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International Conference on
High Temperature Electronics
(HiTEC 2012)

May 8-10, 2012
Albuquerque Marriott Pyramid North
5151 San Francisco Rd NE
Albuquerque, New Mexico 87109 USA

Conference Events and Technical Program
May 8-10, 2012
Tabletop Exhibition
May 8-9, 2012

General Co-Chairs:
Wayne Johnson, Auburn University -
Colin Johnston, Oxford Applied Technology – UK -

Technical Co-Chairs:
Susan L. Heidger, Air Force Research Laboratory -
F. Patrick McCluskey, University of Maryland -
Randy Normann, Perma Works, LLC -

Tabletop Exhibit Application

Questions about exhibits?
Brian Schieman, IMAPS,

HiTEC 2012 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics And Packaging Society (IMAPS), HiTEC 2012 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

Papers will be presented in the following areas:

  • Applications
  • Circuits
  • Device Technologies
  • Energy Sources
  • MEMS and Sensors
  • Packaging
  • Passives
  • Reliability

Exhibition Information

Exhibit Hours:
Tuesday, May 8 -- 11:30 am - 6:30 pm
Refreshment Breaks, Lunch & Reception will be held in the Exhibit Area.

Wednesday, May 9 -- 10:00 am - 4:00 pm
Refreshment Breaks and Lunch will be held in the Exhibit Area.

Installation Hours:
Tuesday, May 8 -- 7:00 am - 11:15 am

Dismantle Hours:
Wednesday, May 9 -- 4:01 pm - 6:00 pm

Tabletop Registration Fees:*

  Through 4/23/12 After 4/23/12
IMAPS Members $625 $725
Non-Members $725 $825

IMAPS reserves the right to refuse any potential exhibitor or advertiser should IMAPS
deem the promotion of a company or organization inappropriate for any reason.

Included with your registration:

• one (1) six foot draped table
• two (2) chairs
• carpeting
• one (1) Technical Proceedings CD-ROM
• one (1) List of Attendees * (sent after the event)
• two (2) Booth Personnel

Additional booth personnel are welcome at no additional fee. An extra cost per person will be applied if personnel wish to participate in meals, breaks and/or receptions. Registrations for the full conference are not included, but are available at an additional cost.

Hotel Information:

Hotel Deadline: April 23, 2012
You must book your hotel directly with the host hotel:

Albuquerque Marriott Pyramid North
5151 San Francisco Rd NE
Albuquerque, New Mexico 87109 USA

Marketing Feature Available for Exhibitors:

IMAPS will extend to all exhibitors an opportunity to provide an unlimited amount of pages of company products, services and contact information to be included in the Technical Proceedings CD-ROM. These CD-ROMs are provided to all technical conference attendees and are for sale through IMAPS to all industry professionals.

This unique feature will allow exhibiting companies an unlimited amount of promotional material for their products and services that will go well beyond their exposure at the Conference.

There is no charge for this optional feature. However, the deadline (4/9/12) must be met in order to be included.

Submissions should be sent electronically in one (1) file, either PDF or Word, that is easy to open, not password-protected and in a logical format. Any materials not sent in the required format or that arrive after the deadline, may not appear on the CD-ROM.Send files to on or before April 9, 2012.


Premier Sponsors:

HiTEN Premier Sponsor - CISSOID

HiTEC Premier Sponsor - Fairchild Semiconductor


Corporate Sponsors:

HiTEN Corporate Sponsor - XREL Semiconductor

HiTEC Corporate Sponsor - Trendsetter Electronics

HiTEC Corporate Sponsor - Analog Devices

HiTEC Corporate Sponsor - Texas Instruments

HiTEC Corporate Sponsor -  PAINE

HiTEC Corporate Sponsor -  Eltek Semiconductors

© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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