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International
Conference on
High Temperature Electronics
(HiTEC 2008)
Hotel Albuquerque Old Town
Albuquerque, New Mexico USA
May 12-15, 2008
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Conference
Events and Technical Program
May 12-15, 2008 |
Tabletop Exhibition
May 13-14, 2008 |
General
Chair: R. Wayne Johnson,
Auburn University
General Co-Chair: Randy Normann, Sandia National
Laboratories
Technical
Chair: Patrick McCluskey, University of Maryland
Technical Co-Chair: Susan L. Heidger, Air
Force Research Laboratory/RDHP |
Exhibiting Companies
Here are the companies
that have already reserved exhibit space:
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AI Technology, Inc.
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Bridge Semiconductor Corp.
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CPS Technologies
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ESL ElectroScience
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Hesse & Knipps
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Honeywell
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Interconnect Systems, Inc.
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Micropac Industries, Inc.
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Minco Technology Labs, Inc.
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Novacap
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Orthodyne Electronics
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Pac Tech USA - Packaging Technologies, Inc.
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Pacific Aerospace & Electronics
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Paine Electronics, LLC
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Q-Tech Corp.
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SemiSouth Laboratories, Inc.
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TRS Technologies, Inc.
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Twilight Technology, Inc.
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West-Bond, Inc.
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IMAPS-International Microelectronics And Packaging Society
and The Microelectronics Foundation
Everything in electronics between the chip and the system!
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001 | Fax: 202-548-6115 |
E-mail: imaps@imaps.org |
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