Basic Packaging Workshop (BPW)
Thursday 4 December 2008

Hosted by:  UNISEM, South Wales - NP11  3XT
Device packaging is now the cornerstone of the industry and is a key skill now needed by managers, engineers and technicians in the electronics chip design, development and manufacturing market as well as University academics and Institute professionals.

An Opportunity to gain knowledge and understanding about the basic technology holding Electronic systems together. A day workshop will cover the 4 main topics of:

• Package trends and technologies including a Market briefing and an insight into Package technology trends and developments.
• Mounting Die including work on Die prep and Epoxy / Eutectic materials and processes.  
• Die Interconnection, covering the Ins & outs of wirebonding, Flip chip and die stacking. 
• Test verification & Reliability looking at pull/Shear test equipment and general Package testing.

There will also be the opportunity to see High Tech Packaging in action with a Factory - Window Tour of the UNISEM facility.

Prices: Students £15.00 + vat, IMAPS-UK & NMI members £25.00 + vat, Others £35 + vat

Programme

9.00 am – Registration
9.30 – 10.30 Session 1 - Package trends and technologies
            a) Market briefing – Andy Longford, PandA Europe
            b) Package technology trends and developments.  -  UNISEM
11.00 – 12.00 Session 2 - Mounting Die
            a) Die prep – John Sweet,  LOADPOINT
            b) Epoxy / Eutectic materials and processes. – Mark Currie, HENKEL
12.00 – 12.30 Factory Tour
Lunch break
1.30 – 2.30 Session 3 - Die Interconnection
            a) Ins & outs of wirebonding – Hugh de Lacy, TS2 Micro
            b) Flip chip and die stacking. – TWI
3.00 – 4.00 Session 4 - Test verification & Reliability
            a) pull/Shear test equipment -  Dr Stephen Clark, DAGE
            b) Package testing. – Iain Gardiner, WAFERDATA
Close  

To book for this event please complete the booking form and return to the IMAPS-UK Secretariat fax +44 1522 575212 e-mail imapsuk@aol.com

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10th - 11th June 2008
MicroTech 2008 Moves to Larger Venue!

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Includes Tabletop Exhibition, Conference Dinner
Hellidon Lakes - Daventry, Northamptonshire

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NEC - Birmingham