Micross

IMAPS Florida Chapter

 

The Florida Chapter of IMAPS is made up of IMAPS members from the Sunshine State and its neighboring states Georgia and Alabama. Meetings rotate across locations throughout the territory and alternate with webinars to be intentionally inclusive of attendees from as many regions as possible within Florida's wide geographical expanse.

Florida hosted the International Symposium on Microelectronics in 2013 and 2015.

Get Involved
The Florida Chapter always welcomes interested speakers and company hosts for upcoming meetings. Contact the chapter President Mike Newton or IMAPS Membership Administrator Shelby Moirano (smoirano@imaps.org) to express interest in:

  • Speaking at a chapter event
  • Hosting a chapter event at your facility
  • Sponsoring a chapter meeting or webinar
  • Joining IMAPS

Upcoming 2017 Chapter Events
Save the date! Each event will be activated with a registration link when more details become available. Click here to view all upcoming IMAPS events.

Upcoming 2018 Chapter Events

February 21, 2018
Technical Workshop and Symposium on Advanced Manufacturing and Innovative Design For DOD Systems
CAMID - Florida Institute of Technology, Palm Bay, Fl.

For a Tabletop Exhibit or Sponsorship Contact Timothy Davis:
tim@jdm-associates.com

CLICK HERE TO REGISTER

The objective of the Advanced Manufacturing Workshop and Symposium is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of emerging electronic packaging technology. This workshop and tabletop exhibits enables discussion and presentations on the latest materials, process, hybrid & emerging advanced manufacturing, maker community and the future of integrated design tools, PLM, digital twin, AR/VR, cyber-based manufacturing and cybersecurity.

FULL PROGRAM

Technical Keynote:
Dr. Michael W. Grieves
Executive Director - Center for Advanced Manufacturing and Innovative Design

*** CALL FOR STUDENT POSTERS ***

​Deadline: February 9, 2018

Click here to submit

Best Poster Awards: 1st $500 / 2nd $300 / 3rd $200

 

Abstracts are being requested for the following areas:

  • Digital Design/Cyberfacturing/Cybersecurity
  • Augment & Virtual Simulation/Design
  • Paper based, PET & PVC substrate media
  • Printable display & lighting
  • Thin and ultra-miniature components
  • Dual Use and DoD Applications
  • Polymer Thick Film Materials
  • Advanced Ceramic materials/packaging
  • 3D, Additive/Subtractive Manufacturing
  • Digital Printing / Deposition Technologies
  • Nanomaterials, inks, epoxies & adhesives
  • Printed electronics
  • Thin & printable battery technology
  • Membrane and capacitive switches
  • Novel die interconnect
  • Metrology

May 17, 2018

ATW on Advanced Packaging for Unmanned Autonomous Systems

Embry-Riddle Aeronautical University (ERAU)
MicaPlex
https://erau.edu/micaplex

Workshop Focus:
This workshop focus is on advanced packaging and emerging manufacturing technologies that support ground, air and space Unmanned Autonomous Systems (UAS). This includes novel materials, integrated electronics, thermal challenges and metrology. Additional challenges of RF devices, communications and antenna technologies that support intersystem communication and cooperation.

 Antennas
 Remote Power Systems
 RF Electronic, components and devices
 Optical Interconnect
 Integrate buss structures
 Nanotechnology
 Optical Interconnect
 Novel Die Interconnect
 Digital Printing / Deposition Technologies
 Solar and battery technology
 Advanced electronic materials/packaging
 Thin and ultra-miniature components
 Metrology
 Thin and ultra-miniature components
 Design, Simulation and Modeling
 4D – Printed Actuation devices
 Polymer Thick Film Materials
 Cybersecurity

Past Chapter Events

August 24, 2017
Advanced Technical Workshop and Tabletops
SMART SENSORS
Research, Manufacturing & IoT Applications
BRIDG- 200 NeoCity Way, NeoCity, FL 34744 (Map)

Chapter President

Mike Newton
CEO, Newton Cyberfacturing
mike@newtoncyberfacturing.com

Chapter Treasurer

Tim Davis
President, JDM Associates
tim@jdm-associates.com

Corporate Members

Aurora Semiconductor
Florida MicroElectronics
Haiku Tech
Micross Components
Plasma-Therm, LLC
Semplastics LLC

Student Chapters

University of Central Florida
Dr. Tengfei Jiang, Advisor

 

 

 

 

 


 
CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems