IMAPS - International Microelectronics And Packaging Society: Bringing together the entire microelectronics supply chain!


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4th International Conference and Exhibition on
Device Packaging

www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA



Conference and Technical Workshops
March 17-20, 2008
Exhibition and Technology Showcase
March 18-19, 2008
Professional Development Courses
March 17, 2008
GBC Spring Conference
March 16-17, 2008

EARLY REGISTRATION AND HOTEL DEADLINES:
FEBRUARY 14, 2008

In conjunction with the Global Business Council (GBC) Spring Conference, March 16-17
$100 discount if attending both Device Packaging and GBC


Courtesy of FlipChip International, LLC

Courtesy of Rensselaer Polytechnic Institute
General Chair:
Ted Tessier
FlipChip International
Chief Technical Officer
Technical Co-Chair:
Beth Keser
Freescale Semiconductor
Technical Co-Chair:
Christo Bojkov
MAXIM
Technical Co-Chair:
Robert Dean
Auburn University
Technical Co-Chair:
Peter Tortorici
Medtronic Microelectronics Center
Technical Co-Chair:
Lou Nicholls
Amkor Technology Inc.
Technical Co-Chair:
James J.-Q. Lu
Rensselaer Polytechnic Institute
Technical Co-Chair:
Ajay Malshe
University of Arkansas
Technical Co-Chair:
Steve Adamson
Asymtek

Device Packaging Advance Program
Register On-Line | Hotel Reservations | Speaker Information
Download Advance Program (pdf) |
Professional Development Courses
Exhibition |
Floorplan | 2008 Exhibitors
Global Business Council (GBC) Spring Conference


THE EXHIBIT FLOOR HAS SOLD OUT

The Fourth Annual Device Packaging Conference (DPC2008) will be held in Scottsdale, Arizona, on March 17-20, 2008. It is an international event sponsored and organized by the International Microelectronics And Packaging Society (IMAPS).

This year’s conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 5 topic areas related to microelectronic packaging: Flip Chip; Wafer Level/Chip Scale Packaging; 3-D Packaging; MEMS; and Biomedical. Technical presentations in these 5 topic areas cover a full range of issues from new developments and materials through manufacturing and reliability. The professional development courses offered are also focused on these 5 topical areas of microelectronics and offer an additional valuable resource to attendees. The Global Business Council (GBC) will co-locate its Spring Conference March 16-17, focusing on the business aspects of these technologies. There will be several networking receptions and gatherings throughout the week, including the opening reception, meals, and other social events.

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.




HOUSING
Hotel Reservation Deadline - February 14, 2008

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264
$209/night
Rooms on hold March 15 – 20, 2008

For on-line reservations: www.radisson.com/ftmcdowellaz - promotional code - IMAPS1
For phone reservations:
call (480) 789-5300 or (800) 333-3333 and mention IMAPS – Device Packaging Conference

Hotel availability and rates will not be guaranteed after February 12, 2008.


Speaker Dates/Information:

  • Extended Abstract or Abstract Book Materials due: February 8, 2008
  • Hotel Reservation Deadline: February 14, 2008
  • Powerpoint/Presentation file for CD-Rom due not later than: March 20, 2008 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

 



 


Corporate
Sponsors:


Corporate Sponsor - Ticona Engineering Polymers

Corporate Sponsor - NEXX Systems



Student Paper Competition
Sponsors:


Student Paper Competition Sponsor - Nordson

Student Paper Competition Sponsor - The Microelectronics Foundation


IMAPS-International Microelectronics And Packaging Society
and The Microelectronics Foundation
Everything in electronics between the chip and the system!
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001 | Fax: 202-548-6115 | E-mail: imaps@imaps.org

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