GBC - Addressing the Business Side of Microelectronics
(formerly the Microelectronics Market Research Council, MMRC)

GBC Summer Conference 2004

Global Flip Chip Business Overview

June 21, 2004
Austin Marriott at the Capitol
Austin, Texas

Conference Presentations
(Keyword Search links in PDF files will not work online)

Monday June 21, 2004

7:00 AM Registration Opens

7:30 AM Continental Breakfast

8:00 AM Opening Remarks

Michael O’Neill, Chairman, GBC Steering Committee
Western Sales Manager, Thick Film Products, Heraeus-Circuit Materials Division

Ted Tessier, Chairman, Flip Chip Topical Workshop & Exhibition
Senior MTS, ST Assembly and Test Services

Session 1 Flip Chip Market Overview
Session Chair: Adam Singer, Market Research Specialist, Cookson Electronics

8:15 AM: Semiconductor Market: Mid-Year Forecast
Trevor Yancey, Vice President of Technology, IC Insights

9:15 AM: Flip Chip End User Market
William Chen, Senior Technical Advisor, ASE

10:15 AM: Break

10:30AM: Global Flip Chip Business Overview
Jan Vardaman, President, TechSearch International

Session 2: Alliances and Acquisitions
Session Chair: Mike Kunselman, Global Marketing Leader-Microelectronics, Dow Corning

11:30 AM: Case Study: Buyout & Start-up of Flip Chip International, LLC
Bob Forcier, Flip Chip International

12:30 PM: LUNCH

1:30 PM: Case Study: Two Acquisitions/Alliances: Kyocera/IBM (Yasu, Japan) and ASE/Compeq
Nick Pearne, Director, BPA Consulting Ltd.

Session 3: Infrastructure
Session Chair: Jan Vardaman, President, TechSearch International

2:30 PM: How to Grow a Flip Chip Bumping Service
Thomas Oppert, Pac Tech

3:30 PM: Break

3:45 PM: APiA - Advanced Packaging and Interconnect Alliance
Ellery Buchanan, Senior Vice President, Marketing and Corporate Development,
Ultratech, Inc.

4:45 PM: SECAP - Semiconductor Equipment Consortium for Advanced Packaging
Michael Topper, Dept. MCM, Project Leader, Thin/Film CSP, Fraunhoffer IZM

5:45 PM: *Speaker's Panel Discussion
Moderated by Gail Flowers, Editor, Advanced Packaging, PennWell Corporation

6:30 PM: *Networking Reception

7:30 PM: Closing Remarks, Adjourn