezoelectric composites
• Pastes/inks/slurries for electronics

2. Material processing and device manufacturing technologies
• LTCC/HTCC and multilayer ceramic and glass processing
• Emerging ultralow temperature, room temperature processing, and cold sintering processing
• Additive manufacturing /3D printing/ direct writing
• Advanced thick film processing
• Fine structuring technologies
• Emerging embedding/integration technologies

3. Devices for emerging technologies
• Circuits, antennas, and filters for MHz, GHz and THz for communications
• Automotive/aerospace/medical electronics/optoelectronics
• Flexible/wearable electronics
• Integrated physical/chemical/biological sensors and actuators
• Packaging and integration issues for MEMS and BioMEMS devices
• Batteries/fuel cells/ energy conversion systems
• Micro-reactors/micro-fluidic devices

4. Design, modeling, simulation, characterization and reliability
• Metamaterials design, realization and characterization
• High frequency devices design/modeling/simulation
• Materials and devices characterization
• Material and device reliability, lifetime, and failure estimation
• Thermal management/thermal transfer simulation

Abstracts Now Due: December 31, 2018
Notice of Acceptance: January 31, 2019
Deadline of Full Paper Submission: April 17, 2019

Please send your 500+ word abstract electronically IMMEDIATELY, using the on-line submittal form at: Full papers are due APRIL 17 and will be sent submitted separately via email or upload. All papers will be presented and published in English.

If you are having problems with the on-line submittal form, please email Brian Schieman

Questions about CICMT 2019:

Thank you Sponsors & Tabletop Exhibitors:

Platinum Sponsor:

Platinum Sponsor: Keko Equipment


Tabletop Exhibitors:

Exhibitor: MTI Corporation

Exhibitor: Partulab




Supporting Sponsor:

American Elements, global manufacturer of high purity metals, semiconductors, ceramics, nanomaterials, & sputtering targets for optoelectronics, sensors, thin films, & MEMS devices




Registration Information: (Early Registration/Hotel Deadline: 15 March 2019) - REGISTER ONLINE

Participant and student registration fees include: access to all technical sessions, access to the tabletop exhibition, meals, refreshment breaks, and one (1) DOWNLOAD of the Conference technical presentation slides. Exhibit fee includes one tabletop exhibit space, and 1 registration to work the booth/exhibition. All prices below are subject to change.

Early Fee
Through 15/3/2019
Regular/Onsite Fee
After 15/3/2019

Conference Participant


Invited Speakers




Tabletop Exhibit
The suppliers of LTCC processing, microelectronic assembly and packaging, 3D printing, electric/magnetic/structural characterization facilities are invited to take part in the Exhibition or Sponsor the conference.

-1 Table Exhibit will include one table (approx. 1.50m x 0.70m), 2 chairs.
-One full registration
- The List of Attendees will be sent after the event.
- Available the opportunity to provide one advertisement page with information about company products, services and contacts.

Please contact for more details.


- 1 Table Exhibit include one table (approx. 1.50m x 0.7m) and 2 chairs
- 2 Participation Passes (2 full registration)
- An A4 page ad in the program and the Abstracts book.
- The sponsor's advertisement / logo will be placed on the conference homepage with a link to the sponsor's home page;
- The logo will appear in prominent places in the conference spaces
*Sponsorship for banquet and student poster awards naming please contact



Speaker Dates/Information:

  • Abstract Deadline extended to: DECEMBER 31, 2018
  • Speaker notification: January 31, 2019
  • Deadline of full paper submission: April 17, 2019
  • Early Registration/Hotel Deadlines: March 15, 2019
  • Speaker BIO Due: April 1, 2019
  • Technical Presentation Time: 20 minutes (15 to present; 5 for Q/A)
  • Keynote Presentation Time: 30 minutes (25 to present; 5 for Q/A)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to prior to event)
  • Poster Presentations will be made on poster boards/easels approximately 3ft x 4ft. Presenters should plan accordingly. Pins/tacks will be provided for the setup.
  • The participants are encouraged to submit full papers to the conference. Selected papers will be published in International Journal of Applied Ceramics Technology or Journal of Inorganic Materials (for the materials-focused papers) or IMAPS Journal of Microelectronics and Electronic Packaging (for the packaging-focused top papers) after peer review..


Visa Application / Information

Please contact the conference secretary if you need an invitation letter or other documents for visa application. E-mail:


Hotel Reservations, Venue Details & Travel to CICMT

1) New World Shanghai Hotel -- VENUE HOTEL
1555 Dingxi Road, Changning District, Shanghai 200050, PRC | +86 21 6240 8888

New World Shanghai Hotel is a five star hotel in the downtown Shanghai, just nearby the SICCAS (Changning campus). Overlooking lush Zhongshan Park, in Shanghai's prime business district, this hotel is an urban sanctuary offering warm and attentive service to its guests, with comfortable, convenient and efficient accommodations. There are many hotels around and several metro lines connect to the airports and train stations

2) Pentahotel Shanghai (1 min to venue hotel by walk)
No.1525 Dingxi Road, Changning District, Shanghai | +86 21-6252 1111

3) Yitel Premium Shanghai Zhongshan Park (15 min to venue hotel by walk)
Building B, No.1119 Yan'an West Road, Changning District, Shanghai | +86 21 5118 0555

4) Lereal Inn Shanghai Zhongshan Park (10 min to venue hotel by walk)
No.1018 Dingxi Road, Changning District, Shanghai | +86 21-62110988

5) Tingfeng Business Hotel (10 min to venue hotel by walk)
No.1031 Dingxi Road, Changning District, Shanghai | +86 21 62100003

*The attendees can book the hotel using public reservation tools like booking, ctrip, etc. .

Traveling to CICMT:

From Pudong International Airport:

Route 1: Take metro line 2 from Airport, get off at Zhongshan Park station and go out from gate 5 (~ 1 hour 40 mins)

Route 2: Take maglev train from Airport, then transfer to metro line 2 at Longyang road. Get off at Zhongshan Park station and go out from gate 5 (~ 1 hour)

From Hongqiao Airport or Hongqiao Railway Station:

Route 1: Take metro line 2, get off at Zhongshan Park station and go out from gate 5 (~ 40 mins)

Route 2: Taxi. (~40 mins and cost is about CNY50.0) SEE the map below.



  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic