IMAPS - International Microelectronics And Packaging Society: Bringing together the entire microelectronics supply chain!


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IMAPS 2nd Advanced Technology Workshop on
Reliability of Advanced Electronic Packages and
Devices in Extreme Cold Environments

February 27 – March 1, 2007
Embassy Suites Hotel Arcadia – Pasadena Area
211 East Huntington Drive
Arcadia, California - USA

Courtesy of JPL/NASA
Photo courtesy of JPL/NASA

General chair:
Dr. Rajeshuni Ramesham
Jet Propulsion Laboratory, California Institute of Technology
Phone: 818-354-7190, Fax: 818-393-4382
E-mail: Rajeshuni.Ramesham@jpl.nasa.gov
Technical Program Chair:
Dr. Chris Van Hoof
IMEC
Phone: +32 16 28 81 80; Fax: +32 16 28 15 01
E-mail: vanhoofc@imec.be


EARLY REGISTRATION AND HOTEL DEADLINE:
February 9, 2007


Register | Hotel Information
Technical Program | Download PDF of Program
| Speaker Dates/Info


Workshop Overview

The objective of this Advanced Technology Workshop (ATW) is to have a unique technical forum that brings together industrialists, scientists, engineers, space agencies and academia who have been working in the area of advanced electronic package reliability and electronic device reliability in extreme cold to hot temperature environments. Studies in extreme thermal and radiation environments are extended beyond nominal operating temperature regimes and radiation levels. Validation of the electronic packages assembled with various electronic parts over a wide temperature range to infuse into future space missions is of significant value for space applications. The other goal of this ATW is to expedite the infusion of cutting-edge technology into present and future NASA projects, missions, and science instruments. This ATW is partially providing the mechanism to create an international network of electronics developers and systems designers by bringing together representatives from academia and the space agencies. This Workshop covers active and passive devices, circuits/systems, advanced packaging, instruments, and reliability under extreme cold to hot temperatures and radiation environments. This is the second workshop in a series that is being organized in the USA since there is a significant interest for NASA and other space agencies in missions to Mars, the Moon, Deep Space Missions and beyond.

Featuring Keynote/Invited Presentations:

Tuesday Keynote Presentation: 8:30 am - 9:30 am
MER Project: Stealing Success from the Jaws of Failure

Robert M. Manning, NASA / Jet Propulsion Laboratory

Featured Session on Technology to Liquid Helium Temperatures for Space Applications
Tuesday, 9:30 am – Noon
Chairs: Chris van Hoof & Patrick Merken, IMEC

Tuesday Lunch Speaker: 12:30 pm - 1:15 pm
Mars Exploration Rover Surface Mission Flight Thermal Performance

Keith Novak, Charles Phillips, Eric Sunada, Gary Kinsella, Jet Propulsion Laboratory

Tuesday Dinner Speaker: 6:15 pm - 7:00 pm
Cryoelectronics and Their Use in the JWST Optical Telescope Element Control Electronics

Sandor Demosthenes, Randy Abbott, Ball Aerospace & Technologies Corp.

Wednesday Keynote Presentation: 8:30 am - 9:10 am
Extreme Temperature Electronics based on Self-Adaptive System using Field Programmable Gate Array

Didier Keymeulen, Ricardo Zebulum, Ramesham Rajeshuni, Adrian Stoica, Jet Propulsion Laboratory; Srinivas Katkoori, University of South Florida; Sharon Graves, Frank Novak, Charles Antill, NASA LaRC

Wednesday Lunch Speaker: 12:30 pm - 1:15 pm
Titan and Enceladus Mission Overview

Kim R. Reh, Jet Propulsion Laboratory

Thursday Keynote Presentation: 8:30 am - 9:00 am
TBD

Texas Instruments

 

Technical Program | Register


Speaker Dates/Information:

  • Extended Abstract or Presentation Material due: February 9, 2007
  • Powerpoint/Presentation file for CD-Rom due not later than: March 1, 2007
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

 

 


 


IMAPS-International Microelectronics And Packaging Society
and The Microelectronics Foundation
Everything in electronics between the chip and the system!
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