3rd European Advanced Technology Workshop
On Micropackaging and Thermal Management
January 30 & 31, 2008 (Wednesday and Thursday)
MERCURE OCEANIDE VIEUX PORT SUD LA ROCHELLE

Conference Chairman:
Jean-Claude RAMES (MBDA France)

Technical Programme Committee:
Franck ANSORGE (FRAUNHOFER IZM)
Nick CHANDLER (BAE SYSTEMS)
Javier COLETO (TECNALIA AEROSPACE)
Pierre LEWANDOWSKI (SIEMENS VDO)
Xavier de LOGIVIERE (HONEYWELL)
Michel MERMET GUYENNET (ALSTOM)
Gilles POUPON (CEA LETI)
Claude SARNO (THALES AVIONICS)
Dave SAUMS (DS & A LLC)

The workshop sessions will include the following topics and papers are invited in these areas:
�� Cooling solutions for microelectronics packaging
�� Microcooling solutions
�� Heat conductive materials
�� Chip, board and system thermal management
�� Thermal modelisation and simulation
�� Heatsinks, heatpipes and other cooling products
�� Liquid and phase change cooling
�� New cooling solutions
�� Experience return (products and systems cooling, power electronics, automotive, transport,…)
�� Thermal management of opto electronics components.

Speakers should submit a 200-300 words abstract describing their proposed 25 minutes presentation
(20 minutes + 5 minutes for questions) not later than October 26, 2007.

Speakers are required to pay a reduced registration fee (480 €) and are also requested to attend the entire
workshop to maximize opportunities for interaction with registered attendees.

Notification of acceptance to the authors by the Technical Committee: November 26, 2007.
Answer to Florence Vireton by e-mail: imaps.france@imapsfrance.org
by fax: +33 (0) 1 39 02 71 93

TABLE TOP EXHIBITION (limited number first come first serve basis) : 1 table, 2 chairs 1 panel
Presentation of your activity, your last products and results (only for companies in relation with
thermal management)