Future Meeting Information

Please join us for dinner and technical presentations.

Event Program:

5:00  Registration, Welcome, and Introductions

5:30  Dinner

6:00 “Electro-deposition of TSV features (3-D focus).”
                     Stan Wright, Account Manager, Enthone Inc.

6:30 “Using FEM/FEA to Understand the Mechanics of Solder Fatigue in Flip Chip, CSP, and BGA Interconnects”.   
               Scott Popelar, Principal R&D Package Engineer, Aeroflex COS
                         
7:00  Closing remarks.  Planning the next event (at the Ceramics Conference - CICMT) 

Registration:

On-line Registration
On-line registration ends Friday, March 27

Registration fees:  Industry professionals; $25.00 members, Students - $ 10.00

Please contact Mr. Tim LeClair at tleclair@yahoo.com or at Avago Technologies (970-288-9163) for more information.

 

Contact Steve Greene, IMAPS Membership Manager, at sgreene@imaps.org for more information.