About the GBC | Steering Commitee
Roadmap Initiative

Archived Events:
2008 Spring Conference | February 21 Virtual Meeting
IMAPS 2007 GBC Marketing Forum | 2007 GBC Spring Conference
GBC Spring Conference 2006 | IMAPS 2005 - Marketing Forum Presentations
GBC Winter Conference 2005 | GBC Presentations from IMAPS 2004
IMAPS 2004 - GBC Marketing Forum | IMAPS 2004 - GBC Business Spotlight Sessions
GBC Summer Conference 2004 | Summer Conference Presentations

Global Business Council
By: Laurie S. Roth
Laurie S. Roth Marketing
Global Business Council (GBC), IMAPS
lauriesroth@yahoo.com

The GBC is actively involved in the following areas, aiming to add value to our corporate membership.

4-Tiers – To further the 4-Tiers iniative, the GBC has participated in forming a matrix which identifies the key supply chain elements by industry segment (Aerospace, Military & Security, Automotive Electronics, Biotech & Medical Electronics, Communications, Computers, Office & Peripherals, Consumer Electronics, Energy and Industrial/Lab) across the four main tiers of the supply chain (Industry Segment/End Market, Systems, Devices & Applications, Design, and Processes & Materials.) Corporate members will be identified by area in which they operate to help prospective customers find appropriate sources for their needs.

Roadmap Initiative - View Complete Roadmap - PDF | PPT
The GBC intends to play a greater role in working with the National Technical Committee (NTC) to scout for and address topics valuable to you, the key benefactors of our programs. We believe that we can communicate the challenges that face the various industry segments we serve, and that we can turn them into action items to be addressed by the IMAPS technical community.

One way to do this is through the well-proven roadmap process. Excellent roadmaps already exist with methods in place to update them on a regular basis. We looked at the International Technology Roadmap for Semiconductors (ITRS) and International Electronics Manufacturing Initiative (iNEMI) roadmaps which both have chapters on semiconductor assembly and packaging.

The GBC intends to take the ITRS and iNEMI roadmaps output on semiconductor assembly and packaging and communicate it throughout the IMAPS community and the NTC, so that we can drive our actions toward developing the capabilities needed to meet the roadmap challenges. We will focus on the gaps identified in the roadmaps that are barriers to the success of the market segments identified in the roadmaps (Automotive, Medical, Aerospace & Defense, Communications, Computer, and Consumer). In the coming months, as our plans take shape, you will hear more from us about this initiative.

View Complete Roadmap - PDF | PPT

GBC Goes “Global” with Regional GBC in Europe
The GBC Steering Committee in North America provided advice and assistance to help the GBC in Europe get going. They already have two important events planned for 2007.

The GBC recently held the following successful events:

GBC Spring Meeting – The Business Side of Device Packaging and Industry Forecast. Just prior to the Device Packaging Conference in Scottsdale, Arizona, the GBC held its Spring Event with a business-oriented program.  In addition to the Golf Tournament which benefitted the Microelectronics Foundation, attendees participated in a welcome reception with keynote speakers and an all day conference on issues affecting our industry.

• Jim Drehle, as trustee of the Microelectronics Foundation, addressed the growing need for fresh talent as baby-boomers retire, depleting the U.S. engineering workforce by over 50%.  He explained how the the Foundation is preparing for the future by developing future leaders, training the teachers, setting up university internship programs, and intervening at the high school level. 
• Satya Chillara, senior analyst for semiconductors with Pacific Growth Equities brought us up to date with Wall Street’s perspective on growth in the semiconductor indusry.  In 2006, the 5-year average sales growth of semiconductors was 12%, with unit growth at 15%, but average selling prices declining by 2%.  Growth is slowing over time, but still ahead of GDP rates.  Previous semiconductor cycles lastest two years, but now the cycles are much shorter, averaging three quarters.  This is due to much tighter controls on inventory and faster reaction times. 
• Brandon Prior, from Prismark Partners, focused on new advanced packaging technologies, explaining that advanced packaging represents 20% of unit volume, but 50% of value.  He sees the challenges in thermal performance, test, yield and cost.
• Chuck Richarsdon presented the iNEMI Roadmaps and how IMAPS could participate in this effort with the ITRS Roadmap chapter on Semiconductor Assembly and Packaging.
• Phil Thomas from Dupont Electronics Technologies shared examples of Dupont’s threshold criteria for new product development and how they bring to bear the “voice-of-the-customer” to identify key market drivers.
• Lee Smith from Amkor Technologies talked about application-specific packaging and how there is still a lot of innovation in low pin-count packages.  He explained how Package-on-Package development was driven by business and logistics issues rather than technology needs.  System-in-Pacakge is an important area with double the rate of IC growth. 
• Brian Matas from IC Insights forecasted 2008 to be the next cyclical peak in the industry with 20% growth.  Video is the new applications driver.  IC units are slated to grow 10% per year over the next ten years.  By 2010, the semiconductcor market will be worth $400 billion.
• Mike Shields from RF Devices described the role of CMOS in the RF Front End of wireless communications and what to look forward to in regards to System-in-Pacakge vs System-on-Chip and cognitive radio.
• Randy Frank of Randy Franck & Associates addressed the opportunities for microelectronics packaging in the automotive market with 63 million vehicles produced in 2005 with ever increasing IC content.
• Peter Tortorici from Medtronics Microelectronics Center showed some remarkable examples of implantable device miniaturization while increasing functionality and showed how the medical electronics industry is changing from providing devices to providing care. 
  

IMAPS has long been a society serving the interests of membership through various symposia, focused technology workshops, and local technical meetings. While the focus of the IMAPS program is largely technical in nature, one initiative within IMAPS is designed to address the business side of the IMAPS portfolio of technologies. Recently the Microelectronics Marketing Research Council (MMRC) has revised its charter to broaden its focus globally as well as addressing additional business topics. With this change in charter, the initiative is renamed the Global Business Council.

What is the Global Business Council?

The Global Business Council (GBC) is an IMAPS initiative that focuses on business issues related to the technology areas addressed by the corporate organizational members of IMAPS. The revised charter is as follows:

• PURPOSE: The IMAPS Global Business Council (GBC) is an initiative within IMAPS which leads the development and communication of the business view of and for the IMAPS corporate membership.

• MISSION: The mission of the GBC is to provide value to IMAPS corporate membership by focusing on the business side of technology for microelectronics and packaging. This will be accomplished by development and presentation of events highlighting relevant business topics of interest to corporate membership.

The GBC is managed by a dedicated volunteer Steering Committee and support from IMAPS staff. The composition of the GBC Steering Committee is representative of a cross-section of dynamic business leaders who are in touch in some fashion with the business of microelectronics and packaging technologies. This team has invested its time to organize events that touch on today’s global business condition.

The members of the GBC Steering Committee are listed below:

Mr. Steve Adamson
Asymtek
sadamson@asymtek.com

Mr. Greg Caswell - Vice-Chair GBC Steering Committee
D2M Technologies
gcaswell@imaps.org

Mr. Jeffrey C. Demmin - IMAPS Publications Committee Chair
Tessera Technologies, Inc.
jdemmin@tessera.com

Mr. Jim Drehle - IMAPS 2006 President
jim_drehle@imaps.org

Mr. Steve Greene - IMAPS, Membership Manager
IMAPS
sgreene@imaps.org

Mr. Howard W. Imhof - Chair GBC Steering Committee
Metalor Technologies USA
howard.imhof@metalor.com

Mr. Harry Kellzi
Teledyne Microelectronic Technologies
hkellzi@teledyne.com

Mr. Mark King
Micropac Industries, Inc.
markking@micropac.com

Dr. Arne Knudsen
Kyocera America, Inc.
arne.knudsen@kyocera.com

Mr. Gary Nicholls
Cookson Electronics
gnicholls@cooksonelectronics.com

Mr. Michael O'Donoghue - IMAPS Executive Director
IMAPS
modonoghue@imaps.org

Mr. Michael P. O'Neill
Reactive NanoTechnologies, Inc.
moneill@imaps.org

Mr. Matt Perry
Engent, Inc.
matt.perry@engentaat.com

Mr. Jim Rates
Chip Supply
jrates@chipsupply.com

Ms. Laurie Roth - IMAPS VP of Membership
Laurie S. Roth Marketing
lauriesroth@yahoo.com

Mr. David L. Saums - Marketing Liaison to NTC
DS & A
dsaums@dsa-thermal.com

Mr. Lee Smith
Amkor Technology
lsmit@amkor.com

Mr. Kurt Theorin
Dupont Microcircuit Materials

Dr. Jie Xue
Cisco Sytems
jixue@cisco.com

About the GBC | Steering Commitee
2008 Spring Conference | Roadmap Initiative

Archived Events:
IMAPS 2007 GBC Marketing Forum | 2007 GBC Spring Conference
GBC Spring Conference 2006 | IMAPS 2005 - Marketing Forum Presentations
GBC Winter Conference 2005 | GBC Presentations from IMAPS 2004
IMAPS 2004 - GBC Marketing Forum | IMAPS 2004 - GBC Business Spotlight Sessions
GBC Summer Conference 2004 | Summer Conference Presentations