International Conference on
High Temperature Electronics
(HiTEC 2016)

May 10-12, 2016
Albuquerque Marriott Pyramid North
5151 San Francisco Rd NE
Albuquerque, New Mexico 87109 USA

Conference Events and Technical Program
May 10-12, 2016
Tabletop Exhibition
May 10-11, 2016

General Co-Chairs:
Wayne Johnson, Tennessee Tech University -
Colin Johnston, Oxford University -

Technical Co-Chairs:
Susan L. Heidger, Air Force Research Laboratory -
F. Patrick McCluskey, University of Maryland -
Randy Normann, Perma Works, LLC -

Premier Sponsors:
HiTEC Premier Sponsor - Presidio Components
3 available    


Corporate Sponsors:

HiTEC Corporate Sponsor - Criteria Labs
7 available    


Early Registration/Exhibit & Hotel Deadline: April 13, 2016

Submit Abstract(s)
Register On-Line | Registration Fees

High Temperature Electronics PDC (Short Course)
Tabletop Exhibit Information | 2015 HiTEN Exhibiting Companies
Speaker Information | Student Competition | Hotel Information

Purchase the HiTEN 2015 Proceedings DOWNLOAD

Please join us in Albuquerque, New Mexico for HiTEC 2016. Companies wishing to sponsor this conference or exhibit, or individuals Interested in submitting an abstract or getting involved as a session chair, please contact Brian Schieman at for more information.

HiTEC 2016 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society, HiTEC 2016 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

Papers will be presented on, but not limited to, the following subjects:

- Geothermal
- Oil well logging
- Automotive
- Military/aerospace
- Space
- Etc.
Device Technologies:
- Si, SOI
- SiC
- Diamond
- GaN
- GaAs
- Contacts
- Dielectrics
MEMS and Sensors:
- Vibration
- Pressure
- Seismic
- Etc.
- Materials
- Processing
- Solders/Brazes
- PC Boards
- Wire Bonding
- Flip Chip
- Insulation
- Thermal

- Analog
- Digital
- Power
- Wireless
- Optical

Energy Sources:
- Batteries
- Nuclear
- Fuel Cells
- Etc.
- Resistors
- Inductors
- Capacitors
- Oscillators
- Connectors
- Failure
- Experimental and
modeling results

Those wishing to present a paper at the HiTEC 2016 Conference must submit a 300-500 word abstract electronically by January 22, 2016, using the on-line submittal form at: All abstracts submitted must represent original, previously unpublished work.  All speakers are required to pay a reduced registration fee. 

Students wishing to present at the High Temperature Electronics Conference must also submit a 300-500 word abstract electronically no later than January 22, 2016; you must check the “YES, I’m a full-time Student” button at the bottom of the submission page after you enter your abstract text in order to be considered for the student competition award.

If your abstract is selected, a Final Manuscript for publication on the Conference DOWNLOAD Proceedings will be due on April 1, 2016.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

If you need assistance with the on-line submission form, please email Brian Schieman ( or call 412-368-1621.


Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check at the ATW/Conference. The selected student must attend the event to present his or her work and receive the award.
The Microelectronics Foundation

Registration Information:(Early Registration Deadline: April 13, 2016)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, receptions, refreshment breaks, an Abstract Book and one (1) CD-Rom of the presentations. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships.

All prices below are subject to change.

Early Fee
Through 4/13/16
Advance/Onsite Fee
After 4/13/16
IMAPS Member
Chapter Officer
Tabletop Exhibit (Member)
Tabletop Exhibit (Non-Member)
Premier Sponsorship (Includes Tabletop)
Corporate Sponsorship (Includes Tabletop)

Register On-Line - available soon

High Temperature Electronics Professional Development Course (PDC - Short Course):

High Temperature Electronics
PDC Instructor: Randall Kirschman, Consultant

Monday, May 9 - preceding the HiTEC Conference
11:00am - 7:00pm (Includes coffee breaks, Lunch from 1-2pm)
Albuquerque Marriott Pyramid North

Additional registration fee from HiTEC Attendee Registration
Register On-Line - Under SESSIONS During Check-out

Course Description: High-Temperature Electronics (HTE) is a valuable option for substantially improving overall system performance. Operating temperature may be thought of as an additional design parameter when justified by system performance requirements. The course is updated and expanded for 2016.

Applications of HTE include many areas: petroleum and geothermal wells, ground vehicles, aircraft, Solar System exploration, and electric power. Relocating electronic subsystems to high temperature can improve overall system efficiency, decrease size and weight, simplify maintenance and improve reliability. At the same time there are many technical challenges, related to materials and their interactions, component behavior, circuit design and interfacing.

The focus of this course is semiconductor electronics at high temperatures: device behavior, applications, advantages and drawbacks, technical issues and present situation. Basic materials characteristics related to electronics at high temperatures, and passive electronic component behavior are included, as well as assembly, packaging and interconnection. The temperature range covered in this course extends from +125C upward, as high as 1000C. Depending on the temperature range, HTE semiconductor devices may be based on Si, SiGe, GaAs, SiC, GaN, C (diamond) and other materials.

