Exhibitors – Contact Adrian Black at 310-813-3352, Fax 310-814-7777 or email  adrian.black@ngc.com

TECHNICAL PROGRAM
	SESSION 1		SESSION 2
	Advanced Electronics Packaging Technology Chair - James C. Weiler, Northrop Grumman, CA Co-Chair - Salim Akbany, Northrop Grumman, CA		Advanced Electronic Materials, Components & Processes Chair - Farman Mesdaghi, Northrop Grumman, CA Co-Chair - Phil Zulueta, JPL, CA
Exhibits Area is Open All Day
9:00AM-9:40AM	T1A1	Thin Film Technology using Nichrome Chuck Nelson, BI Technologies, CA	T2A1	SAE G-19 Counterfeit Electronic Components Committee – Standards Development Progress Phil Zulueta, JPL, CA
Exhibits Area & Refreshments 9:40PM-10:00PM
10:00AM-10:40AM	T1A2	Comparison of Thermal Cycle Test Data for a High I/O PBGA Assembled with Pb-free/Tin-lead Solder per IPC 9701A Reza Ghaffarian, JPL, CA	T2A2	Solar Unmanned Aerial Vehicle (UAV) Brian Shedd, UCLA, CA
Exhibits Area & Refreshments 10:40PM-11:00PM
11:00AM-11:40AM	T1A3	Determining the Effects of Package Parasitics on SI and EMC Performance Doug Smith, D C Smith Consultants, CA	T2A3	A Study of the Principle of Advanced Energy-Saving Furnaces Ken Kuang, Torrey Hills Technologies, CA
Exhibirs Area with Lunch 12:00PM-1:00PM
1:00PM-1:40PM	T1P1	Evaluation of Direct FET® Flip Chip Packaging Technology For Extreme Environments Martin Burmeister, Stellar Microelectronics, CA	T2P1	Innovative Diode Product to Support Today's Space Industry Aram Arzumanyan,Dan C. Tulbure, SSDI, CA
Exhibits Area & Refreshments 1:40PM-2:00PM
2:00PM-2:40PM	T1P2	Reducing the Risk of Contamination from Silicone Materials Thomas Mayer, Nusil Technology, CA	T2P2	Increasing the Efficiency Levels of Photovoltaic and PCB Designs Utilizing Carbon Composite Technology Kris Vasoya, Stablcore, CA
Exhibits Area & Refreshments 2:40PM-3:00PM
3:00PM-3:40PM	T1P3	Flexible Embedded Active Assemblies Linda Del Castillo, JPL, CA	T2P3	Woodwinds and Microwaves Charles Jackson, Northrop Grumman, CA
Exhibits Area & Refreshments 3:40PM-Closure