GBC Spring 2006 Conference
(download program as pdf)

The Business Side of Device Packaging

March 19 & 20, 2006
Doubletree Paradise Valley Resort
Scottsdale, AZ

(immediately preceding and co-located with Device Packaging 2006
$100 discount if attending both GBC and Device Packaging)

Register On-Line | Hotel | Device Packaging Program

The Global Business Council (GBC) is holding its Spring 2006 Conference on “The Business Side of Device Packaging” in sunny Scottsdale, AZ, on March 19 & 20, 2006. This GBC Conference immediately precedes the IMAPS Device Packaging Conference, at the same location, and will parallel the technical session topics by focussing on the business aspects of: Flip Chip, Copper/Low K, 3D Packaging, MEMS, and Optoelectronics. Invited speakers from industry leaders and well-known market research companies, will share with you where they see the opportunities and challenges in these markets. In addition to a keynote presentation by a leading OEM, the conference will also feature a Semiconductor Interconnect Roadmap and a Semiconductor Industry Forecast Update. Several networking events are planned to allow full interaction with your industry peers.

Sunday, March 19, 2006
12:00 Noon – GBC Golf Tournament
(Bus leaves at 11:00 AM returns at 5:00 PM)
Sanctuary Golf Course, Scottsdale, AZ

3:00 PM – Registration Opens

6:00 PM – Welcome Reception

6:30 PM – Keynote Address
Mark Brillhart, Director of Advanced Manufacturing Technology
CISCO Systems, Inc.
Next Generation Packaging and Modules for Advanced Switching and Routing Applications

Monday, March 20, 2006
7:00 AM – Registration Opens

7:30 AM – Continental Breakfast

8:00 AM – Opening Remarks
Laurie Roth, GBC Co-Chair

8:15 AM - Flip Chip
Flip Chip Comes of Age: The Expansion of Flip Chip Packages into High Volume - Jan Vardaman, President, TechSearch International

9:00 AM - Copper/Low K Packaging Issues
Maniam Alagaratnam, VP of Package Dev., LSI Logic

9:40 AM - Break

10:00 AM - Semiconductor Industry Update
Brian Matas, Vice President, IC Insights

10:45 AM - Semiconductor Interconnect Roadmap
The Impact of Future Technologies to the Entire Vertical Supply Chain - Nicholas Leonardi, VPt, CMC Interconnect

11:30 AM - 3D
To SiP or PoP? The Business and Logistic Factors
in 3D Packaging - Lee Smith, Senior Director, Business Development, Amkor

 12:15 PM - Lunch

1:30 PM - MEMS
MEMS Market Quest: Navigating the Road to Success - Marlene Bourne, Senior Director, Nanotechnology & MEMS, Global Crown Capital

2:15 PM - High Frequency/Microwave
Emerging High-Frequency Trends and How They Affect Packaging - Jack Browne, Techncal Director,
Microwaves & RF

3:00 PM - Break

3:30 PM - Optoelectronics
Global Market & Technology Trends in Optoelectronics - Michael Lebby, Executive Director, OIDA

4:15 PM - Closing Remarks and Adjourn


GBC Attendees are invited to attend the Device Packaging Welcome Reception and Keynote Address.

Housing (Hotel Cut-off is February 10, 2006)
Housing Accommodations must be made directly to:

Doubletree Paradise Valley Resort
5401 North Scottsdale Road
Scottsdale, AZ 85250
Ph: 480-947-5400 or 877-445-6677

Single/Double - $199

Reserve room(s) on-line at: http://doubletree.hilton.com/en/dt/groups/private_groups/phxsjdt_ims/index.jhtml.

Please reference IMAPS when making reservations by phone.

 

Register On-Line | Device Packaging Program