Central Texas

Chapter

Region:

Central Texas (Austin, Texas and vicinity)

Future Meeting Information

Central Texas Electronics Association (CTEA) is the Austin-based Central Texas chapter of the SMTA and IMAPS organized to provide regional opportunities to share electronics manufacturing information and networking.

Our October 1, 2008 technical conference and vendor show was extremely successful. The titles of the technical presentations are given below.

Next Meeting is scheduled for Tuesday, January 27, 2009. Please contact Andrew Mawer if you have a presentation that you would like to suggest. If you have given a paper at a national conference recently, I am sure that we would enjoy seeing it.

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Previous Meeting information:
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1st Technical Symposium held on September 15th, 2003.  Five Speakers:
KEYNOTE ADDRESS given by Jan Vardaman of TechSearch International on "Trends in Advanced and Multi-Die Packaging."
-"Considerations for Wafer Level and Chip Scale Micro and Nano Packaging of Integrated Systems" by Dr. Ajay P. Malshe of the University of Arkansas.
-"Trends in RF Packaging" by Greg Caswell of Silicon Hills Design.
-"Flexible and Multilayer Interconnect Technologies" by Dr. Al Viebeck of 3M.
-"Lead-Free Solder: Some Experimental Observations" by Dr. Glenn Masada of the University of Texas.
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2nd Technical Symposium held on January 19th, 2004.  Five Speakers:
KEYNOTE ADDRESS given by Dave Carey of Portelligent on the "Overview of Electronics Packaging in Current Handheld Systems."
-"Industry Pb-Free Solder Implementation Status" by Dr. Randy Scheuller of Dell, Inc.
-"Assembly and Test Issues in Stacked Die and Stacked Packages" by Larry Gilg of Die Products Consortium.
-"Effect of Packaging on the Reliability of Copper/low-k Interconnects" by Dr. Paul Ho of the University of Texas at Austin.
-"Direct Contact Wafer Level Burn-in Technology" by John Pitts of Motorola Semiconductor.
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3rd Technical Symposium held on May 17th, 2004.  Four Speakers:
KEYNOTE ADDRESS given by Mary McDonald of ISO/QS, Inc. on the "RoHS and WEEE [Restriction on Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE)] - Impact on the Electronic Industry"
-"SMT Yield Improvement on a 2755 Pin Count BGA" by David Mendez of Solectron.
-"Signal Propagation without Distortion in Dispersive Lossy Interconnect" (Includes Demonstration) by Dr. Robert Flake of the University of Texas at Austin.
-"Decoupling High Speed Digital Electronics with Embedded Capacitors" by Bill Balliette of 3M.
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4th Technical Symposium held on September 13th, 2004.  Five Speakers:
-"Smart Card Product and Manufacturing Challenges for Government ID Badges" by Neville Pattinson of Axalto.
-"Suppression Device and Test Method for RF System Level ESD Compliance" by Karen Shrier of Electronic Polymers.
-"Reliability Impact of Substrate and Bump Selection for a FC BGA Package" by Thomas Koschmieder of Freescale Semiconductor.
-"Ensuring Reliability in Emerging Technologies: RF-MEMS" by Greg Flynn & Thomas Fowler of Teravicta.
-"QFN from a Tier Three Manufacturing, Test and Failure Analysis Perspective" by Dan Bogard of Sigmatel.
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Holiday Social Meeting held on December 6th, 2004.  Announcements of new officers for 2005.  Attendance of 14 for networking, happy hour and Monday Night Football on large screen at Cool River Cafe, 4001 Parmer Lane in Austin, TX.
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1st Quarterly Technical Symposium held on March 24th, 2005.  Five Speakers - Wireless Program:
-"Packaging Issues in Next-Generation Wireless LAN Technologies" by Patrick Kelly - VP Silicon - Bandspeed.
-"ZigBee: Wireless Made Simple" by Matt Maupin - Product Marketing Manager - Freescale Semiconductor.
-"Multimodal Wireless Communications for Mobility" by Dwayne Lum - Director New Product Marketing - Xplore Technologies
-"Advanced RF Packaging" by Amkor
-"The SBIR Program: Seed Funding for Innovators" by Fred Patterson - President - SBIR Coach
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2nd Quarterly Technical Symposium held on June 6th, 2005. Six Speakers - Thermal/Reliability/Failure Analysis Program
-KEYNOTE ADDRESS "Assembly Trends for Advanced Packages" by Jan Vardaman - TechSearch
-"Thin Array Plastic Package (TAPP): High Density Leadless Packaging" by Leo Higgins - ASAT
-"Overcoming Pb-Free Assembly Challenges - Real World Experiences" by Randy Schueller - Dell
-"An Overview of Surface And Micro Analysis Techniques" by Scott Baumann - Evans, Texas
-"Tools and Equipment to Perform Rigorous Mechanical and Environmental Stress Testing for Enhanced Product Reliability" by Mark Ganninger  - Design and Assembly Concepts Inc
-"Physical Failure Analysis of Electronic Assemblies" by Stephen Schoppe - Process Sciences
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3rd Quarterly Technical Symposium - September 19th, 2005 Five Speakers - Emerging Technologies Program

EMERGING TECHNOLOGIES
-"Printed Electronics: Costs, A Silicon Challenge?" – Larry Evans – President -Evans Associates, Ltd.
-"Data Acquisition for Statistical Quality Processes" – Jim Havener – Chief Operating Officer– Network I/O

