Central Texas

Chapter

Region: 

Central Texas (Austin, Texas and vicinity)

Central Texas Electronics Association (CTEA) is the Austin-based Central Texas chapter of the SMTA and IMAPS organized to provide regional opportunities to share electronics manufacturing information and networking. 

Electronics Design & Manufacturing Symposium

Tuesday, May 11, 2010

Flextronics at 12455 Research Boulevard in NW Austin

Program:

3:00  -  Registration Begins

3:30  -  Welcome and Introductions

3:35  -  "Flextronics Facility Video Tour,"  David Mendez, Flextronics

4:35  -  Break & Networking

4:50  -  "Challenges Associated With Conversion to No-clean Process from Water Clean Process

               for High Reliability Circuit Boards,"  Gordon O’Hara, Flextronics

5:20  -  "Nanotechnology for Electronics and Packaging Applications," 

              Richard Fink, Applied Nanotech

5:50  -  Closing Remarks

6:00  -  Food & Refreshments Served and More Networking

Registration:

RSVP to Bob Baker at:  rjbakeratx@austin.rr.com

There is no charge for SMTA and IMAPS members;  $10 for all non-members

Event Location:

Flextronics at 12455 Research Boulevard in NW Austin

Exit US-183 at Oak Knoll and turn right onto Riata Trace Parkway

Main entrance is left turn off Riata Trace Parkway (Visitor parking in front of Lobby)

See Map at:   http://local.yahoo.com/info-19425416-flextronics-international-austin

In Central Texas, SMTA and IMAPS work together as the Central Texas Electronics Association (CTEA)

Previous Meeting information:
***************************************************************************************************************************
1st Technical Symposium held on September 15th, 2003.  Five Speakers:
KEYNOTE ADDRESS given by Jan Vardaman of TechSearch International on "Trends in Advanced and Multi-Die Packaging."
-"Considerations for Wafer Level and Chip Scale Micro and Nano Packaging of Integrated Systems" by Dr. Ajay P. Malshe of the University of Arkansas.
-"Trends in RF Packaging" by Greg Caswell of Silicon Hills Design.
-"Flexible and Multilayer Interconnect Technologies" by Dr. Al Viebeck of 3M.
-"Lead-Free Solder: Some Experimental Observations" by Dr. Glenn Masada of the University of Texas.
***************************************************************************************************************************
2nd Technical Symposium held on January 19th, 2004.  Five Speakers:
KEYNOTE ADDRESS given by Dave Carey of Portelligent on the "Overview of Electronics Packaging in Current Handheld Systems."
-"Industry Pb-Free Solder Implementation Status" by Dr. Randy Scheuller of Dell, Inc.
-"Assembly and Test Issues in Stacked Die and Stacked Packages" by Larry Gilg of Die Products Consortium.
-"Effect of Packaging on the Reliability of Copper/low-k Interconnects" by Dr. Paul Ho of the University of Texas at Austin.
-"Direct Contact Wafer Level Burn-in Technology" by John Pitts of Motorola Semiconductor.
***************************************************************************************************************************
3rd Technical Symposium held on May 17th, 2004.  Four Speakers:
KEYNOTE ADDRESS given by Mary McDonald of ISO/QS, Inc. on the "RoHS and WEEE [Restriction on Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE)] - Impact on the Electronic Industry"
-"SMT Yield Improvement on a 2755 Pin Count BGA" by David Mendez of Solectron.
-"Signal Propagation without Distortion in Dispersive Lossy Interconnect" (Includes Demonstration) by Dr. Robert Flake of the University of Texas at Austin.
-"Decoupling High Speed Digital Electronics with Embedded Capacitors" by Bill Balliette of 3M.
***************************************************************************************************************************
4th Technical Symposium held on September 13th, 2004.  Five Speakers:
-"Smart Card Product and Manufacturing Challenges for Government ID Badges" by Neville Pattinson of Axalto.
-"Suppression Device and Test Method for RF System Level ESD Compliance" by Karen Shrier of Electronic Polymers.
-"Reliability Impact of Substrate and Bump Selection for a FC BGA Package" by Thomas Koschmieder of Freescale Semiconductor.
-"Ensuring Reliability in Emerging Technologies: RF-MEMS" by Greg Flynn & Thomas Fowler of Teravicta.
-"QFN from a Tier Three Manufacturing, Test and Failure Analysis Perspective" by Dan Bogard of Sigmatel.
***************************************************************************************************************************
Holiday Social Meeting held on December 6th, 2004.  Announcements of new officers for 2005.  Attendance of 14 for networking, happy hour and Monday Night Football on large screen at Cool River Cafe, 4001 Parmer Lane in Austin, TX.
***************************************************************************************************************************
1st Quarterly Technical Symposium held on March 24th, 2005.  Five Speakers - Wireless Program:
-"Packaging Issues in Next-Generation Wireless LAN Technologies" by Patrick Kelly - VP Silicon - Bandspeed.
-"ZigBee: Wireless Made Simple" by Matt Maupin - Product Marketing Manager - Freescale Semiconductor.
-"Multimodal Wireless Communications for Mobility" by Dwayne Lum - Director New Product Marketing - Xplore Technologies
-"Advanced RF Packaging" by Amkor
-"The SBIR Program: Seed Funding for Innovators" by Fred Patterson - President - SBIR Coach
***************************************************************************************************************************
2nd Quarterly Technical Symposium held on June 6th, 2005. Six Speakers - Thermal/Reliability/Failure Analysis Program
-KEYNOTE ADDRESS "Assembly Trends for Advanced Packages" by Jan Vardaman - TechSearch
-"Thin Array Plastic Package (TAPP): High Density Leadless Packaging" by Leo Higgins - ASAT
-"Overcoming Pb-Free Assembly Challenges - Real World Experiences" by Randy Schueller - Dell
-"An Overview of Surface And Micro Analysis Techniques" by Scott Baumann - Evans, Texas
-"Tools and Equipment to Perform Rigorous Mechanical and Environmental Stress Testing for Enhanced Product Reliability" by Mark Ganninger  - Design and Assembly Concepts Inc
-"Physical Failure Analysis of Electronic Assemblies" by Stephen Schoppe - Process Sciences
***************************************************************************************************************************
3rd Quarterly Technical Symposium - September 19th, 2005 Five Speakers - Emerging Technologies Program EMERGING TECHNOLOGIES
-"Printed Electronics: Costs, A Silicon Challenge?" – Larry Evans – President -Evans Associates, Ltd.
-"Data Acquisition for Statistical Quality Processes" – Jim Havener – Chief Operating Officer– Network I/O

