Arizona Chapter
Region:
Arizona and parts of New Mexico
Future Meeting Information
Next Meeting
Thursday, May 17th 2007
TBA
Next Meeting
Thursday, May 17th 2007
TBA
| Date: | Thursday, May 17, 2007 |
| Schedule: | Registration and Lunch at 11:30 – 12:00 Presentation at 12:00 |
| Location: | Mesa City Library Dobson Ranch Branch 2425 S. Dobson Road Mesa, AZ 85202 |
| Cost: |
Luncheon and presentation - $10.00 !!! Special - No Charge for pre-registered attendees !!! Vendor display tables available for $15.00 |
| RSVP: | RSVP by May 15th to: greg.clemons@intel.com |
Chapter Information
Past Meetings and Topics
Past Meetings and Topics
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February 7th 2007
Enabling High Density SiP Manufacturing - The Use of Jetting Technology to Minimize Substrate Area for Underfill
Steve Adamson
AsymtekThis presentation discussed the use of jetting technology
November 1, 2006
Thermal Issues from the ITRS Perspective
Debendra Mallik
Intel Corporation
This presentation discussed the current status and future directions of addressing the package thermal issues from ITRS perspective.
May 16, 2006
High Frequency Composite Laminates
Young Gao
Rogers Corporation
Rogers Corporation joined IMAPS Phoenix and SAMPE Arizona to provide input on High Frequency Composite Laminates as a new solution for high performance chip packaging. Rogers provided a tour of their facility afterwards.
October 26, 2005
Understanding the Lead Free Challenges
Richard Brooks
IndiumDow Corning
Mr. Brooks provides an update on the Lead Free Challenges including alloy selection, surface finish, reliability and performance. Process and Product concerns were discussed as well as related to implementation in the SMT process.
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January 18, 2005
Designing 3D Packages for High Performance
Vern Solberg
Tessera Inc.
Miniaturization of electronic products such as wireless hand sets have driven the development of 3D Packaging, (2, 3 or more die within a single package outline). 3D Packaging improves performance by increasing in-package interconnect efficiency by more direct and shorter interconnects and can simplify the system board design. This talk will focus on a number of new, low risk, sequentially assembled vertically stacked package innovations that can provide the potential for lowering manufacturing costs.
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October 7, 2004
Radio Frequency Identification - The Sun Finally Shines on RFID
Dick Estes
Consultant to Dow Corning
RFID tags have been in the offing for some time now. Their use in badges, subway turnstiles and other applications is well known. With the recent push by WalMart and others for identification on shipment pallets, the door is being shoved open on this application. Dick Estes will present on the RFID tag, what it is, how it is used, the technology, the hurdles to overcome and its bright future.
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May 03 2004
GET THE LEAD OUT
Half Day Symposium, Supplier Day and Luncheon
Topics on Lead Free Processing
Presentations by:
Intel
Bance Hom
Flip Chip International
Indium Corp
Luncheon Speaker: Jim Walker - Gartner/DataQuest
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January 22, 2004
Killer MEMS Applications and their Packages
Ted Tessier
ST Assembly Test Services
The successful commercialization of MEMS applications has largely been dependent on the availability of affordable and reliable packaging solutions. Tthis presentation will provide an overview of specific packaging technologies that have enabled the emergence of 3 widely recognized “Killer MEMS” applications, namely digital imaging, automotive accelerometers and ink jet printing. The recent trend towards Wafer Level Capping of MEMS will also be discussed with its expected revolutionary impact to packaging.
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October 22, 2003
VFM - Fundamentals, Capabilities and Applications
Dick Garard
Lambda Technologies
A practical and comparative overview of various thermal-processing techniques with a brief history of microwave processing will be presented. Variable Frequency Microwave processing for curing polymeric adhesives will be discussed. The fundamentals of microwave energy interactions with gases, liquids and solids (Si, SiO2, SiC, Si3N4, metals) will be explained from a microscopic level to a macroscopic level to real life applications. The effects of VFM on semiconductor functionality will be addressed specifically as it applies to front end and back end semiconductor processing, including: organic ILD dielectric curing; (PSB) passivation stress buffering; wafer level solder reflow; die attach; FC underfill; glob top curing and structural bonding. The strengths and the limitations of the VFM technology will be clearly identified.
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August 28, 2003
A discussion on the Advantages of Integration in today’s Semiconductor Assembly and Test Facility
Leroy Christie
ASM Pacific
Automation has been the watchword of the semiconductor manufacturing world since the earliest days of the automated wire bonder. Today, the integration of these automated process stations brings the highest results out of your automatic tools. Leroy will discuss the advantages and disadvantages associated with integration and the commitments involved to make it happen.
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June 19, 2003
Packaging and Thermal management of Power, Optical, and RF/Microwave devices using Al-Si “CE” Alloys
Stu Weinshanker
Osprey Metals Ltd, UK
The Osprey CE Alloys are lightweight, Binary, Al/Si alloys where the composition of Al and SI can be tailored to provide a specific coefficient of thermal expansion (CTE) value anywhere in the range of 7-17 ppm/ºC. The alloys are manufactured by a proprietary spray-forming process, which promotes isotropic and optimum mechanical properties in the resultant products.
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Continue to check back for more chapter information.
Chapter Officers
Calendar Year 2007
Calendar Year 2007
EV Roberts
480-222-1735
Email: don.ream@asmpt.com
602-437-4688
Email: geoff.gardner@dowcorning.com
480-981-0366
480-563-4325