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IMAPS-Benelux Spring Event 2008
Imaging and Display Packaging Technologies
Thursday, April 10th, 2008
Venue :
IMEC
Kapeldreef 75
B-3001 Leuven
Belgium
9.00 Registration, coffee, exhibition
9.30 Welcome by the chairman
Eric Beyne, IMEC, Leuven, BE
9.40 3D Integrated sensor and imaging Microsystems
Piet De Moor, IMEC, Leuven, BE
10.10 RelacD: A large-Area X-ray camera built from modular micro-systems
Jan Visschers, Nikhef, Amsterdam, NL
10.40 Coffee, exhibition
11.10 CMOS Compatible Through Wafer Interconnects for Imaging Devices
Gereon Vogtmeier, Philips Research Europe, Aachen, DE
12.00 Short wavelength Infrared (SWIR) and uncooled Thermal Infrared image sensors: impact of packaging
Jan Vermeiren, Xenics, Leuven, BE
12.30 Lunch, exhibition
14.00 Low cost high reliability Optical Plastic Packages for automotive and consumer products
Piet De Pauw, Melexis, Tessenderlo, BE
14.30 Die-to-wafer bonding processes for III-V silicon heterogeneous integration
Dries Van Thourhout, IMEC-UGent, BE
15.00 Coffee, exhibition
15.30 Smart optics for industry and medicine
Gleb Vdovin, TU Delft, NL
16.00 Interconnecting Drivers to Flexible Displays
Jonathan Govaerts, IMEC-UGent, BE
16.30 Informal meeting – drinks will be served
16.45 IMAPS Benelux General Assembly meeting
17.15 Closing
IMAPS-Benelux Autumn Event 2007
Latest trends in Electronic Assembly
Thursday, November 8, 2007
TBP Electronics bv
Vlakbodem 10
3247 CP Dirksland
The Netherlands
PROGRAM:
9.00 Registration, coffee, exhibition
9.30 Welcome by the chairman
Nienke Bruinsma, Philips Applied Technologies, NL
9.35 Roadmap assembly technology – trends and challenges
Boris Leekens, TBP Electronics nv, BE
10.00 Packaging technology trends for future circuits – Opportunities of new interconnect types
Bernd Römer, Infineon Technologies AG, DE
10.50 Coffee, exhibition
11.20 Through wafer interconnect technologies for 3D system-in-package
Eric van Grunsven, Philips Applied Technologies, NL
11.45 Fine pitch components and lead free assembly: trends and production issues
Bart Allaert, Connectronics, division of IPTE nv, BE
12.10 Lunch, exhibition, followed by factory tour
13.30 Die and Flip Chip Bonding Equipment for advanced Technologies
Christian Ossmann, Datacon Technology GmbH, AT
14.20 Het omschakelen naar RoHS (loodvrije) productie in het midden - en klein bedrijf.
Gerrit Versteeg, Global Electronics, NL
14.45 Inspection and Metrology for HDI substrates
Pieter Vandewalle, ICOS Vision Systems, BE
15.10 Tea, exhibition
15.30 Combination of experiments and simulations in board level reliability
Hans de Vries, Philips Applied Technologies, NL
15.55 PBA DfX in the RoHS era: Specify the requirements!
Geert Willems, IMEC, BE
16.20 Informal meeting, drinks will be served
17.15 Closing
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