 LEAD FREE TRANSITION

“An Overview of Lead Free Solder Pastes" – Tim Jensen – Senior Technical Support Engineer - Indium Corporation
- "Growth Mechanisms and Mitigation Techniques for Whisker Formation in Pure Sn Lead Finishes".  Dr. Peng Su  - Package Development - Freescale Semiconductor
-"Solectron 'Lead Free' update" - Neal Klubak - NPI Engineering Manager - Solectron
***************************************************************************************************************************
Holiday Social Meeting held on December 2005.  Announcements of new officers for 2006. 
***************************************************************************************************************************
1st Quarterly Technical Symposium - March 27th, 2006 - Five Speakers - Lead Free Electronics Stampede Program
-"Complying with RoHS: Registering Your Hazardous Substance Process Management System" presented by Mary McDonald (MCG) and along with Doug Galle (Sigmatel).
-"RoHS Compliance in PCB Fabrication" presented by Greg Smith (Dynamic & Proto Circuits)
-"Fine-Pitch, Lead-Free Wafer Bumping Using C4NP Technology" presented by Mr Abbott (IBM) with Klaus Ruhmer (Suss Microtec) in a joint process with IBM's ownership of the technology.
-"Lead Free Solder Assembly for Mixed Technology Boards" presented by Karl Seelig (AIM).
-"Review of Industry Status of Tin Whiskering of Matte Tin Finishes" presented by Leo Higgins (ASAT).
Meeting Sponsors and Table-top Exhibitors:  ASI, Dynamic & Proto Circuits, Premier Services, The ISP Group, Torenko Associates
****************************************************************************************************************************
2nd Quarterly Technical Symposium - June 19th, 2006 - Four Speakers
-KEYNOTE PRESENTATION: "Packaging Techniques in Current Generation Portable Products" presented by Portelligent
-"Electromigration in Pb-Free Solder Joints in Plastic Flip-Chip Packages" presented by Seung-Hyun Chae (University of Texas)
-"Using Thermally Conductive Tape for Heat Sink Attachment" presented by Dr Mike de Sorgo (TIMsultants)
-"Measurement and Simulation of the Thermal Resistances of Stacked Die" presented by Dr Bennett Joiner (Freescale)
****************************************************************************************************************************
October 2006 1st Annual Vendor Show & Technical Program

Keynote Presentation: "Economic Trends in the Electronics Industry",  Keith Robinson, Frost and Sullivan

"Advanced Semiconductor Packaging", Robert Darveaux, Amkor

"Lessons From the RoHS Transition", Randy Shueller, Dell

The Lead-free Reflow Process from Material Selection to Reducing Defects,  Peter Biocca, Kester

Wednesday, May 30, 2007

"Solderability of Packages and PCB Surface Finishes in a Lead-Free World", Dr. Bev Christian, Research in Motion
"Hermetic Chip Scale RF MEMS Packaging", TeraVicta Technologies
******************************************************************************************************************

November 9, 2007
"RoHS and WEEE and What It All Means for PCB Design, Fabrication and Assembly" Gil White, DDi Global
"Drivers and Trends in Advanced Packaging Technology" Jan Vardaman, TechSearch International
"SMT Assembly Challenges with Large Telecom PCBAs Including Pb-Free, 0201s and >50 mm BGAs" David Mendez, Solectron Corporation (Texas)

*************************************************************************************************************

April 7,2008 

"The Future of Electronics Manufacturing", Jim Raby, STI Electronics

"Strain Gauge Testing and Analysis for BGA Devices", Swapnil Padhye and Adam Gage, National Instruments

