Program:

            11:30  Registration and networking

            12:00  Lunch and break

             1:00  “Optimizing a Standard Print Process for Mixed Technology Assembly”

                 Rich Lieske, Solutions Engineering Manager at DEK America.

             1:30    “Benchmarking of 96% Alumina Substrates for Thick Film Hybrids” 

                       Sarah Groman, Technical Service Engineer at Heraeus

 2:00   Break

 2:15   “Embedded Passive Materials for Use in PCB/IC Packaging”

           Joel Peiffer, Engineering Specialist at 3M Electronic Solutions.

 2: 45   "Ceramics for MEMS Packaging" 

           Adam Schubring, Sr. Market Development Engineer at Kyocera America, Inc.

3:15 Event wrap-up and chapter elections

3:30 Optional tour of Panasonic’s Advanced Packaging Lab

         Features demonstrations of gold to gold thermosonic flip chip bonding, plasma cleaning process technologies, X-Ray inspection, and SEM cross-section analysis.

4:00 Conclusion

Registration and Logistics:

Tuesday, February 16    11:30 AM CST  

Panasonic Factory Solutions Company of America.   

909 Asbury Dr.   Buffalo Grove, IL 60089    847-495-6131

No ID required for participants.

   Click here for map and directions  

   Call Gene Dunn at 847-495-6131 for on-site information only.

IMAPS Members-$15, non-members-$25, and students with IDs -$5.00. 

On-line registration guarantees seating & lunch.  Please register by COB on Friday, February 12

Participants may pay on-site by cash or check only.  Lunch is not guaranteed then.

Click here to register