6th International
Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging
Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA
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Conference and Technical Workshops
March
9-11, 2010
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Exhibition and Technology Showcase
March
9-10, 2010 |
Professional
Development Courses
March 8, 2010 |
GBC
Spring Conference
March
7-8, 2010 |
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Courtesy of Rensselaer Polytechnic Institute |
Courtesy of US Army RDEDCOM AMRDEC |
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General Chair:
Phil Garrou
Microelectronic Consultants of NC
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3D Packaging
Topical Workshop
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Flip Chip Technologies
Topical Workshop
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Wafer Level Packaging
Topical Workshop
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MEMS & Microsystems
Topical Workshop
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Emerging Tech (LEDs & Passives)
Topical Workshop
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Technical
Co-Chair:
James J.-Q. Lu
Rensselaer Polytechnic Institute
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Technical
Co-Chair:
Linda Bal
Freescale Semiconductor
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Technical
Co-Chair:
Ted Tessier
FlipChip International
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Technical
Co-Chair:
Robert Dean
Auburn University
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Technical
Co-Chair:
Frank Wall
Philips
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Technical
Co-Chair:
Lee Smith
Amkor Technology
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Technical
Co-Chair:
Lou Nicholls
Amkor Technology
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Technical
Co-Chair:
Andrew Strandjord
Pac Tech USA
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Technical
Co-Chair:
Tracy Hudson
US Army
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Technical
Co-Chair:
Robert Heistand
AVX
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EARLY REGISTRATION CUT-OFF: FEBRUARY 19, 2010
HOTEL DEADLINE:
FEBRUARY 4, 2010
On-line Registration | Hotel Reservations
Technical Program | Speaker Information | Professional Development Courses (PDCs)
Exhibition | Reserve Exhibits
On-line | Floorplan | 2010 Exhibitors | 2009 Exhibitors
Global Business Council (GBC) Spring
Conference
Conference Overview:
The Sixth Annual Device Packaging Conference (DPC2010) will be held in Scottsdale, Arizona, on March 8-11, 2010. It is an international event sponsored and organized by the International Microelectronics And Packaging Society (IMAPS).
This year’s conference will feature technical sessions, four plenary speakers, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 6 topic areas related to microelectronic packaging: 3D Packaging; Flip Chip Technologies; MEMS & Associated Microsystems; Wafer Level Packaging; Passive Integration and LED. Technical presentations in these 6 topic areas cover a full range of issues from new developments and materials through manufacturing and reliability. The professional development courses offered are also focused on these topical areas of microelectronics and offer an additional valuable resource to attendees. The Global Business Council (GBC) will co-locate its Spring Conference March 7-8, focusing on the business aspects of these technologies. There will be several networking receptions and gatherings throughout the week, including the opening reception, meals, and other social events.
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.
Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. Only a few booths remain. Please review the exhibit information or contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.
View the Technical Program | On-line Registration
Housing
Hotel Reservation Deadline - February 4, 2010
Housing accommodations must be made directly to:
Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264
$149 single/double
Phone Reservations: (480) 789-5300
Online Reservations: http://www.radisson.com/reservation/resEntrance.do?pacLink=Y&promoCode=IMAP10&hotelCode=AZMCDOWE Or use Promotional Code: IMAP10 from the hotel’s direct website: http://www.radisson.com/hotels/azmcdowe
**Working on special reservation process for government rate.
Speaker Dates/Information:
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