Metro Chapter
Region:
Metro IMAPS Meeting Announcement
When: Thursday March 27, 2008
Registration/Networking 5-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Technical Presentation: 7:15-8:00 PM
Where: Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500
Price: Members: $30.00 if Pre-Registered Tuesday March 25, 2008
$35.00 After March 25, 2008
Non-Members: $35.00 if Pre-Registered by March 25, 2008
$40.00 After March 25, 2008
Student Members: $10.00 if Pre-Registered before March 25, 2008
$ 20.00 after March 25, 2008
Pre Registration Email: slehnert@imaps.org
Phone: Steve Lehnert: (631) 345-3100
WEB: www.imaps.org/chapters/metro
Embedded Discrete High K Capacitor Characterization in Low Temperature Co-Fired Ceramic (LTCC)
Michael Skurski Dupont
Michael A. Skurski is a Sr. Technical Service Representative with DuPont Microcircuit Materials, specializing in 951 Green Tape technology (LTCC), automotive defogger materials, Fodel(R) photoimaging, and Diffusion Patterning(tm) advanced patterning techniques, in addition to performing R&D related functions in these areas, and conventional thick
film technology. Mike joined DuPont in 1979 where he has contributed to various groups within DuPont's Thick Film Electronic Materials Division, including Quality Assurance, Research & Development, Manufacturing Scale-up Engineering, and Technical Service.
This paper will discuss in detail the measurement results of the embedded discrete high K capacitors when fabricated within a Low Temperature Co-fired Ceramic (LTCC) structure. It will cover design rules and typical measured capacitor values and ranges which use high K thick film formulations of K ~500 and K ~1800 with X7R characteristics when embedded within the LTCC circuits.
These capacitors could be utilized as biased and decoupling capacitors; near and around MMIC's and IC's instead of using surface mount capacitors or integrating them in the IC technology.
Details of the properties of the dielectric materials, circuit functional designs and functional properties of the circuits will be discussed, along with processing details and recommendations.
There are a limited number of vendor tables available for this meeting at a cost of $200.00 or 2 for 300.00. Please contact Steve Lehnert if you are interested.
METRO IMAPS
is pleased to announce that it will be hosting a 3 day technical symposium and workshop
on May 7, 8, & 9 2008
at the Holiday Inn Ronkonkoma
Tentative Schedule
May 7, 2008: A full day presentation on flip chip and chip on board technology
Presented by Dr. Daniel Baldwin of Engent
May 8, 2008: ˝ Day Symposium and Vendor Table Top Show
May 9, 2008: A full day presentation on Hermeticity, Near Hermetic Packages and RGA.
Presented by Tom Green of TJ Green Associates
A full day presentation on Flip Chip and Chip on Board Technology presented by:
Dr. Daniel F. Baldwin
Founder of Engent
Dr. Baldwin holds a Ph.D. and S.M., Mechanical Engineering: Massachusetts Institute of Technology B.S.E, Mechanical Engineering, Arizona State University
Dr. Baldwin has been a leading expert in the Microelectronics Packaging industry for eight years. He was pursued and hired by Siemens to synthesize, construct, and run the Advanced Assembly Technology Division of Siemens Dematic serving as the Director and promoted to the Vice President of the Division. Dr. Baldwin subsequently led the efforts related to the management buy-out and formation of Engent.
Dr. Baldwin is a Professor of Mechanical Engineering at the Georgia Institute of Technology, with specialization in Electronics Packaging, Electronics Manufacturing MEMS/MOEMS Packaging, and Board Assembly since 1995. Dr. Baldwin managed large technology development programs at Georgia Tech with over 50 employees. During his tenure at Georgia Tech he raised over $10M in capital funding and constructing a $10M state of the art electronics manufacturing and MEMS/MOEMS packaging development facility.
He received his Master of Science and his Doctoral degrees in Mechanical Engineering from Massachusetts Institute of Technology (MIT), and has over 250 published or delivered articles, scholarly papers, keynote addresses, conference proceedings, and textbooks. Dr. Baldwin held prior positions Bell Labs in Princeton, NJ, where his work focused on electronics products miniaturization and advanced interconnect technologies and MIT as a research manager. Baldwin is renown in the field of leading-edge electronics-assembly technology, micro (opto) electromechanical systems (MEMS/MOEMS) packaging, optoelectronics packaging, and advanced materials processing. A handful of his many honors include:
§ Keynote Address: “Visions of Electronics Manufacturing, Assembly, and Packaging,” EXPO 2000 World Exposition, Hanover, Germany
§ Board of Advisors, Association for Electronics Manufacturing, Society of Manufacturing Engineers (EM/SME)
§ Board of Directors, Surface Mount Technology Association (SMTA)
§ ASME, Outstanding Young Engineer Award, Electrical and Electronics Packaging Division
§ Outstanding Research Award, National Science Foundation, Packaging Research Center
Course fee: 500.00 IMAPS Member 600.00 Non Member (Includes Continental Breakfast and Lunch)
Contact Steve Lehnert Phone (631) 345-3100 Email slehnert@imaps.org to register
Time: 8:00 AM-4:30 PM
Location: Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500
On May 8, 2008
We will be holding a ˝ Day Symposium & Table Top Show
at the Holiday Inn Ronkonkoma
We are presently looking for Technical Presentations in the following Areas:
Advanced Technologies, Quality & Reliability, Extreme Environments & Design, Thermal Design
However all other subjects relating to the industry will be considered.
