KESTER

13th International Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging

WekoPa Resort and Casino
Fountain Hills, Arizona USA

IMAPS Device Packaging

Conference and Technical Workshops
March 7-9, 2017
Exhibition and Technology Showcase
March 7-8, 2017
Professional Development Courses
March 6, 2017
GBC Plenary Session
March 8, 2017
Device Packaging (Amkor Image)
Courtesy of Amkor Technology
Device Packaging (RDEDCOM image)
Courtesy of US Army RDEDCOM AMRDEC

General Chair:
Gilles Poupon
CEA


General Chair-Elect:
Peter Ramm
Fraunhofer EMFT Munich


Past General Chair:
Rozalia Beica
Yole Developpement

Past General Chair:
Ron Huemoeller
Amkor Technology




SUBMIT ABSTRACTS | SUBMIT SHORT COURSES (PDCs) | SPEAKERS
EXHIBITION (Pre-Sales Open October 3 | Open to Public Nov. 1) | SPONSORSHIP
REGISTRATION | HOTEL


Amkor
Courtesy of Amkor Technology

The Largest 2017 Conference Dedicated to...

Interposers, 3D IC & Packaging;

Fan-Out, Wafer Level Packaging
& Flip Chip;

Engineered Micro Systems/Devices
(including MEMS/Sensors, 3D Printing...)

Amkor
Courtesy of Amkor Technology

The 12th International Conference and Exhibition on Device Packaging welcomed 526 total participants from 19 countries, sold out an 11th consecutive exhibit hall, and enjoyed a successful technical program! The conference also proudly welcomed: • A 10% increase in full conference attendees • 15% international attendees • 3 new sponsoring companies • Standing room only in the brand new SiP track • Plus, much more!

**2016 Conference presentations available at WWW.IMAPSOURCE.ORG**

We hope to see you March 6-9, 2017 for next year’s Device Packaging Conference!
NOW ACCEPTING ABSTRACTS, PDC PROPOSALS, AND EXHIBIT PRESALES (Open October 3).

Thank You to the Premier Sponsor:
DPC/GBC Premier Sponsor: ASE US, Inc.
DPC/GBC Premier Sponsor: Amkor Technology
DPC/GBC Premier Sponsor: NAMICS

 

2017 Conference Overview:

The 13th Annual Device Packaging Conference (DPC 2017) will be held in Fountain Hills, Arizona, on March 6-9, 2016. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Featuring 3 Topical Workshop Tracks:

Those wishing to present their work at the Device Packaging Conference must submit a ~500 word abstract electronically no later than November 4, 2016, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary ("extended abstract") with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 20, 2017. A post-conference DOWNLOAD containing the full presentation material as supplied by authors will be mailed after the event to all attendees. Please contact Brian Schieman by email at bschieman@imaps.org if you have questions.

Device Packaging Exhibit and Technology Show:

IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. Full 8' by 10' exhibit spaces will be available. To reserve booth space, please fill out the application form before December 1, 2016 at: www.imaps.org/devicepackaging or contact Brian Schieman by email at bschieman@imaps.org. The exhibits have sold out every year since 2006 and we expect a sell-out again in 2017 - so book before December!

Device Packaging Professional Development Courses (PDCs):

For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 6th, preceding the technical conference. PDC details and registration on-line soon. If you would like to participate as an instructor, please submit a description of your short course on-line at www.imaps.org/pdc no later than November 4, 2016.

 

Please contact Brian Schieman by email at bschieman@imaps.org if you have questions about the technical program, exhibits, golf or PDCs.

 

Device Packaging Poster Session

 


Registration Information: (Early Registration Deadline: February 1, 2017)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; DOWNLOAD will contain the extended abstract and presentation as submitted by the presenter. DOWNLOAD will be emailed 15 approximately business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 2/1/17
Advance/Onsite Fee
After 2/1/17
IMAPS Member
$750
$850
Non-Member
$850
$950
Speaker
$500
$600
Chair
$500
$600
Student
$300
$400
Chapter Officer
$500
$600
Exhibits Only Pass w/ Lunch Included
$30
$30
Exhibits Only Pass NO Lunch Included
$0
$0
8x10 Exhibit (Member)
$1600
$1900
8x10 Exhibit (Non-Member)
$2300
$2600
Professional Development Course:
Each Course Registration is additional to the conference registration. Maximum of 1 morning course and one afternoon course can be selected. Attendees can opt for $0 exhibits only pass if they wish to take a PDC but NOT attend the conference/sessions.
$400
$450

REGISTER ONLINE - SOON


Speaker Dates/Information:

  • Abstracts Deadline: November 4, 2016
  • Speaker Notification Emails: December 9, 2016
  • Extended Abstract Materials due: January 20, 2017
  • Hotel Reservation Deadline: February 1, 2017
  • Early Registration Deadline: February 1, 2017
  • Speaker Bios Due: March 1, 2017
  • Powerpoint/Presentation file for DOWNLOAD due not later than: March 9, 2017 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A) - Keynotes: 45 minutes (40 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

 

Housing
Hotel Reservation Deadline - February 1, 2017

Housing accommodations must be made directly to:

WeKoPa Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

IMAPS Discounted Single/Double Room Rate: AVAILABLE SOON

ONLINE RESERVATIONS - AVAILABLE SOON

Feel free to continue to try: Phone Reservations: (480) 789-5300
Mention IMAPS or IMAPS Device Packaging when booking by phone

Book your hotel reservation today! We have reserved a block of rooms at the host hotel to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.

Hotel Scams Alert!
All reservations should be made directly with the hotel and within the IMAPS room block. We are not using a housing company. If any person or firm contacts you and offers to handle your reservations, please beware. They are completely unauthorized and possibly fraudulent. The convention industry is currently plagued by such groups. If you use one of them and experience any problems, including lost deposits and no reservation when you arrive, IMAPS may not be able to assist you. Please be aware in particular of one of these unauthorized firms – Exhibition Housing Services – whose salespeople have falsely claimed to be calling from IMAPS.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.

 

Device Packaging Sponsorship (Need to be ahead of your competition? Join this list today!)

PREMIER SPONSORS

DPC/GBC Premier Sponsor: ASE US, Inc.

DPC/GBC Premier Sponsor: Amkor Technology

DPC/GBC Premier Sponsor: NAMICS

Corporate Sponsors
EMD Performance Materials - Corporate Sponsor
   
Event Sponsors

 

 

 

 

Golf/Foundation Sponsors

"Eagle" Sponsor (3 holes):
DPC/GBC Premier Sponsor: ASE US, Inc.

Holes: #1, #12 - Closest to Pin, #16

"Birdie" Sponsor (1 hole):
Golf Hole Sponsor: Amkor Technology

Hole #3 - Longest Drive

"Eagle" Sponsor (3 holes):
DPC/GBC Premier Sponsor: NAMICS

Holes: #2, #8 - Closest to Pin, #18

EMD Performance Materials - Corporate Sponsor

Hole #14 - Closest to Pin

Golf Hole Sponsor: AGC Electronics America

     
Official Media Sponsors
       

 



CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • GaN Systems
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Qualcomm
  • Quik-Pak
  • Specialty Coating Systems