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Advanced Technology Conference and Tabletop Exhibits on
Non-Hermetic Packaging Technology for Reliable Microelectronics

January 18, 2012
Rosen Centre Hotel
9840 International Drive
Orlando, Florida - USA

Tabletop Exhibition

Technical Co-Chair:
Thomas J. Green
TJ Green Associates LLC
tgreen@tjgreenllc.com

Technical Co-Chair:
Robert Lowry
Electronic Materials Consultant
lowry98@aol.com




Early Registration/Hotel Deadline: December 23, 2011

Corporate Sponsor:
Corporate Sponsor - Materion

Packaging technologies and materials that are not hermetic, and that offer reliability without hermeticity, are available to the industry. These approaches include flip-chip laminate designs or cavity packages made of materials that provide physical protection for sealed devices, but which are not positively absolute barriers to moisture. The conference proposes to bring together providers of non-hermetic concepts, products, and materials, with package designers, manufacturing and assembly production engineers, quality and reliability managers, and program managers to explore and explain enhanced moisture resistance packaging and provide technical guidance to those capabilities for potential users of such packages especially, for high reliability environments with extended service life expectations.

Presentations will demonstrate how products, technologies, and applications are expanding and redefining the microelectronics industry. There will be presentations in multiple educational sessions, dedicated exhibit hall times, and networking opportunities.

Hours

The Exhibition is on January 18 and exhibits will be open from 10:00 AM until 4:00 PM (Tentative)

Set-up/Dismantle

Exhibit Set-Up:
January 18, 8:00 AM - 10:00 AM
-- (Unless exhibiting on both days - January 17 & 18)

Dismantle:
January 18, after exhibits close (4:00 PM)

Cost

Tabletop space is offered at:

Non-Hermetic Conference Tabletop
$350
COMBO Southeast Conference Tabletop (January 17) & Non-Hermetic Conference Tabletop
$500

What's Included?

Tabletop space will include 6 foot table, and 2 chairs. Basic electrical will be included if located near wall jacks. Dedicated electrical needs or other questions should be directed to the hotel. Booth personnel badges are complimentary. Full session badges are at an additional cost and must be registered separately.

 

Exhibit Questions?:

IMAPS Staff, Brian Schieman, 202-548-8715 or bschieman@imaps.org

Hotel reservations: Hotel Cut-off ws December 23, 2011

Rosen Centre Hotel
9840 International Drive
Orlando, Florida - USA

Discounted IMAPS Room Rates available - view online or call for rates

 

 

Corporate Sponsor:

Materion - Corporate Sponsor

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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001