Contact Bob Conte if you would like to present a paper.
Phone: (631) 586-7600 x263 Email: Bob.Conte@rsm.com
We have a limited number of vendor tables (Approximately 40) available on a first come first served basis. Cost 350.00 before 3/31/08 450.00 after (If any are still available)
Contact Steve Lehnert for further information or to reserve a table. Phone (631) 345-3100 Email: slehnert@imaps.org
We are considering a Golf outing on May 7, 8, or 9. Contact Mike McKeown if interested.
Phone: (516) 739-2690 Email: Mike.McKeown@orthodyne.net
On May 9, 2008
A full day presentation on:
Hermeticity Testing , RGA and "Near Hermetic" Packaging Concepts
A discussion of the new Hereticity requirements in Mil-Std 750 and potential impact in Mil-Std 883 will be included in this presentation
:
Hermeticity of electronics packages and hermeticity test techniques continue to be of critical
importance to the microelectronics packaging community. Specifically, in the area of MEMS/MOEMS
packaging, OLEDs, wafer scale packaging, optoelectronic devices and packaging for Military and Space.
In addition, there are a host of medical implants, bio medical devices and emerging nanotechology
applications that all require hermetic packages and valid techniques to measure the leak rate. In contrast to
a hermetic cavity style package "near hermetic" packages are being developed that rely on polymeric
materials, such as LCP, to make a package that provides just enough moisture protection to survive in the
intended end user environment.
This course begins with an overview of hermetic sealing processes. The class will then examine
the accepted leak test techniques as prescribed in Mil Standard 883 Test Method 1014. This misunderstood
test method is often a source of frustration. The basic science behind helium fine leak testing (both the
fixed and flexible methods) will be presented. Difficulties and limitations in fine leak testing of small
volume packages is a major industry concern, especially among the Space community. Issues with bomb
times and pressures, measured leak rate vs air leak rates, “one way leakers”, virtual leakers will be
addressed, along with gross leak testing; bubble, weight gain etc. In each case the focus will be on practical
issues facing the industry.
The latest techniques for measuring both gross and fine leak testing is Optical Leak Test (OLT). In
this method a laser interferometer measures out of plane deflection on a lid surface in response to a
changing pressure and relates these measurements to an equivalent helium leak rate. For some packages
(e.g. MEMS and Opto devices) OLT is the only available viable technique.
The ultimate goal is to seal the sensitive microelectronic component in a dry, inert atmosphere to
allow reliable functioning of the device over it’s intended lifetime. The gas ambient inside the package is
measured using Residual Gas Analysis. What is RGA (Residual Gas Analysis)? How does it relate to
hermeticity testing? Is the current 5,000 PPM level valid for next generation MEMS/MOEMS and
Nanotechnology. Besides moisture what other gases are of concern?
Packages made from polymeric materials as opposed to traditional hermetic seals (i.e. metal,
ceramic etc) require a different approach from a testing standpoint. The problem is now one of moisture
diffusion through the barrier and package interfaces. A brief review of the techniques and methods to
evaluate a "non-hermetic" approach is presented.
In addition to a comprehensive set of course notes each student receives a copy of a "Practical Guide to TM 1014" authored by the Instructor.
Who Should Attend
This PDC is intended as an introductory to intermediate level course for process engineers, designers,
quality engineers, and managers responsible for sealing, leak testing and RGA results and for those
responsible for evaluating new cavity style packages.
.
Course fee: 500.00 IMAPS Member 600.00 Non Member (Includes Continental Breakfast and Lunch)
Contact Steve Lehnert Phone (631) 345-3100 Email slehnert@imaps.org to register
Time: 8:00 AM-4:30 PM
Location: Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500
Chapter Officers
President:
Steve Lehnert
MDI
Phone: 631 345 3100
Email slehnert@mdipower.com
Vice President:
Mike McKeown
Orthodyne
Phone: 516 739 2690
Email: Mike.McKeown@orthodyne.net
Technical:
Bob Conte
RSM Sensitron
Phone: 631 586 7600 x263
Email: Bob.Conte@rsm.com
Finance:
Scott Baldassarre
Miteq
Phone: 631 436 7400
Email: sbaldassarre@miteq.com
Arrangements:
Deirdre Kenny
FEI
Phone: 516-794-4500
Email: deirdrek@freqelec.com.