Tabletop Exhibits Available

List of Confirmed Exhibitors
 

SEMICONDUCTOR EQUIP CORP                       SABERITEC

CRANE ELECTRONICS                                         ASTRON

CALMONT WIRE AND CABLE                            MICROPAC INDUSTRIES

SOLID STATE DEVICES                                        ANTARES ADVANCED TEST

INTERNATIONAL RECTIFIER                            F&K DELVOTEC

GEL-PAK                                                                   ADVANCED PACKAGING

INTERCONNECT SYSTEMS                                 NPOS TECHNOLOGIES

RMV TECHNOLOGY                                              AZIMUTH ELECTRONICS

SIKAMA INTERNATIONAL                                 TELEDYNE MICROELECTRONICS

AMETEK HCC INDUSTRIES                                HERAEUS

MINCO                                                                      Q-TECH

ORTHODYNE                                                           SONIX

SEMICONDUCTOR EQUIPMENT

v     A Study of the Principle of Advanced Energy-Saving Furnaces

v     SAE G-19 Counterfeit Electronic Components Committee – Standards Development Progress

v     Solar Unmanned Aerial Vehicle (UAV)

v     Thin Film technology using Nichrome

v     Evaluation of Direct FET® Flip Chip Packaging Technology For Extreme Environments

v     Comparison of Thermal Cycle Test Data for a High I/O PBGA Assembled with Pb-free/Tin-lead Solder per IPC 9701A

v     Determining the Effects of Package Parasitics on SI and EMC Performance

v     Woodwinds and Microwaves

v     Reducing the Risk of Contamination from Silicone Materials

v     Flexible Embedded Active Assemblies