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IMAPS - International Microelectronics And Packaging Society
ACerS - American Ceramic Society
IMAPS Germany
DKG - German Ceramics Society

IMAPS/ACerS 4th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2008)

April 21-24, 2008
Holiday Inn - City Centre
Munich, Germany

General Co-Chairs:
Technical Program Co-Chairs:

Christian Hoffman
EPCOS OHG
christian.hoffmann@epcos.com

Michael Lanagan
Penn State University
mlanagan@psu.edu

Andreas Roosen
University of Erlangen - Nuremberg
andreas.roosen@ww.uni.erlangen.de

Amy Moll
Boise State University
amoll@boisestate.edu

Jun Akedo
AIST
akdeo-j@aist.go.jp

Local Organizing Committee :

Markus Blumenberg (DKG), Christian Hoffmann (EPCOS OHG), Jens Müller (TU Ilmenau), Heinz Osterwinter (HS Esslingen),
Andreas Roosen (University of Erlangen-Nuremberg)



Ceramic Technology Tutorials

Two tutorials will be offered by the IMAPS Europe Liaison Committee in conjunction with the conference. The tutorials will be held at the Fraunhofer IZM premises in Munich prior to the conference on Monday, April 21, from 1:00 pm to 5:00 pm.

Download Complete Tutorial Details

Tutorial 1: LTCC for Micro- and Millimetre-Wave Applications
Speakers: Reinhard Kulke, Peter Uhlig (IMST GmbH)

  • LTCC Process
  • 3D-Simulation and Test Methods
  • Applications in Telecommunication and Sensor Electronics

Tutorial 2: Ceramic pressure sensors: From materials to devices
Speakers: Marija Kosec, Darko Belaviè, Marina Santo-Zarnik (Jozef Stefan Institute (JSI) and HIPOT)

  • Piezoresistive, piezoelectric and capacitive pressure sensors
  • Piezoelectric materials
  • Numerical modelling
  • Design and realisation of sensors
  • Benchmarking – different types of sensors

For more information please download the Tutorial Information under www.cicmt.org or contact Paul Collander (President IMAPS Europe), Phone +358 400 608074, e-mail: paul(at)poltronic(dot)fi

Download Complete Tutorial Details

 

 


 


IMAPS-International Microelectronics And Packaging Society
and The Microelectronics Foundation
Everything in electronics between the chip and the system!
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