Micross

 

International Conference on
High Temperature Electronics
(HiTEC 2016)

May 10-12, 2016
Albuquerque Marriott Pyramid North
5151 San Francisco Rd NE
Albuquerque, New Mexico 87109 USA

Conference Events and Technical Program
May 10-12, 2016
Tabletop Exhibition
May 10-11, 2016

General Co-Chairs:
Wayne Johnson, Tennessee Tech University - wjohnson@tntech.edu
Colin Johnston, Oxford University - colin.johnston@materials.ox.ac.uk

Technical Co-Chairs:
Susan L. Heidger, Air Force Research Laboratory - Susan.Heidger@kirtland.af.mil
F. Patrick McCluskey, University of Maryland - mcclupa@calce.umd.edu
Randy Normann, Perma Works, LLC - randy@permaworks.com

Premier Sponsors:
HiTEC Premier Sponsor - Presidio Components
HiTEC Premier Sponsor - X-Rel
HiTEC Premier Sponsor - NGK NTK
HiTEC Premier Sponsor - Vorago Technologies
HiTEC Premier Sponsor - Trendsetter Electronics

 


Corporate Sponsors:

HiTEC Corporate Sponsor - Criteria Labs
HiTEC Corporate Sponsor - Joule HiTEC Corporate Sponsor - RS Solutions HiTEC Corporate Sponsor - KEMET
HiTEC Corporate Sponsor - RelChip

HiTEC Corporate Sponsor - CISSOID

HiTEC Corporate Sponsor - Analog Devices HiTEC Corporate Sponsor - Tekmos

 


Early Registration/Exhibit & Hotel Deadline: April 13, 2016


Tabletop Exhibit Information

2016 Exhibiting Companies | HOTEL Information | Floorplan
Exhibit Info | Hours | Install | Dismantle | Costs | What's Included


TABLETOPS & SPONSORSHIPS SOLD OUT

Questions about exhibits?
Brian Schieman, IMAPS, bschieman@imaps.org

HiTEC 2016 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational management of the International Microelectronics Assembly and Packaging Society (IMAPS), HiTEC 2016 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

The objective of the HiTEC Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HiTEC is silicon and silicon-on-insulator (SOI). Although, HiTEC is not simply a semiconductor focused network. HiTEC provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Over 150 participants attended the 2015 conference in Cambridge and more than 200 in Albuquerque in 2014, representing companies such as Baker Hughes, Cissoid S.A., GE, Honeywell, Sandia National Laboratories, Schulmberger, Texas Instruments, TSL and various academic institutions. Delegates hailed from Belgium, China, France, Japan, Germany, Norway, Sweden, the US and the UK.

TABLETOPS & SPONSORSHIPS SOLD OUT

Thank you to the HiTEC 2016 Sponsors & Exhibitors.
Please be sure to stop by their tabletops during the Conference to learn more…

NEW! Click here to view the exhibitor floor plan.

HiTEC Premier Sponsor - Presidio Components
Presidio Components, Inc.

*PREMIER SPONSOR*

HiTEC Premier Sponsor - X-Rel
X-REL Semiconductor

*PREMIER SPONSOR*

HiTEC Premier Sponsor - NGK NTK
NGK NTK

*PREMIER SPONSOR*

HiTEC Premier Sponsor - Vorago Technologies
Vorago Technologies

*PREMIER SPONSOR*

HiTEC Premier Sponsor - Trendsetter Electronics
Trendsetter Electronics

*PREMIER SPONSOR*

HiTEC Corporate Sponsor - Analog Devices
Analog Devices
*CORPORATE SPONSOR*

HiTEC Corporate Sponsor - CISSOID
CISSOID
*CORPORATE SPONSOR*
HiTEC Corporate Sponsor - Criteria Labs
Criteria Labs
*CORPORATE SPONSOR*
HiTEC Corporate Sponsor - Joule
Joule Sales and Marketing
*CORPORATE SPONSOR*
HiTEC Corporate Sponsor - KEMET
Kemet Electronics Corporation
*CORPORATE SPONSOR*
HiTEC Corporate Sponsor - RelChip
RelChip, Inc.
*CORPORATE SPONSOR*
HiTEC Corporate Sponsor - RS Solutions
RS Solutions
*CORPORATE SPONSOR*
HiTEC Corporate Sponsor - Tekmos
Tekmos
*CORPORATE SPONSOR*

AdTech Ceramics

AkroMetrix, LLC

American High Voltage

AVX Corporation

Boschman Technologies /
Advanced Packaging Center

DS&A LLC

ESL ElectroScience

Frequency Management International

Hesse Mechatronics, Inc.

Hi-Rel Group LLC

Hybrid Design Associates, Inc

Indium Corporation

International Rectifier HiRel Products Inc.

IPDIA

Knowles Novacap

Kyocera America Inc.

Micro Crystal AG

MicroPulse - CANCELLED

Northrop Grumman

Palomar Technologies, Inc.

Q-Tech

Semi Dice, Inc.

Sentec E&E Co., Ltd.

Statek

Stellar Industries Corp.

ThermaCore

TT Semiconductor, Inc

UltraTape

Vanguard Electronics

VPT, Inc.

Watt Consulting

Wright Capacitors, Inc.

Click here to view the exhibitor floor plan.


Exhibition Information

Exhibit Hours:
Tuesday, May 10 -- 10:15 am - 6:30 pm
Refreshment Breaks, Lunch & Reception will be held in the Exhibit Area.

Wednesday, May 11 -- 10:15 am - 4:15 pm
Refreshment Breaks & Lunch will be held in the Exhibit Area.

Installation Hours:
Monday, May 9 -- 3:00 pm - 5:00 pm
Tuesday, May 10 -- 7:00 am - 10:00 am

Dismantle Hours:
Wednesday, May 11 -- 4:15 pm

All packages should be sent directly to the HOTEL and arrive on Friday, May 6 or Monday, May 9

 

Tabletop Registration Fees:*

 
Through 4/13/16
After 4/13/16
IMAPS Corporate Members
$625
$725
Non-Members
$725
$825

IMAPS reserves the right to refuse any potential exhibitor or advertiser should IMAPS
deem the promotion of a company or organization inappropriate for any reason.

Included with your registration:

• one (1) six foot table
• two (2) chairs
• one (1) Technical Proceedings DOWNLOAD
• one (1) List of Attendees * (sent after the event)
• one (1) Booth Personnel (meals included)

Additional booth personnel are welcome at an extra cost to cover their meals. Registrations for the full conference are not included, but are available at an additional cost.


Hotel Information -- Hotel Deadline: April 13, 2016
You must book your hotel directly with the host hotel:

Albquerque Marriott Pyramid North
5151 San Francisco Rd NE
Albuquerque, New Mexico 87109 USA

.


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems