Micross

 

International Conference and Exhibition on
High Temperature Electronics
(HiTEC 2018)

May 8-10, 2018
Hotel Albuquerque
Albuquerque, New Mexico USA

Conference Events and Technical Program
May 8-10, 2018
Tabletop Exhibition
May 8-9, 2018

General Co-Chairs:
Wayne Johnson, Tennessee Tech University - wjohnson@tntech.edu
Colin Johnston, Oxford University - colin.johnston@materials.ox.ac.uk

Technical Committee:
Holger Kappert, Fraunhofer IMS - Holger.Kappert@ims.fraunhofer.de
F. Patrick McCluskey, University of Maryland - mcclupa@calce.umd.edu
Randy Normann, Perma Works, LLC - randy@permaworks.com
Maithil Pachchigar, Analog Devices - Maithil.Pachchigar@analog.com
Steve Riches, Tribus-D Ltd - striches1@outlook.com
David Sarraf, TE Connectivity - david.sarraf@te.com
Carol Williams, Trendsetter Electronics - carolw@trendsetter.com

Premier Sponsors:
HiTEC Premier Sponsor - Presidio Components
HiTEC Premier Sponsor - Trendsetter Electronics
HiTEC Premier Sponsor - NGK NTK

 

Corporate Sponsors:
HiTEC Corporate Sponsor - RelChip
HiTEC Corporate Sponsor - Analog Devices
HiTEC
 Corporate Sponsor - Joule
HiTEC Corporate Sponsor - CISSOID
HiTEC Corporate Sponsor - TEKMOS
HiTEC Corporate Sponsor - X-Rel

Early Registration & Hotel Deadlines: April 13, 2018

**SPONSORSHIPS & EXHIBITS ARE NOW SOLD OUT**

REGISTER ONLINE

Exhibitor Information | Visiting the Exhibitors | HOTEL | SPEAKERS

**The HTE pdc/short-course scheduled Monday before HiTEC has been cancelled**

Please join us in Albuquerque, New Mexico for HiTEC 2018. Companies wishing to sponsor this conference or exhibit, please contact Brian Schieman at bschieman@imaps.org for more information. SPEAKERS - did you miss the abstract submission deadline? Contact bschieman@imaps.org right away!.

HiTEC 2018 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society, HiTEC 2018 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

 

 

 

MONDAY, MAY 7 | Pre-Conference Short Course (PDC) -- CANCELLED

Pre-Conference Professional Development Course on:

HIGH TEMPERATURE ELECTRONICS
PDC Instructor: Randall Kirschman, Consultant

**THIS PDC/SHORT-COURSE PRECEDING HiTEC HAS BEEN CANCELLED**




FULL CONFERENCE PROGRAM BEGINS TUESDAY...

 

TUESDAY, MAY 8


7:00am-6:00pm

Registration Open

7:00am-8:00am

Breakfast

10:00am-6:00pm

Exhibits Open (when not in session)


8:00am-8:15am

Opening Remarks: Conference Chair –
Wayne Johnson, Tennessee Tech University


8:15am-9:00am

PLENARY:
Monitoring Magma Under Volcanoes: The Future Of Eruption Forecasting And Geothermal Energy

Magma, represents the most extreme environment in Earth’s crust. Typical conditions at the top of a magma body are > 50 MPa and > 800oC. The location and conditions of magma storage were entirely speculative until recently when geothermal drilling encountered magma in Iceland, Kenya, and Hawaii. The door is now open, if appropriate sensors can be developed, to monitor conditions at the source of eruptions. This will move eruption forecasting, a concern for 10% of the world’s population, from recognizing patterns in proxy surface measurements towards the reliability of weather forecasting. It can also aid in achieving a huge increase in productivity of clean geothermal energy. Associated aqueous fluids are super-heated or super-critical.

John C Eichelberger, Professor of Geology, Emeritus | University of Alaska Fairbanks


SESSION 1

T1: PACKAGING
Session Chair: Harold L. Snyder, Jr., Physical Solutions

 

9:00am-9:30am

Modelling the Influence of Conformal Coatings on Thermo-Mechanical Fatigue of Solder Interconnects in Electronic Packages
Patrick McCluskey, Maxim Serebreni, University of Maryland (Ross Wilcoxon)

9:30am-10:00am

Sixty Earth-days Test of Prototype Pt/HTCC Alumina Package in Simulated Venus Environment
Liangyu Chen, Ohio Aerospace Institute/NASA GRC (Philip Neudeck, Roger Meredith, David Spry, Leah Nakley, Glenn Beheim, Gary Hunter, NASA Glenn Research Center; Dorothy Lukco, Vantage Partners LLC / NASA Glenn Research Center)


10:00am-10:30am

Break in the Exhibit Area


10:30am-11:00am

Organic Hybrids for Circuit Assemblies - Initial Environmental Testing of a Low Cost Alternative to Ceramic Substrate based Assemblies
Martin Wickham, National Physical Laboratory

11:00am-11:30am

Identification of Thermo-mechanical Fatigue Fracture Location by Transient Thermal Analysis for High-temperature Operating SiC Power Module Assembled with ZnAl Eutectic Solder
Fumiki Kato, National Institute of Advanced Industrial Science and Technology (Kenichi Koui, Hidekazu Tanisawa, Shinji Sato, Yoshinori Murakami, Hiroki Takahashi, Hiroshi Yamaguchi, Hiroshi Sato)

11:30am-12:00pm

Influence of Initial Shear Strength on Time to Failure of Copper (Cu) Wire Bonds in Thermal Aging Condition
Subramani Manoharan, University of Maryland (Stevan Hunter, ON Semiconductor; Chandradip Patel (former student), Patrick McCluskey, University of Maryland)

12:00pm-12:30pm

Increasing High-Temperature Reliability of ICs Assembled in Plastic Packages Using Die Extraction, Gold Ball Removal, ENEPIG Die Bond Pad Plating and Reassembly
Charlie Beebout, Global Circuit Innovations


12:30pm-2:00pm

Lunch in the Exhibit Area


SESSION 2

T2: DIE ATTACH
Session Chair: F. Patrick McCluskey, University of Maryland

 

2:00pm-2:30pm

Highly Reliable Pressure-Less Silver Sintering Joint
Sihai Chen, Indium Corporation of America (William Shambach, Chris LaBarbera, Ning-Cheng Lee)

2:30pm-3:00pm

Conductive Fusion Technology Advanced Die Attach Materials for High Power Applications
Maciej Patelka, NAMICS (Nicholas Krasco)


3:00pm-4:00pm

Break in the Exhibit Area


4:00pm-4:30pm

**REPLACEMENT Presentation**
Thermal Conductivity of Cu-Sn Transient Liquid Phase Sintered Interconnects for High Power Density Modules by Hannes Greve and Patrick McCluskey
Patrick McCluskey, University of Maryland

4:30pm-5:00pm

Novel Solder-mesh Interconnection Design for Power Module Applications
Adrian Lis, Osaka University (Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose)


5:00pm-6:00pm

Networking Reception in the Exhibit Area


 

 



 

WEDNESDAY, MAY 9


7:00am-5:00pm

Registration Open

7:00am-8:00am

Breakfast

10:00am-4:30pm

Exhibits Open (when not in session)


8:00am-8:15am

Opening Remarks: Conference Chair –
Wayne Johnson, Tennessee Tech University


8:15am-9:00am

PLENARY:
Sensor Systems for Extreme Harsh Environments

Sensors are key elements for capturing environmental properties and are increasingly important in the industry for the intelligent control of processes. While in many everyday objects highly integrated sensor systems are already state of the art, the situation in an industrial environment is clearly different. Frequently the use of sensor systems is impossible, because the extreme ambient conditions of industrial processes like high operating temperatures, strong mechanical load or a humid or chemically aggressive environment do not allow a reliable operation of sensitive electronic components. The realization of such sensor systems demands a multidisciplinary approach including e.g. the design of reliable sensor elements, high temperature integrated circuits, assembly and housing. Therefore eight Fraunhofer Institutes have concentrated their competencies and have kicked off the Fraunhofer Lighthouse Project ‘eHarsh’. This presentation gives an introduction in the objectives of this comprehensive project.

Dipl.-Ing. Holger Kappert | Fraunhofer Institute for Microelectronic Circuits and Systems IMS


SESSION 3

W1: SiC
Session Chair: Liangyu Chen, Ohio Aerospace Institute/NASA GRC

 

9:00am-9:30am

Digital Logic Synthesis for 470 Celsius Silicon Carbide Electronics
Nick Chiolino, Ozark Integrated Circuits, Inc. (A.Matthew Francis, Jim Holmes, Matthew Barlow)

9:30am-10:00am

Yearlong 500°C Operational Demonstration of Upscaled 4H-SiC JFET Integrated Circuits
Philip G. Neudeck, NASA Glenn Research Center (David J. Spry, Liangyu Chen, Michael J. Krasowski, Norman F. Prokop, Carl W. Chang, Glenn M. Beheim)


10:00am-10:30am

Break in the Exhibit Area


10:30am-11:00am

Analog and Logic High Temperature Integrated Circuits Based on Enhancement Mode Planar SiC JFETs
Peter Alexandrov, United Silicon Carbide (Matt O’Grady)

11:00am-11:30am

High Temperature SRAM in SiC CMOS
Matthew Barlow, Ozark Integrated Circuits, Inc. (A. Matt Francis, Nicholas Chiolino)

11:30am-12:00pm

Co-optimized Reliability and Parasitic inductance in Small Footprint Vertical Silicon Carbide MOSFET
Mahsa Montazeri, University of Arkansas

12:00pm-12:30pm

High Heat-density SiC Heater Chip for Thermal Characterization of High Temperature Packaging
Naoki Wakasugi , Yamato Scientific Co.,Ltd. and Osaka University (Shijo Nagao, Dongjin Kim, Katsuaki Suganuma)


12:30pm-2:00pm

Lunch in the Exhibit Area


SESSION 4

W2: Si / SOI
Session Chair: Holger Kappert, Fraunhofer IMS

 

2:00pm-2:30pm

Configurable Digital Logic for Extreme Environments
Richard Rea, RelChip, Inc. (Marshall Soares)

2:30pm-3:00pm

Performance Test Results of a Precision Data Acquisition and Control Platform for 200C+ High Temperature Environments
Jeff Watson, Analog Devices (Maithil Pachchigar, Analog Devices; Ross Bannatyne, Clay Merritt, Vorago Technologies; Chris Conrad, Glenn Smollinger, Earle Drack, Petromar Technologies)

3:00pm-3:30pm

Lifetime and Failure Modes of High Temperature SOI Products
Derek Maxwell, RelChip (Matt Corless)


3:30pm-4:30pm

Break in the Exhibit area
(Exhibits End for the Conference at 4:30)


4:30pm-5:00pm

From Chips to Modules: Tackling the High Temperature Design Challenge
Zlatan Gradincic, CISSOID S.A. (Pierre Delatte)

5:00pm-5:30pm

Predict SiC MOSFET Aging
Laurent Martinez, X-REL Semiconductor

5:30pm-6:00pm

Moving to 0.15µm 225C HT SOI: The RC10002 Microcontroller
Marshall Soares, RelChip (Whitney Durham)


 

 



 

THURSDAY, MAY 10


7:00am-11:00am

Registration Open

7:00am-8:00am

Breakfast

 

NO EXHIBITS TODAY


8:00am-8:15am

Opening Remarks: Conference Chair –
Wayne Johnson, Tennessee Tech University


8:15am-9:00am

PLENARY:
US Geothermal Funding Outlook

This paper presents the need for geothermal well monitoring and the general environmental requirements of the geothermal well. HT SOI well monitoring electronics are presented. All well monitoring systems require data recording software on the surface. Surface support systems are also discussed. One of the major costs of any reservoir monitoring system is in the design and testing of the electronics and supporting system software. In fact, it is normal to spend over $100K USD on software development alone. Given the small size of the geothermal market, this cost impedes technology development. This paper outlines the design of the HT SOI well monitoring system using public domain software to aid in holding down development cost. This concept can encourage improved HT SOI well monitoring electronics for future geothermal applications.