"Pb-free BGA Component Reliability: A Comparison of SAC405 Versus Sn-3.5Ag Solder Ball Alloys", Daniel Cavasin, AMD 4:50 - 5:20 PM - "Reflow Processes and PCB Design for Lead-Free and 0201 Discretes", Curtis Hart, Silicon Hills Design  

**************************************************************************************************************

October 1, 2008  Vendor Show and Technical Program

"X-Ray Inspection for Electronics Quality and Reliability" Glenn Robertson of Process Sciences

"High-Density Packaging Trends in Portable Electronics"   David Carey of Portelligent

"Electronics Reliability Prediction Using the Product Bill of Materials"  Cheryl Tulkoff and Jim Lance of National Instruments

"Thin Film Photovoltaic Technology and Solar Cell Module Design" Bert Haskell of HelioVolt

Followed by a door64.com Networking Event sponsored by Central Texas Electronics Association

**************************************************************************************************************

February 3, 2009   Technical Program

"Microelectronic Applications of Advanced Automatic Optical Inspection (AOI)",  Camtek

"Overcoming Challenges in Thermally Enhanced BGA Packaging with Low-k Silicon"  Dr. Chu-Chung (Stephen) Lee (Freescale Semiconductor)

"Filler Dispersion in Epoxy Mold Compound and Its Effect on the Reliability of Cu/Low-k Devices in Plastic Ball Grid Array Packages," Dr. Min Ding (Freescale Semiconductor)

***************************************************************************************************************

May 12,2009 Technical Program:

"Seven Ways to Profile to Profitability", Brian O'Leary

Brian gave a book to the first 30 people in the door (limit two per company).

KIC "Design for Recyclability", Craig Boswell, Hobi International

"Preparing Yourself for the Job Search", Pat Goodwin, Pat Goodwin Assoc

"Detecting Counterfeit Electronic Components", Stephen Schoppe, Process

****************************************************************************************************************

October 22, 2009 Technical Program

Cheryl Tulkoff of DfR Solutions: " Manufacturing and Reliability Challenges With QFN "

Kim-Marie Vo of Freescale Semiconductor:  "Intellectual Property Law: What Non-Attorneys Should Know "

Ray Prasad of Ray Prasad Consultancy Group:  "Troubleshooting SMT Yield Problems in a Tin-Lead and Lead Free World "

Dr. Dan Baldwin of Engent: "New and Emerging Technologies in Electronics"

Presentations from the October Symposium and Vendor Show are available at <http://www.smta.org/chapters/chapters_detail.cfm?chapter_id=35>

***************************************************************************************************************************
2010 Planning meeting held in December 2009.  Organization overview, 2010 planning session, announcements of new officers for 2010. 
***************************************************************************************************************************

****************************************************************************************************************

Febuary 16, 2010 Technical Program

"Trends and Technologies in 3D Packaging and Integration", Jan Vardaman, TechSearch International"

"Customer Value and Plant Performance, The Impact of Implementing Traceability", Tommy Fox, Optimal Electronics Corp.

"Cleaning Flux Residues under Low Profile Components", Rich Brooks, Kyzen Corp.

"Avoiding Some Common Soldering and Package Failure Modes in Electronic Assemblies", Andrew Mawer, Freescale Semiconductor

 ******************************************************************************************************************

________________________________________________________________________________________________________________

Chapter Officers

Central Texas Electronics Association (CTEA)

Local Chapter of IMAPS (www.imaps.org) and SMTA (www.smta.org)

President: Keith Vanderlee, TDK Magnecomp (512) 345-0284, kvanderlee@magnecomp.com
Vice-President: Shean Dalton (512) 535-0629 shean@fhpreps.com

Treasurer: Bob Baker, Consultant, 512-345-1025 , rjbakeratx@austin.rr.com

Secretary: Bennett Joiner, Freescale Semiconductor, (512) 996-5739, bennett.joiner@freescale.com

VP Technical Programs: Andrew Mawer, Freescale, (512) 895-7925, Andrew.Mawer@Freescale.com

Asst. VP Technical Programs: Leo Higgins, Freescale, (512) 895-2564, Leo.Higgins@freescale.com

Asst. VP Technical Programs:  Rich Brooks, KYZEN, (615) 983-4601  rich_brooks@kyzen.com

VP Membership: Keith Vanderlee, TDK Magnecomp (512) 345-0284, kvanderlee@magnecomp.com

Vendor Show Chair: Keith Vanderlee, TDK Magnecomp (512) 345-0284, kvanderlee@magnecomp.com

SMTA National Rep: Keith Vanderlee, TDK Magnecomp (512) 345-0284, kvanderlee@magnecomp.com

IMAPS National Rep:  Shean Dalton, (512) 535-0629, shean@fhpreps.com

Chapter Web Sites:

IMAPS: http://www.imaps.org/chapters/centraltexas/index.htm

SMTA: http://www.smta.org/chapters/chapters_detail.cfm?chapter_id=35

updated 05/01/10 by Shean Dalton