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The Arizona Chapter serves the IMAPS members residing in Arizona and New Mexico. The IMAPSArizona Chapter promotes and cultivates a local forum for the exchange of technical information and industry solutions relating to microelectronics to help our members and their companies better compete in today’s global economy. The chapter holds technical meetings, plant tours, and networking social events throughout the year.
Previous Meeting:
IMAPS AZ Chapter held a Special Half Day Luncheon and Workshop on "Copper Wirebonding Industry Scan: From the Wire to the Product" on Thursday, May 12, 2011 at the Dobson Ranch Inn in Mesa AZ
Abstract:
IMAPS AZ chapter invites you to attend our afternoon workshop on Cu wire bonding technology. We will have several companies from across the supply chain discussing various aspects of Copper wire bonding technology.
Agenda:
- 12-1pm Keynote Speaker: Linda Matthews, TechSearch Int'l
- 1-1:30pm OEM Viewpoint: Speaker TBD
- 1:30-2pm OSAT Viewpoint: Tony Panczak, Amkor Technology
- 2-2:30pm Ball Bond Equipment: Leroy Christie, ASM Pacific
- 2:30-3pm Wedge Bond Equipment: Lee Levine and Joseph Bubel, Hesse & Knipps
- 3-3:30pm Wire Material: Dr. Murali, Heraeus
- 3:30-4pm Panel Discussion and Wrap up
Linda Matthew, TechSearch International
"Copper Wire Bond Developments" Presentation
Abstract
Copper wire bond is a hot topic. This presentation covers all the new developments, including growth in the use of copper, wire types, reliability, capillaries and lifetime/MTBA.
Bio
Linda Matthew is a senior analyst at TechSearch International. She has over 20 years of experience in the electronics packaging industry, including both marketing and engineering positions.
Lee Levine, Hesse & Knipps
Abstract
Room temperature copper wire wedge bonding is in development. The results of some designed experiments and work that is required to achieve product capability will be discussed.
Bio
Lee Levine was principal staff metallurgist at K&S for 20 years. He presently operates his own company, Process Solutions Consulting Inc (www.processsolutionsconsulting.com) where he offers process consulting, SEM, EDS and Failure Analysis, Design of Experiments and Wire Bonding Training to the semiconductor industry. He is a former VP Technology of IMAPS and is a Fellow and J.P Wagnon Award recipient of the society. He is a Sr. member of IEEE and a sustaining member of ASM. He has published over 70 papers and currently is a Contributing Editor for Test and Packaging Times, an online newsletter where he writes a column “Levine on Bonding”.
Dr. Murali, Heraeus Materials
Abstract
High purity fine metal wires made of gold (Au), copper (Cu) and aluminum (Al) are widely used in microelectronics packaging industries for interconnections in integrated circuits. On a global scale, Cu wire has gained momentum in demand for existing and future applications due to the increasing price of gold, and it drives the semiconductor industry in considering this wire material for low cost initiatives. The commercially available 4N (99.99%) purity Cu rods are drawn and annealed with stringent criteria to suit for wire bonding application. Wires of other purity such as 3N, 5N and 6N are being studied but not reached to the stage of mass production for wire bonding purpose. Measured electrical resistivity and predicted inductance of Cu wire are 1.7µW.cm and 12-13nH, respectively. Fusing current of varying wire diameter and wire length are reported. Cu is prone for oxidation, unlike Au, which is inert. A good wire bonding is achieved normally for <35Ĺ surface oxide (Cu2O) layer thickness. Bonded wire microstructure, hardness and grain structure of free air ball (FAB) of 4N Cu wire are reported. Shelf life, floor life, tensile properties, bondability, reliability and future development of Cu wire are discussed.
Bio
Dr. Murali received his PhD in Metallurgical Engineering from Indian Institute of Science (IISc), 1994. He was commended with Best Doctorate Thesis Award, 1995, IISc, and The Outstanding Young Metallurgist Award, 1996, Ministry of Mines, Government of India and Indian Institute of Metals. He is a Fellow of International Biographical Association, Cambridge. Dr. Murali has published/presented more than 75 papers in International Journals/Conferences and National Seminars. He is currently a Principal Research Engineer at Heraeus Materials, Singapore. He has 20 years of research experience in industry and academia.
Registration and exhibits will open at 11:00am - Lunch will be served at noon - Exhibits close at 4:30pm. Luncheon and presentations - $25.00 in advance for members / $30.00 in advance for non-members / $35 at door.
- 6ft Tabletop for your display
- Company promotion via links from our invitations and the AZ Chapter website to your company website
- Lunch for one attendee
Exhibitors for May Luncheon Were:
IMAPS Press Release:
IMAPS Honors IC Insights with a GBC Partnership Award
Washington, DC – February 15, 2011 - The International Microelectronics And Packaging Society (IMAPS) announced that IC Insights will receive a new award from IMAPS Global Business Council named the GBC Partnership Award. The GBC Partnership Award recognizes corporations that invest their time and talent in helping IMAPS execute on the society’s mission ‘to lead the Microelectronics Packaging, Interconnect and Assembly Community, providing means of communicating, educating, and interacting at a global level for the business issues the industry faces.’ The award will be presented Thursday, February 17th to Bill McClean, President of IC Insights following his talk on “Reasons for Optimism in 2011” at the IMAPS Arizona Chapter luncheon held in 
“IC Insights has delivered timely keynote addresses at our first quarter Global Business Council and AZ Chapter meetings the past two years. Their ability to communicate key industry trends and provide accurate semiconductor market forecasts during this period of volatility has helped our members better understand the diverse semiconductor market and business cycles. We feel our GBC attendees will get great insight from their luncheon keynote on March 7th that helps bridge a very strong program on the eras of 3D and energy efficiency.” stated Lee Smith of Amkor who serves as VP of Marketing and Membership for IMAPS along with his role as the GBC 3D packaging co-chair.
“The IMAPS events have allowed IC Insights to communicate our outlook and hear the growth perspective’s from decision makers across the semiconductor supply chain. Confidence established in the first and second quarters, was a key reason the industry was able to respond quickly to the strong rebound in the second half of 2009 and carry that through the first three quarters of 2010 to give us a boom year that met our aggressive expectations. So it is an honor to be recognized and invited to continue participating in these important IMAPS events.” noted Bill McClean.
Note: Monday March 7th, Brian Matas VP of Market Research at IC Insights will deliver the keynote address at the Global Business Council’s Spring 2011 event held at the Radisson Fort McDowell Resort in
About IMAPS - The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the
About IC Insights, Inc. - IC Insights, Inc. is a leading semiconductor market research company headquartered in
AZ Student Chapter at Arizona State University (ASU):
Are you an engineering student and want to become more involved in the future of microelectronics? The Arizona Chapter of IMAPS has its very own student chapter located at Arizona State University. Being a student member, you receive benefits such as reduced dues, publishing and speaking opportunities, online access to many industry resources, discounts to IMAPS events and much more.
Please contact IMAPS ASU Student Chapter Advisors Professors Patrick Phelan (phelan@asu.edu) and Amaneh Tasooji (amaneh@cox.net) or James Wang, IMAPS Membership Officer (james.wang@powergoldconsultant.com) for additional information and on how to become a new student member.