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Welcome to the IMAPS Asia homepage.

This site is currently under construction and will be available in the coming weeks.

This website will be dedicated to the IMAPS (International Microelectronics And Packaging Society) Chapters throughout Asia. It will contain news, events, committee information, member directories, membership benefits, how to join, call for papers and student resources for each Chapter. Some chapter pages will be listed in their native language.

 

 

 

 

Upcoming Asian Events
International Conference on Electronics Packaging (ICEP) 2008
Tokyo, Japan
6/10/2008 - 6/12/2008
International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT - HDP)
Shanghai, China
7/28/2008 - 7/31/2008
7th International Symposium on Microelectronics and Packaging (ISMP 2008)
Seoul, Korea
10/15/2008 - 10/17/2008
Emerging Microelectronics and Interconnection Technology (EMIT 2008)
Bangalore, India
12/15/2008 - 12/18/2008

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