|
|
|
|||
|
|
Central Texas Chapter Region: Central Texas ( Central Texas
Electronics Association (CTEA) is the Austin-based
Design & Manufacturing Tech Forum & Expo Thursday, November 10 Program: 10:30-5:00 Exposition
Floor Open 11:00 "Lithium-Ion Batteries and Electric
Vehicles." Joel Sandahl,
President and CEO of ZX Technologies 12:00 Complimentary Lunch and Door Prize
Drawings 1:00 "Reliability & Metallurgy of
ENEPIG Board Finish and Tin-Lead Solder Joints." Mike Wolverton,
Professional Engineer at Raytheon Space & Airborne Systems 2:15 "The iNEMI
Roadmap and Research Plan (The Good, The Bad and The Ugly!)
" Alan Rae, iNEMI
Research Director and Managing Member of TPF Enterprises 3:00 Refreshments, Networking, and More Door Prize Drawings 3:30 "Using Automated Solder Paste
Inspection to Improve Print Yields." Chrys
Shea, President of Shea Engineering Services 5:00 Final Door Prize Drawings Registration: This event is complimentary for IMAPS members and non-members.
Booth
Space Still Available! Discount
on exhibit space for IMAPS corporate members Exhibitors Click here for more information or online exhibitor
registration Attendees Click here to register before COB November 7 Norris Conference
Center at Northcross Mall (backside) 2525 West Anderson
Lane If you prefer not to
receive Chapter event announcement, please e-mail reply with “unsubscribe”
typed in the subject line. In
Central Texas, SMTA and IMAPS work together as the Central Texas Electronics
Association (CTEA) Previous Meeting information: *************************************************************************************************************************** "Commercializing Nanofabricated Devices for
Drug Delivery – Is It Actually Possible?", Randy Goodall, NanoMedical Systems "Fluid
Flow Mechanics – Key to Low Standoff Cleaning”, Naveen
Ravindran, Zestron "Constraint Driven HDI PCB Design", Weldon
Tadlock, Cadence Design Systems " Challenges & Opportunities in Electric
Propulsion / Generation Systems", Julian Partridge, KLD Energy
Technologies *************************************************************************************************************************** "3M's
High Speed Cable Products", Bill Ballard, 3M "MTBF:
Your Mileage May Vary…", Ed Tinsley,
Dell "LDI
Imaging, LDI Solder Mask, Silkscreen, and Vision Drilling”, Bryan
Fish, Streamline Circuits "Touch
Screens: Staying on Point in 2011 and
Beyond", Michael Woolstrum, Touch International *************************************************************************************************************************** "Lead-Free
Chip-Package Interaction Reliability Overview", Lei Fu, Advanced Micro Devices (AMD) "Improving
System Reliability with SynJet Cooling",
Dr. Markus Schwickert, CRE, Nuventix "Counterfeit Components
Avoidance and Detection”, Jason Jowers, Velocity
Electronics "AC
Power Electronics for Rooftop Solar", Terence Parker, SolarBridge Technologies *************************************************************************************************************************** "Key
Reliability Risks on Pb-free Products", Randy Schueller, DfR Solutions "Solar
Power - Macroeconomic Trends", Iga Hallberg, HelioVolt "Establishing
a High-Yield, Pb-free Process, including Ultra Fine Pitch Printing for
Passives and CSPs", Ron Lasky, Indium Corporation / Dartmouth College "Packaging
for Portables: Going Vertical and Getting Small", David Carey, UBM TechInsights *************************************************************************************************************************** "Trends
and Technologies in 3D Packaging and Integration", Jan Vardaman, TechSearch
International" "Customer
Value and Plant Performance, The Impact of Implementing Traceability", Tommy Fox, Optimal Electronics Corp. "Cleaning
Flux Residues under Low Profile Components", Rich Brooks, Kyzen Corp. "Avoiding
Some Common Soldering and Package Failure Modes in Electronic Assemblies",
Andrew Mawer, Freescale Semiconductor *************************************************************************************************************************** *************************************************************************************************************************** Cheryl Tulkoff
of DfR Solutions: " Manufacturing and
Reliability Challenges With QFN " Kim-Marie Vo of Freescale
Semiconductor: "Intellectual
Property Law: What Non-Attorneys Should Know " Ray Prasad of Ray Prasad Consultancy
Group: "Troubleshooting SMT Yield
Problems in a Tin-Lead and Lead Free World " Dr. Dan Baldwin of Engent: "New and Emerging Technologies in
Electronics" Presentations from the October
Symposium and Vendor Show are available at <http://www.smta.org/chapters/chapters_detail.cfm?chapter_id=35> *************************************************************************************************************************** "Seven Ways to Profile to
Profitability", Brian O'Leary Brian gave a book to the first 30 people in the
door (limit two per company). KIC
"Design for Recyclability", Craig Boswell, Hobi
International "Preparing
Yourself for the Job Search", Pat Goodwin, Pat Goodwin Assoc "Detecting Counterfeit Electronic
Components", Stephen Schoppe, Process *************************************************************************************************************************** "Microelectronic Applications of
Advanced Automatic Optical Inspection (AOI)", Camtek "Overcoming Challenges in
Thermally Enhanced BGA Packaging with Low-k Silicon" Dr. Chu-Chung (Stephen) Lee (Freescale
Semiconductor) "Filler Dispersion in Epoxy Mold
Compound and Its Effect on the Reliability of Cu/Low-k Devices in Plastic
Ball Grid Array Packages," Dr. Min Ding (Freescale Semiconductor) *************************************************************************************************************************** "X-Ray Inspection for
Electronics Quality and Reliability" Glenn Robertson of Process Sciences
"High-Density Packaging Trends
in Portable Electronics" David
Carey of Portelligent "Electronics Reliability
Prediction Using the Product Bill of Materials" Cheryl Tulkoff
and Jim Lance of National Instruments "Thin Film Photovoltaic
Technology and Solar Cell Module Design" Bert Haskell of HelioVolt Followed by a door64.com Networking
Event sponsored by Central Texas Electronics Association *************************************************************************************************************************** "The Future of Electronics Manufacturing", Jim Raby, STI Electronics "Strain Gauge Testing and Analysis for BGA Devices", Swapnil Padhye and Adam Gage,
National Instruments "Pb-free BGA Component Reliability: A Comparison of SAC405
Versus Sn-3.5Ag Solder Ball Alloys", Daniel Cavasin,
AMD 4:50 - 5:20 PM - "Reflow Processes and PCB Design for Lead-Free and
0201 Discretes", Curtis Hart, Silicon Hills
Design *************************************************************************************************************************** *************************************************************************************************************************** "Solderability
of Packages and PCB Surface Finishes in a Lead-Free World", Dr. Bev
Christian, Research in Motion Keynote Presentation: "Economic Trends in the Electronics
Industry", Keith Robinson, Frost
and Sullivan "Advanced Semiconductor Packaging", Robert Darveaux, Amkor "Lessons From the RoHS
Transition", Randy Shueller, Dell The Lead-free Reflow Process from Material Selection to Reducing
Defects, Peter Biocca,
Kester The Print Process in Reliable Lead-free Assembly, Mike Burgess,
Photo Stencil 2nd Quarterly Technical
Symposium - June 19th, 2006 - Four Speakers LEAD FREE
TRANSITION - "An Overview of
Lead Free Solder Pastes" ?Tim Jensen ?Senior
Technical Support Engineer - Indium Corporation *************************************************************************************************************************** Chapter Officers Central Texas Electronics Association (CTEA) Local Chapter of IMAPS
(www.imaps.org) and SMTA (www.smta.org) President: Keith Vanderlee, TDK Magnecomp (512) 345-0284,
kvanderlee@magnecomp.com Treasurer: Bob Baker, Consultant,
(512) 345-1025, rjbakeratx@austin.rr.com Secretary: Mary Ann Nailos, Dell, (512) 724-1138, mary_nailos@dell.com VP Technical Programs:
Tommy Fox, Optimal Electronics Corp, (512) 372?415, tfox@optelco.com Asst. VP Technical
Programs:
Andrew Mawer, Freescale, (512) 895-7925, Andrew.Mawer@Freescale.com VP Membership: Rich Brooks, KYZEN, (615) 983-4601
rich_brooks@kyzen.com Vendor Show Chair: Keith Vanderlee, TDK Magnecomp, (512)
345-0284, kvanderlee@magnecomp.com IMAPS National Rep: Min Ding, Freescale Semiconductor, (512)
895-3517, min.ding@freescale.com SMTA National Rep: Praveen Kumar Manjeshwar, Cisco Systems, (512) 378-1206, pmanjesh@cisco.com Chapter Web Sites: IMAPS: http://www.imaps.org/chapters/centraltexas/index.htm SMTA: http://www.smta.org/chapters/chapters_detail.cfm?chapter_id=35
updated 04/19/2011 by Min
Ding |
|||
|
|
|
