IMAPS - Chicago/Milwaukee Chapter

Winter Technical Forum on Materials and Advanced Technologies
Tuesday, March 15, 2011

PROGRAM AGENDA
On-line registration

HOSTED BY: LASERAGE – WAUKEGAN, IL

Laserage Technologies
Laserage specializes in laser scribing, machining, drilling, welding, and other custom laser job shop services.

11:30 AM Registration and Networking

12:00 PM Lunch and Chapter Announcements

12:45 PM Topic: Multilayer Ceramics for MEMS Packaging
Speaker: Adam Schubring / Kyocera

01:15 PM              Topic:          Advanced Anisotropic Conductive Paste for Flip Chip Assembly
                            Speaker:      Ken Araujo / Namics Technologies

01:45 PM             Break:          Refreshments

02:00 PM              Topic:          Improvements in Solid State Lighting Applications with the use of Traditional
                                                Thick Film Technology.
                           Speaker:       Sarah Groman / Heraeus Materials Technology

02:30 PM Topic: Advanced Solid State Lighting using MID Technology
Speaker: Vic Zaderej / Molex

03:00 PM Topic: Advance Packaging Cleaning & Process Development
Speaker: Tim Noble & Sherry Hoard / Kyzen Corporation

03:30 PM Topic: Overview of Laserage and Tour
Speaker: Steve Capp / Laserage

04:00 PM Conclusion

Location: Registration:

Laserage                                IMAPS Members                                 $15.00
3021 Delany Road                   Non-members                                     $20.00
Waukegan, IL   60087              Students & Displaced
Phone: (847) 856-2216              Members                                             $ 5.00

On-line registration guarantees seating and lunch.
Participants may pay on-site by cash or check only.

Past Events:

Winter Technical Symposium

Tuesday, February 16, 2010

Thick Film Materials, Printing, and MEMS Technologies

Program:



            11:30 Registration and networking

            12:00 Lunch and break

             1:00 “An Overview of Solid State Lighting”

                 Marc Chason from Marc Chason and Associates.

             1:30    “Benchmarking of 96% Alumina Substrates for Thick Film Hybrids”

                       Sarah Groman, Technical Service Engineer at Heraeus



2:00   Break

2:15   “Embedded Passive Materials for Use in PCB/IC Packaging”

           Joel Peiffer, Engineering Specialist at 3M Electronic Solutions.

2: 45   "Ceramics for MEMS Packaging"

           Adam Schubring, Sr. Market Development Engineer at Kyocera America, Inc.

3:15 Event wrap-up and chapter elections

3:30 Optional tour of Panasonic’s Advanced Packaging Lab

         Features demonstrations of gold to gold thermosonic flip chip bonding, plasma cleaning process technologies, X-Ray inspection, and SEM cross-section analysis.

4:00 Conclusion