Although future developments in electronics are difficult to predict, it is likely that high-temperature electronics will find increased use for enhanced performance in extreme environments.


I. - Introduction and definitions, course description & objectives, temperature ranges, history and background.
II. - Applications: oil and geothermal well measurements, space exploration and power, aircraft,  automotive. Reasons for high-temperature operation of electronics; benefits and drawbacks.
III. - Materials behavior - non-semiconductors: thermal conductivity, thermal expansion, heat capacity, thermal diffusivity, electrical conduction, glass transition temperature, strength, temperature capabilities, dielectric properties, magnetic properties.
IV. - General semiconductor materials behavior: carrier generation, mobility, electrical conductivity, behavior and capabilities of Ge, Si, SiGe, GaAs, GaN, SiC, BN, C (diamond), etc. - semiconductor device temperature capabilities/limits.
V. - Silicon device behavior: diodes, bipolar transistors, FETs (JFETs, MOSFETs, etc.), power devices (MOSFETs, IGBTs, thyristors, etc.), integrated circuits (bipolar, CMOS, SOI); SiGe devices.
VI. - Devices based on medium-bandgap semiconductor materials: GaAs, AlGaAs, GaP, etc.
VII. - Devices based on large-bandgap semiconductor materials: GaN, SiC, BN, C (diamond).
VIII. - Passive components (resistors, capacitors, inductors) for high temperatures.
IX. – Assembly and packaging for high temperatures: thin-film, thick-film, die-attach, wirebonding, soldering, packages, interfacing, examples of assemblies.
X. - Modeling & simulation.
XI. - Reliability & aging: how high temperature differs from room temperature, mechanical stress, failure rates, temperature cycling, testing examples, adaptive circuitry.
XII. - Radiation effects with examples.
XIII. - Design issues and ideas: choosing components, factors, temperature/temperature range, lifetime requirements, environment & additional stresses, mechanical, resources, custom vs commercial.
XIV. - Alternative technologies for high temperature electronics.
Commercial components for high temperatures: passives, semiconductor devices, circuits.
XV. - References & Bibliography

Course Objectives: Provide an overview of situations where the technologies of electronics and high temperatures are brought together. Provide an overview of the applications for high temperature electronics. Survey the relationships between fundamental phenomena, materials behavior, and device and system characteristics and performance at high temperatures. Overview the behavior of materials and components used in electronics at high temperatures: metals, ceramics, plastics, passive components, semiconductor materials and devices, and electronic circuits and assemblies. Provide practical information on materials, devices, circuits and techniques for those involved in developing high-temperature electronics.

Copies of the slides (approximately 275), course notes (approximately 150 pages), and more than 500 references/bibliographic items are provided.

Who Should Attend?: Engineers and technical persons in research or development of electronics for high-temperature applications. Familiarity with electronic devices and circuits is an advantage; however, materials and device fundamentals will be reviewed.

Dr. Randall Kirschman is an internationally recognized authority on extreme-temperature electronics. He has been consulting to industry, government and academe since 1980 in the areas of microelectronic materials and fabrication technology, and electronics for extreme temperatures. Before going into business for himself in 1982, he managed the processing laboratory at the R&D Center at a division of Eaton Corporation, where he was responsible for the fabrication of thin-film hybrids for microwave components. Prior to that, he was on the staff of the Jet Propulsion Laboratory, performing research on semiconductor materials and devices. During 1990-91 he was a Visiting Senior Research Fellow at the Institute of Cryogenics, University of Southampton, England. Between 1998-2005, he was a member of the Physics Department at Oxford University. He edited the 1999 IEEE Press/Wiley book High-Temperature Electronics. He completed his undergraduate studies at the University of California, and earned his Ph.D. in Physics and Electrical Engineering at the California Institute of Technology in 1972.



Speaker Dates/Information:

  • Abstract Deadline: January 22, 2016
  • Speaker notification: February 10, 2016
  • Final Manuscripts for Proceedings due: April 1, 2016
  • Early Registration/Hotel reservation cut-off: April 13, 2016
  • Speaker BIO Due: May 1, 2016
  • Presentation Slides Must Be Ready BEFORE: May 10, 2016
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to prior to event)


Hotel Information -- Hotel Deadline: April 13, 2016
You must book your hotel directly with the host hotel:

Albquerque Marriott Pyramid North
5151 San Francisco Rd NE
Albuquerque, New Mexico 87109 USA

Single/Double: $129 plus taxes/fees

On-line Reservations

Phone Reservations: 1-800-228-9290
Ask for IMAPS/HITEMP when booking by phone.

  • Amkor
  • Canon
  • Corning
  • Fastech Synergy Philippines
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NEO Tech
  • Palomar
  • Plexus
  • Qualcomm
  • Specialty Coating Systems