Randy A Normann, On Measurement


SESSION 5

TH1: COMPONENTS
Session Chair: Colin Johnston, Oxford University

 

9:00am-9:30am

A 300°C High Reliability Halt/Hast Screening/Sorting Procedure for Ceramic Capacitors
Harold L. Snyder, Jr., Physical Solutions

9:30am-10:00am

Robust Reliability of Ceramic Capacitors for Power Electronics
Abhijit Gurav, KEMET Electronics Corporation (John Bultitude, John McConnell, Reggie Phillips)


10:00am-10:30am

Coffee/Tea Break


10:30am-11:00am

New Capacitive Sensor Performance
David Andrew, Rosemount Specialty Products

11:00am-11:30am

Mitigation of High Temperature Environments on Electrical Disconnects
Kenneth Dowhower, TE Connectivity

 

**SPEAKER WITHDREW APRIL 27**
Carbon Fiber-based Thermal Interface Materials for High Temperature Applications
MP Divakar, KULR Technology (Michael Mo)


 

11:30am

Closing Remarks



 

 



Registration Information: (Early Registration Deadline: April 13, 2018) | REGISTER ONLINE

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, receptions, refreshment breaks, and one (1) DOWNLOAD of the proceedings papers. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 4/13/18
Advance/Onsite Fee
After 4/13/18
IMAPS Member
$625
$725
Non-Member
$750
$850
Speaker
$450
$550
Chair
$450
$550
Student
$150
$200
Chapter Officer
$450
$550
Tabletop Exhibit (Member) - includes 2 exhibit personnel badges with meals
$800 -
SOLD OUT
$900 -
SOLD OUT
Tabletop Exhibit (Non-Member) - includes 2 exhibit personnel badges with meals
$900 -
SOLD OUT
$975 -
SOLD OUT
Premier Sponsorship (Includes Tabletop) - includes 1 tabletop, 2 session badges, 4 exhibit personnel badges with meals, and advertisements
$3500 -
SOLD OUT
$3500 -
SOLD OUT
Corporate Sponsorship (Includes Tabletop) - includes 1 tabletop, 1 session badge, and 2 exhibit personnel badges with meals
$2000 -
SOLD OUT
$2000 -
SOLD OUT
**CANCELLED** Pre-Conference Professional Development Course on:
HIGH TEMPERATURE ELECTRONICS -
ADDITIONAL EXPENSE TO CONFERENCE REGISTRATIONS NOTED ABOVE! Includes 1 badge to attend, 1 print copy of course notes, Lunch and Coffee Breaks.
$525
$525

REGISTER ONLINE


Speaker Dates/Information:

  • Abstract Deadline extended to: FEBRUARY 16, 2018
  • Speaker notification now: March 14, 2018
  • Early Registration/Hotel reservation cut-off: April 13, 2018
  • Final Manuscripts for Proceedings due: April 20, 2018
  • Speaker BIO Due: April 30, 2018
  • Presentation Slides Must Be Ready BEFORE: May 8, 2018
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event). The slide presentations that are used on the session laptops will be converted to secure PDFs and made available to conference paid attendees via download. Speakers needing to remove slides or update slides should do so before May 13 and email bschieman@imaps.org the new file)

 


Hotel Information -- Hotel Deadline: April 13, 2018
You must book your hotel directly with the host hotel:

Hotel Albquerque
800 Rio Grande Blvd. NW
Albuquerque, New Mexico 87104 USA
phone: 505.843.6300 | toll-free: 1.800.237.2133

Single/Double: $149/night + taxes/fees

Click here to book online!

Book your hotel reservation today! We have reserved a block of rooms at the host hotel to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.

 


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems