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Advance Program
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IMAPS/ACerS International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT)

April 24-27, 2006
Grand Hyatt Hotel
Denver, Colorado USA


Message from the General Chairs...

Under the joint sponsorship of the International Microelectronics And Packaging Society (IMAPS) and the American Ceramic Society (ACerS), the scope of the very successful Ceramic Interconnect Conference has expanded. The 2nd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) combines the complementary interests, strengths, and leadership of the constituencies of both IMAPS and ACerS to focus on and accelerate advances in both ceramic interconnect and ceramic microsystems. Experience shows this conference is THE premier global forum on ceramic interconnect and ceramic microsystems, two of the fastest growing areas of ceramic technology.

We thank our 22 member international advisory board, the Technical Co-Chairs, Michael Lanagan (Penn State University) and Christian Hoffmann (EPCOS) the session organizers/leaders, and the IMAPS and ACerS staff for their support and leadership in putting this program together.

The participation of speakers from more than 70 different organizations across Europe, Asia, North and South America reflect the international scope of this three-day conference. These speakers represent a range of interests from University Research through Manufactures to Users. Three invited keynote speakers will provide comprehensive overviews of current and future directions in key areas, including: Government R&D, Medical Devices and Industrial Uses. Additionally, 88 contributed papers in 14 different sessions including oral presentations and 1:1 interactions will address the latest advances in ceramic interconnect and ceramic microsystems.

Finally, to provide an opportunity for those involved in development and manufacturing to meet suppliers who support the industry, space has been set aside for tabletop exhibits. To facilitate networking, these exhibits will be located in the same room used for the breaks and meals. To reserve space, visit www.cicmt.org or contact Ann Bell (abell@imaps.org), 202-548-8717. Space is limited, so reserve yours as soon as possible.

The 2nd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies has all of the ingredients of a very successful meeting; please join us in Denver, April 24-27, 2006.

Kevin G. Ewsuk and Michael Ehlert
General Co-Chairs

 

 

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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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