KESTER

 

International Conference and Exhibition on
High Temperature Electronics
(HiTEC 2018)

May 8-10, 2018
Hotel Albuquerque
Albuquerque, New Mexico USA

Conference Events and Technical Program
May 8-10, 2018
Tabletop Exhibition
May 8-9, 2018

General Co-Chairs:
Wayne Johnson, Tennessee Tech University - wjohnson@tntech.edu
Colin Johnston, Oxford University - colin.johnston@materials.ox.ac.uk

Technical Co-Chairs:
Susan L. Heidger, Air Force Research Laboratory - Susan.Heidger@kirtland.af.mil
F. Patrick McCluskey, University of Maryland - mcclupa@calce.umd.edu
Randy Normann, Perma Works, LLC - randy@permaworks.com
Updates soon

Premier Sponsors:
HiTEC Premier Sponsor - Presidio Components
3 Premier Spots Available

 


ABSTRACT DEADLINE: JANUARY 22, 2018

SUBMIT ABSTRACT(S) | SPONSORSHIPS

Please join us in Albuquerque, New Mexico for HiTEC 2018. Companies wishing to sponsor this conference or exhibit, or individuals Interested in submitting an abstract or getting involved as a session chair, please contact Brian Schieman at bschieman@imaps.org for more information.

HiTEC 2018 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society, HiTEC 2018 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

Papers will be presented on, but not limited to, the following subjects:

Applications:
- Geothermal
- Oil well logging
- Automotive
- Military/aerospace
- Space
- Etc.
Device Technologies:
- Si, SOI
- SiC
- Diamond
- GaN
- GaAs
- Contacts
- Dielectrics
MEMS and Sensors:
- Vibration
- Pressure
- Seismic
- Etc.
Packaging:
- Materials
- Processing
- Solders/Brazes
- PC Boards
- Wire Bonding
- Flip Chip
- Insulation
- Thermal
management

Circuits:
- Analog
- Digital
- Power
- Wireless
- Optical

Energy Sources:
- Batteries
- Nuclear
- Fuel Cells
- Etc.
Passives:
- Resistors
- Inductors
- Capacitors
- Oscillators
- Connectors
Reliability:
- Failure
mechanisms
- Experimental and
modeling results

Those wishing to present a paper at the HiTEC 2018 Conference must submit a 500+ word abstract electronically by JANUARY 22, 2018, using the on-line submittal form at: www.imaps.org/abstracts.htm. All abstracts submitted must represent original, previously unpublished work.  All speakers are required to pay a reduced registration fee.  If your abstract is selected, a Final Manuscript for publication on the Conference DOWNLOAD Proceedings will be due on April 1, 2018.

Students wishing to present at the High Temperature Electronics Conference must also submit a 500+ word abstract electronically no later than JANUARY 22, 2018; you must check the “YES, I’m a full-time Student” button at the bottom of the submission page after you enter your abstract text in order to be considered for the student competition award.

Accepted papers may be considered for further publication in the IMAPS peer-reviewed Journal of Microelectronics and Electronic Packaging.

If you need assistance with the on-line submission form, please email Brian Schieman (bschieman@imaps.org).

 


Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check at the ATW/Conference. The selected student must attend the event to present his or her work and receive the award.
The Microelectronics Foundation



Registration Information: (Early Registration Deadline: April 13, 2018)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, receptions, refreshment breaks, an one (1) DOWNLOAD of the proceedings papers. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 4/13/18
Advance/Onsite Fee
After 4/13/18
IMAPS Member
$625
$725
Non-Member
$750
$850
Speaker
$450
$550
Chair
$450
$550
Student
$150
$200
Chapter Officer
$450
$550
Tabletop Exhibit (Member) - includes 2 exhibit personnel badges with meals
$700
$800
Tabletop Exhibit (Non-Member) - includes 2 exhibit personnel badges with meals
$800
$900
Premier Sponsorship (Includes Tabletop) - includes 1 tabletop, 2 session badges, 4 exhibit personnel badges with meals, and advertisements
$3000
$3000
Corporate Sponsorship (Includes Tabletop) - includes 1 tabletop, 1 session badge, and 2 exhibit personnel badges with meals
$1500
$1500

REGISTER ONLINE (SOON)


Speaker Dates/Information:

  • Abstract Deadline: JANUARY 22, 2018
  • Speaker notification: February 16, 2018
  • Final Manuscripts for Proceedings due: April 1, 2018
  • Early Registration/Hotel reservation cut-off: April 13, 2018
  • Speaker BIO Due: April 30, 2018
  • Presentation Slides Must Be Ready BEFORE: May 8, 2018
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event). The slide presentations that are used on the session laptops will be converted to secure PDFs and made available to conference paid attendees via download. Speakers needing to remove slides or update slides should do so before May 13 and email bschieman@imaps.org the new file)

 


Hotel Information -- Hotel Deadline: April 13, 2018
You must book your hotel directly with the host hotel:

Hotel Albquerque
800 Rio Grande Blvd. NW
Albuquerque, New Mexico 87104 USA
phone: 505.843.6300 | toll-free: 1.800.237.2133

Single/Double: $149/night + taxes/fees

ONLINE BOOKING - SOON

Book your hotel reservation today! We have reserved a block of rooms at the host hotel to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.

 


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems