14th International Conference and Exhibition on

WekoPa Resort and Casino
Fountain Hills, Arizona USA

IMAPS Device Packaging

Conference and Technical Workshops
March 6-8, 2018
Exhibition and Technology Showcase
March 6-7, 2018
Professional Development Courses
March 5, 2018
GBC Plenary Session
March 7, 2018
Device Packaging (Amkor Image)
Courtesy of Amkor Technology
Device Packaging (RDEDCOM image)
Courtesy of US Army RDEDCOM AMRDEC

General Chair:
Peter Ramm
Fraunhofer EMFT Munich

General Chair-Elect:
Jon Aday

Past General Chair:
Rozalia Beica
Dow Electronic Materials

Past General Chair:
Gilles Poupon

EXHIBIT DETAILS (SOLD OUT) | 2018 EXHIBITORS | 2018 Exhibit Floorplan


60 presentations on FOWLP, 3D, Microsystems...

Poster Session

Poster Session featuring 20+ presentations & Happy Hour!


5 Keynotes on 3DIC, Heterogeneous Integ., SiP, Automotive...

Professional Development Courses (PDCs)

12 short courses on: 3D, Fanout, High Density Pkg, Cu Pillars, & more...

Exhibit Hall

A sold-out exhibition: 66 booths...the companies you need to see


Receptions, happy hour in the desert, and more networking & fun!


2018 Conference Overview:

The 14th Annual Device Packaging Conference (DPC 2017) will be held in Fountain Hills, Arizona, on March 5-8, 2018. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Courtesy of Amkor Technology

The Largest 2018 Conference Dedicated to...

Interposers, 3D IC & Packaging;

Fan-Out, Wafer Level Packaging
& Flip Chip;

Engineered Micro Systems/Devices
(including MEMS/Sensors, 3D Printing...)

More technical papers, keynotes, and coverage of FOWLP, 3D, and Micro Systems/Devices than any other competing Conference! If you can only attend one FOWLP/3D conference this year, make sure you don't miss DPC 2018...

Courtesy of Amkor Technology
Corporate Sponsor - Dow Electronic Materials



(Tues. & Wed.)

Premier Silver Sponsor: NAMICS


Device Packaging Poster Session

Please contact Brian Schieman by email at if you have questions about the technical program, exhibits, sponsorship, golf or PDCs.



Registration Information: (Early Registration Deadline: February 7, 2018)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; DOWNLOAD will contain the extended abstract and presentation as submitted by the presenter. DOWNLOAD will be emailed 15 approximately business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Early Fee
Through 2/7/18
Advance/Onsite Fee
After 2/7/18
IMAPS Member
Chapter Officer
Exhibits Only Pass w/ Lunch Included
Exhibits Only Pass NO Lunch Included
8x10 Exhibit (Member)
8x10 Exhibit (Non-Member)
Professional Development Course:
Each Course Registration is additional to the conference registration. Maximum of 1 morning course and one afternoon course can be selected. Attendees can opt for $0 exhibits only pass if they wish to take a PDC but NOT attend the conference/sessions.


Speaker Dates/Information:

  • Abstracts Deadline EXTENDED TO: November 8, 2017
  • Speaker Notification Emails: December 1, 2017
  • Extended Abstract Deadline: February 5, 2018
  • Hotel Reservation Deadline: February 7, 2018
  • Early Registration Deadline: February 7, 2018
  • Speaker Bios Due: February 15, 2018
  • Powerpoint/Presentation file for DOWNLOAD due not later than: March 8, 2018 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A) - Keynotes: 45 minutes (40 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Poster Session/Information
The poster session is planned to be an INTERACTIVE presentation. This means you do not start and complete a scheduled talk without interruption like in a regular/oral session. Speakers should have talking points and be at their poster throughout the entire session (Wednesday, March 8 from 5:30pm-6:30pm). You can "present" your scheduled materials, but more often the attendees will review your slides and ask questions. Or you can watch them and talk to them depending on which slide they are on. Authors may either print out each of their powerpoint slides on regular paper and tack them up in order, or prepare a large poster (or 2 even). Recommended poster size is typically 3x4 feet, with the max space on the board being 4 ft high x 8 ft wide. IMAPS staff will provide tacks to secure your print outs. The session is first-come-first-serve so there are not assigned poster boards/locations. POSTER SETUP FROM 4PM UNTIL 5:00PM on Wednesday, March 8.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.


Hotel Reservation Deadline - February 7, 2018

Housing accommodations must be made directly to:

WeKoPa Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

IMAPS Discounted Single/Double Room Rate: $179/night + taxes + fees


Book your hotel reservation today! We have reserved a block of rooms at the host hotel to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.

Hotel Scams Alert!
All reservations should be made directly with the hotel and within the IMAPS room block. We are not using a housing company. If any person or firm contacts you and offers to handle your reservations, please beware. They are completely unauthorized and possibly fraudulent. The convention industry is currently plagued by such groups. If you use one of them and experience any problems, including lost deposits and no reservation when you arrive, IMAPS may not be able to assist you. Please be aware in particular of one of these unauthorized firms – Exhibition Housing Services – whose salespeople have falsely claimed to be calling from IMAPS.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.


Device Packaging Sponsorship (Need to be ahead of your competition? Join this list today!)


Premier Platinum Sponsor: ASE US, Inc.
Premier Gold 
Sponsor - EMD Performance Materials
Premier Gold Sponsor - XYZTEC
Premier Silver Sponsor: Amkor Technology
Premier Silver Sponsor: NAMICS
Premier Silver Sponsor: Cadence
Premier Silver Sponsor: Mentor Graphics Premier Silver Sponsor: Kyocera
Corporate Sponsors
Corporate Sponsor - Dow Electronic Materials Corporate Sponsor - Technic
Mobile APP Sponsor: SETNA
SPTS - Corporate Sponsor
Corporate Sponsor - NGK NTK
Corporate Sponsor: Evatec
Corporate Sponsor: Applied Materials
Additional Event Sponsors

Mobile Station & Poster Session Sponsor: VEECO

Mobile Charging Station &
Poster Session Happy Hour

Poster Session Sponsor: SAMTEC

Poster Session Happy Hour

Break Sponsor - Intevac

Coffee Breaks (3)

Break Sponsor: 
TechSearch International

Coffee Break

Evening Panel & Reception Sponsor: Yield Engineering Systems, Inc.(YES)

Evening Panel & Reception

Break Sponsor: 
S3IP Binghamton University

Coffee Break

Kulicke and Soffa Industries

Bag Inserts & Web

Golf/Foundation Sponsors

"Birdie" Sponsor (1 hole):

DPC/GBC Premier Sponsor: ASE US, Inc.

Hole: 5 - Closest to Pin

"Birdie" Sponsor (1 hole):

EMD Performance Materials - Corporate Sponsor

Hole: 9 - Closest to Pin

"Birdie" Sponsor (1 hole):

Premier Gold Sponsor - XYZTEC

Hole: 15 - Closest to Pin

"Birdie" Sponsor (1 hole):

DPC/GBC Premier Sponsor: NAMICS

Hole: 12 - Longest Drive

"Birdie" Sponsor (1 hole):

Golf Hole Sponsor: Amkor Technology

Hole: 18 - Longest Putt

"Birdie" Sponsor (1 hole):

DPC Premier Gold Sponsor: Cadence

Hole: 1

"Birdie" Sponsor (1 hole):

Premier Silver Sponsor: Mentor Graphics

Hole: 2

"Birdie" Sponsor (1 hole):

Premier Silver Sponsor: Kyocera

Hole: 3

Golf Hole Sponsor: AGC Electronics America

Hole: 7 - Closest 2ND SHOT

Mobile Station & Poster Session Sponsor: VEECO

Hole: 6

Golf Sponsor: NxQ
Mask Aligners

Hole: 8

Golf Hole Sponsor: Nikon

Hole: 10

ASM Pacific - Hole Sponsor

Hole: 13

Corporate Sponsor - Technic

Hole: 14

Corporate Sponsor - Technic

Hole: 16

Golf Hole Sponsor: Advance Reproductions

Hole: 17

Golf Hole Sponsor: Dixon Golf

Hole: 4 - Straight Drive Competition
Hole: 11 - Hole-in-One Competition

Official Media Sponsors
3D Incites - Media Sponsor
Media Sponsor: Webcom - Electronics Protection


  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems