9th International Conference and Exhibition on Device Packaging www.imaps.org/devicepackaging Radisson Fort McDowell Resort and Casino Scottsdale/Fountain Hills, Arizona USA

Conference and Technical Workshops March 12-14, 2013 Exhibition and Technology Showcase March 12-13, 2013 Professional Development Courses March 11, 2013 GBC Spring Conference March 10-11, 2013 In conjunction with the Global Business Council (GBC) Spring Conference, March 10-11 Courtesy of Rensselaer Polytechnic Institute Courtesy of US Army RDEDCOM AMRDEC General Chair: James Lu Rensselaer Polytechnic Institute General Chair-elect (PDCs): Ron Huemoeller Amkor Technology Past General Chair (Panels): Peter Elenius E&G Technology Partners 3D & 2.5D Packaging Topical Workshop Flip Chip & Wafer Level Packaging Topical Workshop MEMS & Microsystems Topical Workshop LED Packaging for SSL Topical Workshop Technical Chair: Rozalia Beica Lam Research AG Technical Chair: Linda Bal Freescale Semiconductor Technical Chair: Tracy Hudson US Army Technical Chair: Thomas Goodman E&G Technology Partners Technical Co-Chair: Peter Ramm Fraunhofer EMFT Technical Co-Chair: Luu Nguyen Texas Instruments Technical Co-Chair: Russell Shumway Amkor Technology Technical Co-Chair: Bob Karlicek Rensselaer Polytechnic Institute Exhibit Booths are now SOLD OUT Early Registration & Hotel Deadlines: February 8, 2013

Technical Program | Download Final Program PDF | Professional Development Courses (PDCs)
Registration Information | Speaker Info
Exhibition Details | Floorplan | 2013 Exhibitors | 2012 Exhibitors
Global Business Council (GBC) Spring Conference
Spring Golf Invitational | Texas Hold'em Tournament

Thank you to the DPC/GBC Premier Sponsors:

Device Packaging 2013 was another great conference. Thank you to all the sponsors, exhibitors, speaker, attendees, and volunteers! The exhibit hall sold again for the 8th consecutive year. We saw more than 520 attendees participating in 2013. The 2014 Conference looks to improve upon this and expected to again be considered the largest and most important show decidated to 3D Packaging, Flip Chip/WLP, MEMS, LEDs and the addition of other "Emerging Technologies" - Photonics Packaging and more.

2013 Conference Overview:

The ninth Annual Device Packaging Conference (DPC2013) was held in Scottsdale, Arizona, on March 11-14, 2013. It was an international event sponsored and organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The 2013 conference featured technical sessions, a panel discussion, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provided a focused forum on the latest technological developments in 4 topical workshop tracks related to microelectronic packaging: Advanced 3D Packaging; Flip Chip & Wafer Level Packaging; MEMS & Associated Microsystems; and LED Packaging for Future Solid-State Lighting. The latest technologies were presented over 2 1/2 days of 15 technical sessions, 1 poster session, 6 keynotes addresses, more than 75 technical presentations, and more 3D content than ever before - an expanded 3D Track featuring multiple parallel sessions.

Device Packaging 2013 featured...

...and that's only the technical side of the Conference! There were also a lot of other exciting activites held -- the 2013 IMAPS Microelectronics Foundation Spring Golf Invitational, the Welcome & Exhibitor Receptions, the 3rd Annual Texas Hold'em Tournament, to name only a few.

Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715 if you have questions about the technical program, exhibits, golf or PDCs.

Technical Program | Professional Development Courses (PDCs) | Exhibition Information

Registration Information: (Early Registration Deadline: February 8, 2013)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) USB of presentations; USB will contain the extended abstract and presentation as submitted by the presenter. USB will be mailed 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Housing
Hotel Reservation Deadline - February 8, 2013

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

$155 single/double

Hotel Scams Alert!
Beware of Hotel Scams! Exhibition Housing Services has been soliciting several exhibitors indicating that they are the official housing vendor for IMAPS Device Packaging 2013 Please note that they are NOT affiliated with the show at all and are not working in your best interest. Booking rooms through companies such as Exhibition Housing Services could result in false reservations and a loss of deposit money.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.

Speaker Dates/Information:

• Abstracts Deadline Extended Until: December 7, 2012
• Speaker Notification Emails: January 14, 2013
• Extended Abstract or Abstract Book Materials due: February 8, 2013
• Hotel Reservation Deadline: February 1, 2013
• Early Registration Deadline: February 1, 2013
• Speaker Bios Due: March 1, 2013
• Powerpoint/Presentation file for CD-Rom due not later than: March 14, 2013 (Last day of Conference)
• Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
• Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A) - Keynotes: 45 minutes (40 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

DPC/GBC Premier Sponsors:

Sponsor - Post-Conference Presentations USB Drives:

Sponsor - Exhibit Reception, Lunch & Break:

Sponsor - Conference Lanyards:

Sponsor - 3D Panel:

Sponsor:

Sponsor:

Sponsor:

Sponsor - Refreshment Breaks:

Sponsor - Refreshment Breaks:

Sponsor - Refreshment Breaks:

Sponsor - GBC Speaker Dinner:

"Eagle" Golf Sponsors:

"Birdie" Golf Sponsor:

Golf Hole Sponsors: