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CICMT

IMAPS/ACerS 11th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2015)

SUBMIT ABSTRACTS | SCHEDULE | REGISTER | SPEAKERS | EXHIBITS

April 20-23, 2015
Fraunhofer Institute Center
Winterbergstrasse 28
01217 Dresden, Germany

Abstract Deadline: November 30, 2014

General Chair:
Alexander Michaelis
Fraunhofer IKTS
Alexander.Michaelis@ikts.fraunhofer.de
General Co-Chair:
Dan Krueger
Honeywell FM&T
dkrueger@kcp.com
Technical Chair:
Minoru Osada
National Institute for Materials Science, Japan
Technical Co-Chair:
Steve Dai
Sandia National Lab., USA


Local Organizing Committee:
Uwe Partsch, Fraunhofer IKTS, Germany
Markus Eberstein, Fraunhofer IKTS, Germany
Jens Müller, Ilmenau University of Technology, Germany
Jörg Töpfer, FHS Jena, Germany
Sebastian Brunner, EPCOS AG, Munich, Germany
Torsten Rabe, Federal Institute for Materials Research and Testing, Berlin, Germany

 


Submit Abstracts On-Line
Registration Details | Hotel Information | Speaker Information
Tabletop Exhibit Information


Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities.

Ceramic Interconnect Track
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities.

Ceramic Microsystems Track
Enabled by the availability of commercial ceramic, metal and embedded passives materials systems, and the rapid prototyping capabilities of the well established multilayer ceramic interconnect technology, three dimensional (3-D) functional ceramic structures are spawning new microsystems applications in MEMS, sensors, microfluidics, bio-devices, microreactors, and metamaterials. These new devices and applications exploit the ability to integrate complex 3D features and active components (e.g., valves, pumps, switches, light pipes, and reaction chambers).

In addition, the Ceramic Microsystems track of the CICMT conference targets new developments in microsystems that include fabricating 3- D micro device structures enhanced with sol-gel, advanced printing and patterning technologies, high temperature materials technologies, and emerging applications like energy harvesting. Many of these innovative applications are taking advantage of the unique ability to integrate the thermal, chemical, mechanical and electrical properties of these multicomponent ceramic-metal systems.

Special Features
• Invited keynote and international presentations on the current status ceramic technology and future system directions.

• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.

Planned Session and Paper Topics Include:

Ceramic Microsystems
Ceramic Interconnect

Markets and Applications
• MEMS Technology and Markets
• Batteries and Fuel Cells
• Biological and Medical
• Chemical and Biochemical
• Photonics
Materials and Properties
• Materials Integration & Nano-materials
• Thermal Management and Reliability
• Piezoelectric Materials

• Optoelectronics
Processing and Manufacturing
• MEMS Manufacturing Technology
• Industrial Automation and Rapid Prototyping
• Nano-technology/Integration
• High Temperature Microsystems
Devices
• Sensors and Actuators
• Micro-reactors
• Fluidic Devices
• Biomolecular and cell transport systems
• Energy Conversion systems
Characterization and Reliability
• Materials and Process Characterization
• Systems Reliability, Lifetime, and Failure Estimation
• Reliability of High-Performance Microsystems
Design, Modeling, and Simulation
• Thermal and Heat Transfer
• Computational Fluid Dynamics


Markets and Applications
• Automotive
• Aerospace
• Lighting/Solar
• Wireless/Communication
• Medical Electronics
Materials and Properties/Functions
• Dielectric and Magnetic Materials
• Embedded and Integrated Passives
• Microwave/mm wave characterization
• Zero-shrink Ceramic Systems
Processing and Manufacturing
• LTCC and Multilayer Ceramics
• Roll to Roll and Continuous Manufacturing
• Direct WRite and Drop on Demand
• Advanced Thick Film Processing
• Fine Structuring Technologies
Devices
• Circuits, antennas, and filters
• Embedded Structures & Components
• Optical Devices and Optoelectronics
Characterization and Reliability
• Characterization of Green Tapes
• Life Testing, Quality Issues
• RF performance
Design, Modeling, and Simulation
• High Frequency Design Software

• Design Rules

Integrated Ceramic Technology
 

Advanced Packaging Technology
• Next Generation Packaging Technologies
• Packaging and Integration in BioMEMS
• Packaging Issues for MEMS Devices
• Technologies for Microsystems Components and Substrates
• Packaging Standard for Microsystems
• Environmental Issues, Lead Free Systems
• Cost Reduction


Abstracts Due: November 30, 2014
Notice of Acceptance: December 11, 2014
Program Published: January 8, 2015
Final Manuscripts Due: February 27, 2015

Please send your 300-500 word abstract electronically, using the on-line submittal form at: www.imaps.org/abstracts.htm. All papers will be presented and published in English. All speakers are required to pay a reduced registration fee.

If you are having problems with the on-line submittal form, please email Brian Schieman bschieman@imaps.org or call 1-412-368-1621 (USA).


