The Central Texas Chapter of IMAPS represents members hailing from Austin and surrounding communities, including Houston.. This chapter meets at least twice per year for full-day electronics design, manufacturing and test symposia as part of the Central Texas Electronics Association.
The Central Texas Chapter always welcomes interested speakers and company hosts for upcoming meetings. Contact Chapter President Kevin Hess to express interest in:
- Speaking at a chapter event
- Hosting a chapter event at your facility
- Sponsoring a chapter meeting or webinar
- Joining IMAPS
Upcoming 2018 Chapter Events
Save the date! Each event will be activated with a registration link when more details become available. Click here to view all upcoming IMAPS events.
3:00 - Registration Begins
3:30 - Welcome and Introductions
3:35 - " 3D Printing: Current Status and Application Areas ”
Dr. David Bourell, Professor, UT-Austin
4:05 - " Chip Security Vulnerability: How to Close Gap Between Design Software & Hardware ”
Keith Guidry, CTO, Sawblade Ventures
4:35 - Break for Networking
4:50 - " High-Performance Computing (HPC), Machine Learning, & Other Engineering Problems ”
Dr. Damian Valles, Assistant Professor, Texas State University
5:20 - " DLP (Digital Light Processing) Light Engines That Cure 3D Printed Polymers ”
Jorge Moguel, Executive VP, TyRex-Digital Light Innovations
5:50 - Door Prizes Drawing & Closing Remarks
6:00 - Food & Refreshments Served and More Networking
RSVP to Bob Baker at: email@example.com
No charge for SMTA & IMAPS members; $10 for all non-members >> (Cash or Check ONLY!)
Students can also attend for FREE!
Flex, Welcome Center, 12455 Research Park Loop in NW Austin
Enter site via Riata Trace Pkwy or Oak Knoll Dr off Research Blvd (US-183)
See Map at: (Map to Flex)
In Central Texas, SMTA and IMAPS work together as the Central Texas Electronics Association (CTEA)
The Central Texas Chapter of IMAPS in conjunction with SMTA had a very interesting meeting August 24 at TyRex Group. The meeting included a factory tour of three of the business groups that are part of TyRex. One the tours was focused on the 3-D printing business. In addition to the tour, there was a presentation: "Understanding the 3D Printing Ecosystem," by Martin Johnson, Business Development Vice President. The other three presentations were: "Scaling Effect of Through-Silicon Via (TSV) on Stress & Reliability for 3D Interconnects" by Laura Spinella, PhD, UT-Austin Microelectronics Research Center, "Silicon Photonics Prototyping” by Dr. Swapnajit Chakravarty, Sr Research Scientist, Omega Optics, and "CT Teardown of the New Samsung S8+ Smart Phone" by Dr. Bill Cardoso, President, Creative Electron.
Left Image:Factory tour of the 3-D printing facility.
Right Image: Presentation by Laura Spinella on Through-Silicon Vias