Honeywell

IMAPS Florida Chapter

 

The Florida Chapter of IMAPS is made up of IMAPS members from the Sunshine State and its neighboring states Georgia and Alabama. Meetings rotate across locations throughout the territory and alternate with webinars to be intentionally inclusive of attendees from as many regions as possible within Florida's wide geographical expanse.

Florida hosted the International Symposium on Microelectronics in 2013 and 2015.

Get Involved
The Florida Chapter always welcomes interested speakers and company hosts for upcoming meetings. Contact the chapter President Mike Newton or IMAPS Membership Administrator Shelby Moirano (smoirano@imaps.org) to express interest in:

  • Speaking at a chapter event
  • Hosting a chapter event at your facility
  • Sponsoring a chapter meeting or webinar
  • Joining IMAPS


Upcoming 2018 Chapter Events

August 23, 2018

Near Disney World

The International Microelectronics, Assembly and Packaging Society

Florida Chapter Presents

SMART SENSORS

Research, Manufacturing & IoT Applications

REGISTER HERE


Co-Chairs: 
Dr. Amit Kumar, Associate Director, 
Research and Technology Services, BRIDG


Dr. Tengfei Jiang, Assistant Professor,
Materials Science and Engineering, University of Central Florida


August 23, 2018
BRIDG - 200 NeoCity Way, NeoCity, FL 34744

 

Abstract Deadline for Speakers and Student Posters: August 15, 2018
Submit abstracts here


Workshop Focus:
Over 50 billion devices will be connected to smart sensors. Demand for sensors is expected to reach 1 trillion. What do these sensors do? They count your steps. Measure your acceleration to calculate your ETA when using GPS. They even automatically adjust your camera lens around ambient light to help you snap that perfect picture. These are just a few of the ways sensors unite to deliver a constant stream of leading-edge experiences on your smart phone. Beyond phones, sensors are infiltrating cars, buildings, appliances, medical equipment, and wearable devices that track personal fitness and health conditions. This workshop will bring together the scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of smart sensors, systems and advanced packaging technology. This workshop and tabletop exhibits enables discussion and presentations on the latest semiconductor based design, process and materials for smart sensor and photonic technologies.

  • Silicon Sensors
  • Optical Sensors
  • Wide Band Gap Power Electronics
  • Nanotechnology
  • Optical Interconnect
  • Novel Die Interconnect
  • Through Silicon Vias
  • 2.5 and 3D Die Stacking & Interposers
  • Digital Printing / Deposition Technologies
  • Internet of Things
  • Advanced Ceramic materials/packaging
  • Thin and ultra-miniature components
  • Metrology
  • Thin and ultra-miniature components
  • Design, Simulation and Modeling
  • Smart Sensor Applications
  • Polymer Thick Film Materials
  • Cybersecurity

Past Chapter Events

February 21, 2018
Technical Workshop and Symposium on Advanced Manufacturing and Innovative Design For DOD Systems
CAMID - Florida Institute of Technology, Palm Bay, Fl.

The objective of the Advanced Manufacturing Workshop and Symposium is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of emerging electronic packaging technology. This workshop and tabletop exhibits enables discussion and presentations on the latest materials, process, hybrid & emerging advanced manufacturing, maker community and the future of integrated design tools, PLM, digital twin, AR/VR, cyber-based manufacturing and cybersecurity.

May 17, 2018

ATW on Advanced Packaging for Unmanned Autonomous Systems

Embry-Riddle Aeronautical University (ERAU)
MicaPlex
https://erau.edu/micaplex

Workshop Focus:
This workshop focus is on advanced packaging and emerging manufacturing technologies that support ground, air and space Unmanned Autonomous Systems (UAS). This includes novel materials, integrated electronics, thermal challenges and metrology. Additional challenges of RF devices, communications and antenna technologies that support intersystem communication and cooperation.

August 24, 2017
Advanced Technical Workshop and Tabletops
SMART SENSORS
Research, Manufacturing & IoT Applications
BRIDG- 200 NeoCity Way, NeoCity, FL 34744 (Map)

Chapter President

Mike Newton
CEO, Newton Cyberfacturing
mike@newtoncyberfacturing.com

Chapter Treasurer

Tim Davis
President, JDM Associates
tim@jdm-associates.com

Corporate Members

Aurora Semiconductor
Florida MicroElectronics
Haiku Tech
Micross Components
Plasma-Therm, LLC
Semplastics LLC

Student Chapters

University of Central Florida
Dr. Tengfei Jiang, Advisor

 

 

 

 

 


 
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