Schedule:

Monday, April 20, 2015
(afternoon)
Registration and welcome reception

Tuesday, April 21, 2015 Parallel sessions
IKTS laboratory tour
Poster session and finger food

Wednesday, April 22, 2015 Parallel sessions
Guided city tour
Congress dinner in Dresden's historic city

Thursday, April 23, 2015 Parallel sessions until noon
Lunch & wrap up

Full Program & Details Available : January 8, 2015

 


Registration Information: (Early Registration/Hotel Deadline: March 20, 2015)

Conference fee includes: Entrance to conference sessions and poster presentations; Entrance to the industrial exhibition; Coffee, drinks and fingerfood during the breaks; Small lunches; Welcome reception on April 20, 2015; Fraunhofer IKTS laboratory tour on April 21, 2015; Poster session and finger food on April 21, 2015; and Guided city tour and conference dinner on April 22, 2015 . All prices below are subject to change.

Type
Early Fee
Through 3/20/2015
Advance/Onsite Fee
After 3/20/2015
Member (IMAPS, ACerS, DKG)
550 Euros
650 Euros
Non-Member
650 Euros
750 Euros
Speaker, Chair
450 Euros
450 Euros
Student (valid student card)
200 Euros
200 Euros
Tabletop Exhibit (includes booth & one exhibitor person)
1.300 Euros plus 19 % VAT
Exhibitor Second Person
200 Euros
200 Euros

 

Registration
Registration is possible with the registration form on this website. Please use one form for each participant.

Payment
Payments can be made by transfer to our bank-account or by cheque. Payment by credit card is not possible. Please find all payment details in the invoice, which you will receive within a few days after your registration.

Cancellation
Cancellations can be made written, by letter, fax or email. Until about a week before the event, the cancellation is free of charge. If we receive your cancellation after this deadline a cancellation fee of 50 percent of the total fee will be charged. Alternatively, you may nominate a substitute participant from your company
.


Exhibition Information:

Industrial Exhibition
The Conference is complemented by an industrial exhibition that offers an efficient contact platform and opportunity to learn about the latest developments.

We cordially invite you to participate as an exhibitor at the Conference.

  • Each booth is about 5 square meters in size with a table, a wall poster, a shair and on request a power supply.
  • We publish a brief company profile at this place and in the conference documents.
  • The catering during the breaks and the poster presentation will take place in the exhibition area.
  • The exhibitor fee of 1.300 Euros plus 19 % VAT includes the booth as described and the conference fee for one person.
  • For a second exhibitor person a reduced fee of 200 Euros will be charged.

For organizational issues and exhibition:

Annika Ballin
cicmt2015@ikts.fraunhofer.de
Phone +49 351 2553-7231


Speaker Dates/Information:

  • Abstract Deadline Extended: November 30, 2014
  • Speaker notification: December 11, 2014
  • Program Published: January 8, 2015
  • Final Manuscripts for Proceedings CD-ROM due: February 27, 2015
  • Early Registration Deadline: March 20, 2015
  • Presentation Time: 40 minutes (30 to present; 10 for Q/A)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Poster Presentations will be made on poster boards/easels approximately 3ft x 4ft. Presenters should plan accordingly. Pins/tacks will be provided for the setup. Additional poster details at: http://www.imaps.org/speakers/poster.htm.

Instructions for presenting at the Conference
All accepted abstracts will be published in the conference documents. Please note that travel expenses or registration fees cannot be reimbursed by the conference organizers.

Details for oral presentation
The allocated time to each talk is usually 40 minutes (30 minutes for oral presentation, followed by 10 minutes for discussion). Speakers and session chairs are requested to strictly adhere to this schedule in order to finish sessions on time and to permit participants to move successfully from one parallel session to another. The conference room will be equipped with a computer projection system (LCD projector and PC with Windows, Microsoft Office and Adobe Acrobat Reader). Speakers are required to meet with their session chairpersons in the conference room at least 10 minutes before the beginning of the session. During this time speakers load and check their presentation on the designated computer. For all technical questions a local staff member will be available to help.

Details for poster presentation
Posters should be at most 841 mm (33,11") wide x 1189 mm (46,81") high (DIN A0). There are no further requirements for the poster design. Please hand over your printed poster at the desk during the registration on April 20, 2015. The poster session will take place in the exhibition area of the conference venue. Authors are required to be present at their posters during the breaks in order to discuss their work with other sympoium attendees
.

 

Additional Speaker Information...

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 30 minutes followed by 10 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 30 minutes, followed by 10 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

 


Hotel Reservations (Certain Hotel Deadlines: December 2014 - April 2015)

ACCOMMODATIONS CAN BE REVIEWED AND BOOK ONLINE AT:

http://www.ikts.fraunhofer.de/en/Events/cicmt_2015/accommodation.html

 

 
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  • Honeywell
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  • Micro Systems Technologies
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  • Quik-Pak
  • Specialty Coating Systems
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