Heraeus ELD

11th International Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging

WekoPa Resort and Casino
Fountain Hills, Arizona USA



Conference and Technical Workshops
March 17-19, 2015
Exhibition and Technology Showcase
March 17-18, 2015
Professional Development Courses
March 16, 2015
NEW** GBC Plenary Session on IoT
March 18, 2015




Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC


General Chair:

Ron Huemoeller
Amkor Technology

General Chair-elect
(Panels & Keynotes):

Rozalia Beica
Yole Developpement
Past General Chair
(PDCs):

James Lu
Rensselaer Polytechnic Institute
Past General Chair
(Technical):

Paul Siblerud
Strategic Tech Analysis, LLC

3D & TSV
Track
Flip Chip & Wafer Level Packaging
Track
Engineered Microsystems & Devices (includes MEMS & Sensors) Track
Photonics, LED & Emerging Technologies Track
Technical Co-Chair:
Peter Ramm
Fraunhofer EMFT Munich
peter.ramm@emft.fraunhofer.de
Technical Co-Chair:
John Aday
Qualcomm
jaday@qti.qualcomm.com
Technical Co-Chair:
Robert Dean
Auburn University
deanron@auburn.edu
Technical Co-Chair:
John Mazurowski
Penn State Electro Optics Center
jmazurowski@eoc.psu.edu
Technical Co-Chair:
Jeff Calvert
Dow Electronic Materials
jcalvert@dow.com
Technical Co-Chair:
John Hunt
ASE US
John.Hunt@aseus.com
Technical Co-Chair:
Russell Shumway
Amkor Technology
russell.shumway@amkor.com
Technical Co-Chair:
TBD


Early Registration & Hotel Deadlines: February 17, 2015

 

Thank You to the DPC/GBC Premier Sponsors:
DPC/GBC Premier Sponsor: VEECO
DPC/GBC Premier Sponsor: Amkor Technology
DPC/GBC Premier Sponsor: ASE US, Inc.



REGISTER ONLINE
Registration Information | Hotel Reservations

Speaker Info | Student Competition
Exhibition Details | Floorplan | 2015 Exhibitors | 2014 Exhibitors
Global Business Council (GBC) Plenary Session on Internet of Things (IoT) ** NEW held Wednesday

Charity Spring Golf Invitational | Charity Texas Hold'em Tournament


**THE TECHNICAL PROGRAM WILL BE ONLINE TODAY (JANUARY 28)**

2015 Conference Overview:

The 11th Annual Device Packaging Conference (DPC 2015) will be held in Fountain Hills, Arizona, on March 16-19, 2015. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Featuring Topical Workshop Tracks on:

  • Advanced 3D IC & Packaging;

  • Flip Chip and Wafer Level Packaging;

  • Microsystems & Devices (includes MEMS & Sensors); and

  • Photonics Packaging & Other Emerging Technologies

 

 

Device Packaging Exhibit and Technology Show:

IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. Full 8' by 10' exhibit spaces will be available. To reserve booth space, please fill out the application form before February 1, 2015 at: www.imaps.org/devicepackaging or contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621. The exhibits have sold out every year since 2006 AND HAVE SOLD OUT AGAIN FOR 2015! We have more than 10 exhibitors on a wait-list at this time.

 

 

 

Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621 if you have questions about the technical program, exhibits, golf or PDCs.

 


Registration Information: (Early Registration Deadline: February 17, 2015)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; DOWNLOAD will contain the extended abstract and presentation as submitted by the presenter. DOWNLOAD will be emailed 15 approximately business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 2/17/15
Advance/Onsite Fee
After 2/17/15
IMAPS Member
$700
$800
Non-Member
$800
$900
Speaker
$450
$550
Chair
$450
$550
Student
$275
$375
Chapter Officer
$450
$550
Exhibits Only Pass w/ Lunch Included
$30
$30
Exhibits Only Pass NO Lunch Included
$0
$0
8x10 Exhibit (Member) - SOLD OUT
$1300
$1500
8x10 Exhibit (Non-Member) - SOLD OUT
$2000
$2200
Professional Development Course:
Each Course Registration is additional to the conference registration. Maximum of 1 morning course and one afternoon course can be selected OR just the one full-day course by Tom Green (8-hour | $600/650 fee). Attendees can opt for $0 exhibits only pass if they wish to take a PDC but NOT attend the conference/sessions.
$400
$600 (Tom Green PDC)
$450
$650 (Tom Green PDC)

REGISTER ONLINE


Housing
Hotel Reservation Deadline - February 17, 2015

Housing accommodations must be made directly to:

WeKoPa Resort & Casino
(The Fort McDowell Yavapai Nation re-launched the Radisson Fort McDowell Resort as the new We-Ko-Pa Resort & Conference Center effective October 1, 2014)
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

IMAPS Discounted Single/Double Room Rate: $175/night + Taxes and Fees

On-Line Reservations

Phone Reservations: (480) 789-5300
Mention IMAPS or IMAPS Device Packaging when booking by phone

Hotel Scams Alert!
All reservations should be made directly with the hotel and within the IMAPS room block. We are not using a housing company. If any person or firm contacts you and offers to handle your reservations, please beware. They are completely unauthorized and possibly fraudulent. The convention industry is currently plagued by such groups. If you use one of them and experience any problems, including lost deposits and no reservation when you arrive, IMAPS may not be able to assist you. Please be aware in particular of one of these unauthorized firms – Exhibition Housing Services – whose salespeople have falsely claimed to be calling from IMAPS.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.



Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions.

The Device Packaging student review committee will evaluate all student papers/posters and award at a total of $3,000 in awards checks at/following the Conference: $1500 first prize, $1000 second prize, and $500 third prize. The selected student(s) must attend the event to present his or her work and receive the award.

The Microelectronics Foundation


 

Speaker Dates/Information:

  • Abstracts Deadline Extended: December 5, 2014
  • Speaker Notification Emails: January 14, 2015
  • Extended Abstract or Abstract Book Materials due: February 13, 2015
  • Hotel Reservation Deadline: February 17, 2015
  • Early Registration Deadline: February 17, 2015
  • Speaker Bios Due: March 1, 2015
  • Powerpoint/Presentation file for CD-Rom due not later than: March 19, 2014 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A) - Keynotes: 45 minutes (40 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

 

Device Packaging/GBC Sponsors

Premier Sponsor:
DPC/GBC Premier Sponsor: VEECO

Premier Sponsor:

Golf Hole Sponsor: Amkor Technology

Premier Sponsor:
DPC/GBC Premier Sponsor: ASE US, Inc.

Sponsor - Badge Lanyards:
Hole Sponsor: NAMICS
Sponsor - GBC Speaker Dinner:
Kyocera - GBC Speaker Dinner Sponsor
Poster Session "Happy Hour":
Sponsor: Lam Research

sponsorships
available



CORPORATE PREMIER MEMBERS
  • Amkor
  • Canon
  • Corning
  • Honeywell
  • Indium
  • Isola Group
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Natel
  • Palomar
  • Plexus
  • Quik-Pak
  • Specialty Coating Systems