Micross

14th International Conference and Exhibition on
DEVICE PACKAGING
www.imaps.org/devicepackaging

WekoPa Resort and Casino
Fountain Hills, Arizona USA

IMAPS Device Packaging

Conference and Technical Workshops
March 6-8, 2018
Exhibition and Technology Showcase
March 6-7, 2018
Professional Development Courses
March 5, 2018
GBC Plenary Session
March 7, 2018
Device Packaging (Amkor Image)
Courtesy of Amkor Technology
Device Packaging (RDEDCOM image)
Courtesy of US Army RDEDCOM AMRDEC

General Chair:
Peter Ramm
Fraunhofer EMFT Munich


General Chair-Elect:
Jon Aday
Qualcomm


Past General Chair:
Rozalia Beica
Dow Electronic Materials

Past General Chair:
Gilles Poupon
CEA




ABSTRACT DEADLINE: OCTOBER 18, 2017
EARLY REGISTRATION DEADLINE NOW: FEBRUARY 1, 2018
SPONSORSHIP RENEWALS FOR 2018 - NOW OPEN (EXHIBIT SALES SOON)

SUBMIT ABSTRACTS (before October 18)

REGISTER ONLINE | REGISTRATION INFO | HOTEL
SPEAKER DETAILS | SUBMIT PROFESSIONAL DEVELOPMENT COURSES (PDCs) PROPOSALS
EXHIBIT/SPONSOR PROSPECTUS | 2018 Booth Application | 2018 Exhibit Floorplan
2017 EXHIBITORS | CHARITY GOLF OUTING


Amkor
Courtesy of Amkor Technology

The Largest 2018 Conference Dedicated to...

Interposers, 3D IC & Packaging;

Fan-Out, Wafer Level Packaging
& Flip Chip;

Engineered Micro Systems/Devices
(including MEMS/Sensors, 3D Printing...)

Amkor
Courtesy of Amkor Technology

 

2018 Conference Overview:

The 14th Annual Device Packaging Conference (DPC 2017) will be held in Fountain Hills, Arizona, on March 5-8, 2018. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Featuring 3 Topical Workshop Tracks:

  • Interposers & 3D IC & Packaging;

  • Flip Chip, Wafer Level Packaging & Fan-Out; and

  • Engineered Micro Systems/Devices (including MEMS, Sensors & 3D Printing)

Those wishing to present their work at the Device Packaging Conference must submit a ~1000 word abstract electronically no later than OCTOBER 18, 2017, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary ("extended abstract") with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 19, 2018. A post-conference DOWNLOAD containing the full presentation material as supplied by authors will be mailed after the event to all attendees. Please contact Brian Schieman by email at bschieman@imaps.org if you have questions.

 

 

Device Packaging Exhibit and Technology Show:

IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. Full 8' by 10' exhibit spaces will be available. THE SPONSORSHIP RENEWAL PROCESS IS NOW OPEN THROUGH JULY. Exhibit sales will open following this phase. Interested in sponsorship and exhibiting? Contact Brian Schieman by email at bschieman@imaps.org. The exhibits have sold out every year since 2006 and WILL SELL OUT AGAIN FOR 2018 - MOST LIKELY IN OCTOBER 2017!

Device Packaging Professional Development Courses (PDCs):

For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 6th, preceding the technical conference. PDC details and registration on-line soon. If you would like to participate as an instructor, please submit a description of your short course on-line at www.imaps.org/pdc no later than OCTOBER 18, 2017.

 

Please contact Brian Schieman by email at bschieman@imaps.org if you have questions about the technical program, exhibits, golf or PDCs.

 

Device Packaging Poster Session

 


 

Registration Information: (Early Registration Deadline: February 1, 2018)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; DOWNLOAD will contain the extended abstract and presentation as submitted by the presenter. DOWNLOAD will be emailed 15 approximately business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 2/1/18
Advance/Onsite Fee
After 2/1/18
IMAPS Member
$800
$900
Non-Member
$900
$1000
Speaker
$550
$650
Chair
$550
$650
Student
$300
$400
Chapter Officer
$550
$650
Exhibits Only Pass w/ Lunch Included
$30
$30
Exhibits Only Pass NO Lunch Included
$0
$0
8x10 Exhibit (Member)
$1600
$1900
8x10 Exhibit (Non-Member)
$2300
$2600
Professional Development Course:
Each Course Registration is additional to the conference registration. Maximum of 1 morning course and one afternoon course can be selected. Attendees can opt for $0 exhibits only pass if they wish to take a PDC but NOT attend the conference/sessions.
$425
$475

REGISTER ONLINE


Speaker Dates/Information:

  • Abstracts Deadline: OCTOBER 18, 2017
  • Speaker Notification Emails: December 1, 2017
  • Extended Abstract Deadline: January 19, 2018
  • Hotel Reservation Deadline: February 1, 2018
  • Early Registration Deadline: February 1, 2018
  • Speaker Bios Due: February 15, 2018
  • Powerpoint/Presentation file for DOWNLOAD due not later than: March 8, 2018 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A) - Keynotes: 45 minutes (40 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Poster Session/Information
The poster session is planned to be an INTERACTIVE presentation. This means you do not start and complete a scheduled talk without interruption like in a regular/oral session. Speakers should have talking points and be at their poster throughout the entire session (Wednesday, March 8 from 5:30pm-6:30pm). You can "present" your scheduled materials, but more often the attendees will review your slides and ask questions. Or you can watch them and talk to them depending on which slide they are on. Authors may either print out each of their powerpoint slides on regular paper and tack them up in order, or prepare a large poster (or 2 even). Recommended poster size is typically 3x4 feet, with the max space on the board being 4 ft high x 8 ft wide. IMAPS staff will provide tacks to secure your print outs. The session is first-come-first-serve so there are not assigned poster boards/locations. POSTER SETUP FROM 4PM UNTIL 5:00PM on Wednesday, March 8.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

 

Housing
Hotel Reservation Deadline - February 1, 2018

Housing accommodations must be made directly to:

WeKoPa Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

IMAPS Discounted Single/Double Room Rate: $175/night + taxes + fees - Details Soon

 

Book your hotel reservation today! We have reserved a block of rooms at the host hotel to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.

Hotel Scams Alert!
All reservations should be made directly with the hotel and within the IMAPS room block. We are not using a housing company. If any person or firm contacts you and offers to handle your reservations, please beware. They are completely unauthorized and possibly fraudulent. The convention industry is currently plagued by such groups. If you use one of them and experience any problems, including lost deposits and no reservation when you arrive, IMAPS may not be able to assist you. Please be aware in particular of one of these unauthorized firms – Exhibition Housing Services – whose salespeople have falsely claimed to be calling from IMAPS.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.

 

Device Packaging Sponsorship (Need to be ahead of your competition? Join this list today!)

PLATINUM PREMIER SPONSOR

 
GOLD PREMIER SPONSORS
     
Corporate Sponsors
       
 
Additional Event Sponsors

 

Golf/Foundation Sponsors
 

 

Official Media Sponsors
Media Sponsor: MEMS Journal
Media Sponsor: Chip Scale Review
3D Incites - Media Sponsor
 

 



CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems