International Conference and Exhibition on
High Temperature Electronics
(HiTEC 2018)

May 8-10, 2018
Hotel Albuquerque
Albuquerque, New Mexico USA

Conference Events and Technical Program
May 8-10, 2018
Tabletop Exhibition
May 8-9, 2018

General Co-Chairs:
Wayne Johnson, Tennessee Tech University -
Colin Johnston, Oxford University -

Technical Committee:
Holger Kappert, Fraunhofer IMS -
F. Patrick McCluskey, University of Maryland -
Randy Normann, Perma Works, LLC -
Maithil Pachchigar, Analog Devices -
Steve Riches, Tribus-D Ltd -
David Sarraf, TE Connectivity -
Carol Williams, Trendsetter Electronics -

Premier Sponsors:
HiTEC Premier Sponsor - Presidio Components
HiTEC Premier Sponsor - Trendsetter Electronics
HiTEC Premier Sponsor - NGK NTK


Corporate Sponsors:
HiTEC Corporate Sponsor - RelChip
HiTEC Corporate Sponsor - Analog Devices
 Corporate Sponsor - Joule
HiTEC Corporate Sponsor - CISSOID
HiTEC Corporate Sponsor - TEKMOS
HiTEC Corporate Sponsor - X-Rel

Early Registration/Exhibit & Hotel Deadline: April 13, 2018

Tabletop Exhibit Information

2018 Exhibiting Companies | HOTEL Information | Floorplan
Exhibit Info | Hours | Install | Dismantle | Costs | What's Included


Questions about exhibits?
Brian Schieman, IMAPS,

HiTEC 2018 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational management of the International Microelectronics Assembly and Packaging Society (IMAPS), HiTEC 2018 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

The objective of the HiTEC Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HiTEC is silicon and silicon-on-insulator (SOI). Although, HiTEC is not simply a semiconductor focused network. HiTEC provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Over 120 participants attended the 2017 conference in Cambridge and more than 200 in Albuquerque in 2016, representing companies such as Cissoid S.A., GE, Honeywell, Sandia National Laboratories, Texas Instruments, TSL and various academic institutions. Delegates hailed from Belgium, China, France, Japan, Germany, Norway, Sweden, the US and the UK.


Thank you to the HiTEC 2018 Sponsors & Exhibitors.
Please be sure to stop by their tabletops during the Conference to learn more…

NEW! Click here to view the exhibitor floor plan.

HiTEC Premier Sponsor - Presidio Components
Presidio Components, Inc.


HiTEC Premier Sponsor - Trendsetter Electronics
Trendsetter Electronics


KEMET Electronic Components

HiTEC Premier Sponsor - NGK NTK



HiTEC Corporate Sponsor - RelChip
RelChip, Inc.
HiTEC Corporate Sponsor - Analog Devices
Analog Devices
HiTEC Corporate Sponsor - Joule
Joule Sales and Marketing
HiTEC Corporate Sponsor - CISSOID
HiTEC Corporate Sponsor - TEKMOS
HiTEC Corporate Sponsor - X-Rel
X-REL Semiconductor

5N Plus Inc.

AdTech Ceramics

American High Voltage

Arizona State University

AVX Corporation

Criteria Labs

Emerson Automation Solutions

Ferro Corporation

Frequency Management International

Hesse Mechatronics, Inc.

Indium Corporation

Kyocera International Inc.

Momentive Performance Materials

NASCENTechnology Manufacturing, Inc.

Ozark Integrated Circuits, Inc.

Palomar Technologies, Inc.

Polyonics, Inc.

Semi Dice, Inc.

Statek Corporation

StratEdge Corporation

TT Semiconductor

Vorago Technologies

NEW! Click here to view the exhibitor floor plan.

Exhibition Information

Exhibit Hours:
Tuesday, May 8 -- 10:00 am - 6:30 pm
Refreshment Breaks, Lunch & Reception will be held in the Exhibit Area.

Wednesday, May 9 -- 10:00 am - 4:30 pm
Refreshment Breaks & Lunch will be held in the Exhibit Area.

Installation Hours:
Tuesday, May 8 -- 7:00 am - 10:00 am

Monday, May 7 -- TBD (IMAPS trying to get some time - not guaranteed though)

Dismantle Hours:
Wednesday, May 9 -- 4:31 pm

All packages should be sent directly to the HOTEL and arrive on Friday, May 4 or Monday, May 7 - NOT BEFORE
(Address packages to your staff staying at the hotel, include your company name and IMAPS on all labels)


Tabletop Registration Fees:*

Through 4/13/18
After 4/13/18

IMAPS reserves the right to refuse any potential exhibitor or advertiser should IMAPS
deem the promotion of a company or organization inappropriate for any reason.

Included with your registration:

• one (1) six foot table
• two (2) chairs
• one (1) Technical Proceedings DOWNLOAD
• one (1) List of Attendees * (sent after the event)
• two (2) Booth Personnel (meals included)

Additional booth personnel are welcome at an extra cost to cover their meals.
Registrations for the full conference are not included, but are available at an additional cost.

Hotel Information -- Hotel Deadline: April 13, 2018
You must book your hotel directly with the host hotel:

Hotel Albquerque
800 Rio Grande Blvd. NW
Albuquerque, New Mexico 87104 USA
phone: 505.843.6300 | toll-free: 1.800.237.2133

Single/Double: $149/night + taxes/fees

Click here to book online!

Book your hotel reservation today! We have reserved a block of rooms at the host hotel to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic