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4th International
Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging
Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA
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Conference and Technical Workshops
March
17-20, 2008
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Exhibition and Technology Showcase
March
18-19, 2008 |
Professional
Development Courses
March 17, 2008 |
GBC
Spring Conference
March
16-17, 2008 |
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Courtesy of FlipChip International, LLC |

Courtesy of Rensselaer Polytechnic Institute |
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General Chair:
Ted Tessier
FlipChip International
Chief Technical Officer |
Technical
Co-Chair:
Beth Keser
Freescale Semiconductor |
Technical
Co-Chair:
Christo Bojkov
MAXIM |
Technical
Co-Chair:
Robert Dean
Auburn University |
Technical
Co-Chair:
Peter Tortorici
Medtronic Microelectronics Center |
Technical
Co-Chair:
Lou Nicholls
Amkor Technology Inc. |
Technical
Co-Chair:
James J.-Q. Lu
Rensselaer Polytechnic Institute |
Technical
Co-Chair:
Ajay Malshe
University of Arkansas |
Technical
Co-Chair:
Steve Adamson
Asymtek |
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Device Packaging Advance Program
Register On-Line | Hotel Reservations | Speaker Information
Download Advance Program (pdf) | Professional Development Courses
Exhibition | Floorplan | 2008 Exhibitors
Global Business Council (GBC) Spring
Conference
THE EXHIBIT FLOOR HAS SOLD OUT
The Fourth Annual Device Packaging Conference (DPC2008) will be held in Scottsdale, Arizona, on March 17-20, 2008. It is an international event sponsored and organized by the International Microelectronics And Packaging Society (IMAPS).
This year’s conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 5 topic areas related to microelectronic packaging: Flip Chip; Wafer Level/Chip Scale Packaging; 3-D Packaging; MEMS; and Biomedical. Technical presentations in these 5 topic areas cover a full range of issues from new developments and materials through manufacturing and reliability. The professional development courses offered are also focused on these 5 topical areas of microelectronics and offer an additional valuable resource to attendees. The Global Business Council (GBC) will co-locate its Spring Conference March 16-17, focusing on the business aspects of these technologies. There will be several networking receptions and gatherings throughout the week, including the opening reception, meals, and other social events.
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.
HOUSING
Hotel Reservation Deadline - February 14, 2008
Housing accommodations must be made directly to:
Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264
$209/night
Rooms on hold March 15 – 20, 2008
For on-line reservations: www.radisson.com/ftmcdowellaz - promotional code - IMAPS1
For phone reservations: call (480) 789-5300 or (800) 333-3333 and mention IMAPS – Device Packaging Conference
Hotel availability and rates will not be guaranteed after February 12, 2008.
Speaker Dates/Information:
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Corporate
Sponsors:


Student Paper Competition
Sponsors:


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