 LEAD FREE TRANSITION

“An Overview of Lead Free Solder Pastes" – Tim Jensen – Senior Technical Support Engineer - Indium Corporation
- "Growth Mechanisms and Mitigation Techniques for Whisker Formation in Pure Sn Lead Finishes".  Dr. Peng Su - Package             Development - Freescale Semiconductor
-"Solectron 'Lead Free' update" - Neal Klubak - NPI Engineering Manager - Solectron
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Holiday Social Meeting held on December 2005.  Announcements of new officers for 2006. 
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1st Quarterly Technical Symposium - March 27th, 2006 - Five Speakers - Lead Free Electronics Stampede Program
-"Complying with RoHS: Registering Your Hazardous Substance Process Management System" presented by
Mary McDonald (MCG) and along with Doug Galle (Sigmatel).
-"RoHS Compliance in PCB Fabrication" presented by Greg Smith (Dynamic & Proto Circuits)
-"Fine-Pitch, Lead-Free Wafer Bumping Using C4NP Technology" presented by Mr Abbott (IBM) with Klaus Ruhmer
(Suss Microtec) in a joint process with IBM's ownership of the technology.
-"Lead Free Solder Assembly for Mixed Technology Boards" presented by Karl Seelig (AIM).
-"Review of Industry Status of Tin Whiskering of Matte Tin Finishes" presented by Leo Higgins (ASAT).
Meeting Sponsors and Table-top Exhibitors:  ASI, Dynamic & Proto Circuits, Premier Services, The ISP Group,
Torenko Associates
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2nd Quarterly Technical Symposium - June 19th, 2006 - Four Speakers
-KEYNOTE PRESENTATION: "Packaging Techniques in Current Generation Portable Products" presented by Portelligent
-"Electromigration in Pb-Free Solder Joints in Plastic Flip-Chip Packages" presented by Seung-Hyun Chae (University of Texas)
-"Using Thermally Conductive Tape for Heat Sink Attachment" presented by Dr Mike de Sorgo (TIMsultants)
-"Measurement and Simulation of the Thermal Resistances of Stacked Die" presented by Dr Bennett Joiner (Freescale)
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October 2006 1st Annual Vendor Show & Technical Program

Keynote Presentation: "Economic Trends in the Electronics Industry", Keith Robinson, Frost and Sullivan

"Advanced Semiconductor Packaging", Robert Darveaux, Amkor

"Lessons From the RoHS Transition", Randy Shueller, Dell

The Lead-free Reflow Process from Material Selection to Reducing Defects, Peter Biocca, Kester

The Print Process in Reliable Lead-free Assembly, Mike Burgess, Photo Stencil

Wednesday, May 30, 2007

"Solderability of Packages and PCB Surface Finishes in a Lead-Free World", Dr. Bev Christian, Research in Motion
"Hermetic Chip Scale RF MEMS Packaging", TeraVicta Technologies
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November 9, 2007
"RoHS and WEEE and What It All Means for PCB Design, Fabrication and Assembly"
Gil White, DDi Global
"Drivers and Trends in Advanced Packaging Technology"
Jan Vardaman, TechSearch International
"SMT Assembly Challenges with Large Telecom PCBAs Including Pb-Free, 0201s and >50 mm BGAs"
David Mendez, Solectron Corporation (Texas)

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April 7,2008 

"The Future of Electronics Manufacturing", Jim Raby, STI Electronics

"Strain Gauge Testing and Analysis for BGA Devices", Swapnil Padhye and Adam Gage, National Instruments

"Pb-free BGA Component Reliability: A Comparison of SAC405 Versus Sn-3.5Ag Solder Ball Alloys", Daniel Cavasin, AMD 4:50 - 5:20 PM - "Reflow Processes and PCB Design for Lead-Free and 0201 Discretes", Curtis Hart, Silicon Hills Design  

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October 1, 2008 Vendor Show and Technical Program

"X-Ray Inspection for Electronics Quality and Reliability" Glenn Robertson of Process Sciences

"High-Density Packaging Trends in Portable Electronics" David Carey of Portelligent

"Electronics Reliability Prediction Using the Product Bill of Materials" Cheryl Tulkoff and Jim Lance of National Instruments

"Thin Film Photovoltaic Technology and Solar Cell Module Design" Bert Haskell of HelioVolt

Followed by a door64.com Networking Event sponsored by Central Texas Electronics Association

Chapter Officers

Central Texas Electronics Association (CTEA)

Local Chapter of IMAPS (www.imaps.org) and SMTA (www.smta.org)

President: Chris Kimball, Virtex Assembly, (512) 835-6772 Chrisk@virtexassembly.com

Vice-President: Bill Mace, billmace6@gmail.com

Secretary: Dr. Bennett Joiner, Freescale Semiconductor, (512) 996-5739, bennett.joiner@Freescale.com

VP Technical Programs: Andrew Mawer, Freescale Semiconductor, (512) 895-7925, andrew.mawer@Freescale.com

Treasurer: Bob Baker, consultant, (512) 345-1025, rjbakeratx@austin.rr.com

VP Membership: Keith Vanderlee, Magnecomp, (512)799-4052, kvanderlee@magnecomp.com

Vendor Show Chair: President: Chris Kimball, Virtex Assembly, (512) 835-6772 Chrisk@virtexassembly.com

Chapter Web Sites:

SMTA: http://www.smta.org/chapters/chapters_detail.cfm?chapter_id=35

IMAPS: http://www.imaps.org/chapters/centraltexas/index.htm

updated 11/3/08