IMAPS - International Microelectronics And Packaging Society: Bringing together the entire microelectronics supply chain!


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IMAPS - International Microelectronics And Packaging Society
ACerS - American Ceramic Society

IMAPS/ACerS 5th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2009)

The Curtis Hotel
Denver, Colorado - USA
April 21 - 23, 2009

General Co-Chairs:
Technical Program Co-Chairs:

Michael Lanagan
Penn State University
mlanagan@psu.edu

Jun Akedo
AIST
akdeo-j@aist.go.jp

Amy Moll
Boise State University
amoll@boisestate.edu

Takaaki Tsurumi
Tokyo Institute of Technology
ttsurumi@ceram.titech.ac.jp

Jens Müller
Technical University Ilmenau
jens.mueller@imaps.de



Early Registration and Hotel Deadline: March 20, 2009

Advance Program | Register On-Line
Download Advance Program PDF | Hotel Information | Speaker Information
Tabletop Exhibit Information | Reserve Booth On-line


Message from the General Co-Chairs:

The CICMT Conference is back in Denver after a successful meeting in Munich last year. This event will bring together experts from Asia, Europe, and North and South America to present and discuss the latest advances in ceramic interconnect and ceramic microsystems technologies. Coming from more than 40 different organizations including universities as well as industry and government laboratories, the conference will provide a wide spectrum of interests reflected in the papers throughout 12 sessions. This year’s keynote and international session speakers will focus on multilayer ceramic components and future applications.

In addition to the Microsystems and Ceramic Integration paths, we are delighted to add a Low Temperature Co-fired Ceramic Processing (LTCC) standards session to promote industrial interactions. Tabletop exhibits are available to provide an opportunity to meet suppliers who support our industry. To reserve space, view the exhibits brochure.

We thank our session chairs, the technical co-chairs, Amy Moll (Boise State University), Jens Müller (Technical University Ilmenau), Takaaki Tsurumi (Tokyo Institute of Technology), and the IMAPS staff for their support and leadership in putting this program together.

Do not miss THE ceramic interconnect and ceramic microsystems event in Denver this year.  

The 2010 CICMT is planned for Tokyo and more details will be available in the future.

Michael Lanagan and Jun Akedo
General Co-Chairs


Advance Program
| Register On-Line | Hotel
| Speaker Info | Tabletop Exhibit Information | Reserve Booth On-line



Speaker Dates/Information:

  • Final Manuscripts for Proceedings due: February 20, 2009
  • Early Registration and Hotel Cut-off: March 20, 2009
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)

 


Hotel Reservations

The Curtis
1405 Curtis Street
Denver, CO 80202

Phone Reservations: (800) 525 6651
Online Reservations: www.thecurtis.com (Enter dates on homepage, then on the next screen enter “Rate Code” GRPIMP)

Rates: $199/night standard, $229/night upgraded
Cut off date: Friday, March 20, 2009


 


 


IMAPS-International Microelectronics And Packaging Society
and The Microelectronics Foundation
Everything in electronics between the chip and the system!
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001 | Fax: 202-548-6115 | E-mail: imaps@imaps.org

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