IMAPS - Tabletop Exhibitors, Non-Hermetic Packaging Conference 2012

Advanced Technology Conference and Tabletop Exhibits on
Non-Hermetic Packaging Technology for Reliable Microelectronics

January 18, 2012
Rosen Centre Hotel
9840 International Drive
Orlando, Florida - USA

Homepage | 2012 Exhibit Information

Early Registration/Hotel Deadline: December 23, 2011

Questions about exhibits?
Brian Schieman, IMAPS, bschieman@imaps.org

Here are the companies that reserved exhibit space:

Exhibitor	Booth	Booth Type
AI Technology, Inc.	Booth: 2011 NonHermetic 11	Tabletop
Endicott Interconnect Technology	Booth: 2011 NonHermetic 14	Tabletop
Geib Refining Corporation	Booth: 2011 NonHermetic 02	Tabletop
IC Assembly Services Inc.	Booth: 2011 NonHermetic 13	Tabletop
Interplex Engineered Products, Inc.	Booth: 2011 NonHermetic 08	Tabletop
Kyocera America, Inc.	Booth: 2011 NonHermetic 12	Tabletop
Mastermelt America	Booth: 2011 NonHermetic 03	Tabletop
Multisorb Technologies	Booth: 2011 NonHermetic 04	Tabletop
NAMICS Corporation	Booth: 2011 NonHermetic 06	Tabletop
Materion Corporation - Corporate Sponsor:	Booth: 2011 NonHermetic 01	Tabletop
Quik-Pak	Booth: 2011 NonHermetic 10	Tabletop
Specialty Coating Systems Inc.	Booth: 2011 NonHermetic 09	Tabletop
SST International	Booth: 2011 NonHermetic 05	Tabletop
Tektronix Component Solutions	Booth: 2011 NonHermetic 07	Tabletop