KESTER

International Conference and Exhibition on
High Temperature Electronics Network (HiTEN 2017)

July 10-12, 2017
Queens' College
Cambridge, United Kingdom

Abstract Deadline Extended: January 31, 2017

Conference Chairs:

Colin Johnston
Oxford University
colin.johnston@materials.ox.ac.uk

R. Wayne Johnson
Tennessee Tech University
wjohnson@tntech.edu

Organizing Committee:

Alison Crossley, University of Oxford (UK)
Andy Longford, Panda Europe IMAPS UK (UK)
Patrick McCluskey, CALCE (US)
Denis Flandre, UCL (B)
Bernd Michel, FHG-IZM (D)
Randy Norman, Perma Works (US)
Bernard Parmentier, Schlumberger (F)
Ovidiu Vermessan, SINTEF (N)
Matthias Werner, NMTC (D)
Wolfgang Wondrak, Daimler Chrysler (D)


Submit Abstracts

Registration Fees | Register On-line
Speaker Information/Deadlines | Room Reservations

Tabletop Exhibition Details | Reserve Booth(s) On-line | Sponsorship Opportunities


HiTEN Conference Focus:

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI).  Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Abstracts are being requested in the following areas:

  • Applications in the Aerospace, Automotive, Oil & Gas, and Geothermal Industries
  • Devices and applications
  • Novel devices
  • ASICs for high temperature applications
  • Memories
  • Passive components
  • Power devices
  • Semiconductor materials
  • Contacts and metallizations
  • Materials
  • Packaging and inter connects
  • Sealants, adhesives, solders
  • Reliability and failure mechanisms
  • Lifetime predictions
  • Accelerated life testing
  • Testing at high temperatures

Those wishing to present a paper at the HiTEN 2017 Conference must submit a 500 word abstract electronically by January 31, 2017, using the on-line submittal form at: www.imaps.org/abstracts.htm. All abstracts submitted must represent original, previously unpublished work.  All speakers are required to pay a reduced registration fee. 

Students wishing to present at the High Temperature Electronics Conference must also submit a 500 word abstract electronically no later than January 31, 2017; you must check the “YES, I’m a full-time Student” button at the bottom of the submission page after you enter your abstract text in order to be considered for the student competition award.

If your abstract is selected, a Final Manuscript for publication on the Conference Proceedings will be due on May 3, 2017.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

If you need assistance with the on-line submission form, please email Brian Schieman (bschieman@imaps.org).

 


Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check at the ATW/Conference. The selected student must attend the event to present his or her work and receive the award.
The Microelectronics Foundation




Speaker Dates/Information:

HiTEN Speaker Information:

  • Abstracts Due: January 31, 2017
  • Abstract Notification Emails Sent: February 24, 2017
  • Final Manuscript (Proceedings) due: May 3, 2017
  • Early Registration Deadline: June 2017
  • Room/Food Reservation Deadline: June 2017
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop, cloud, or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Final Manuscripts for the HiTEN Proceedings are due May 3, 2017.
Send Your Final Manuscript Via E-Mail to bschieman@imaps.org, in PDF format only (PDF can be in color).

Selected Manuscripts from HiTEN will be considered for publishing in the Journal of Microelectronics and Electronic Packaging. Invitations will be made separately. Inquiries can be sent to jmep@imaps.org.

Speakers must register for this conference at the reduced speaker rates. Early registration deadline is June 2017; and Room/Food reservation deadline is June 2017. See registration form for detailed information.

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.


Registration Information: (Early Registration Deadline: June 2017)

Delegate, Speaker/Chair, and Student registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) Proceedings CD-ROM. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 6/2017
Advance/Onsite Fee
After 6/2017
Tabletop Exhibit
$600
$700
Corporate Sponsorship (Includes Tabletop - Limit 8)
$1500
$1500
Premier Sponsorship (Includes Tabletop - Limit 4)
$3000
$3000

Register On-line

 


Housing Reservations: (Room/Food Reservation Deadline: June 2017)

Conference Location:
Queens' College
Cambridge, UK

DETAILS SOON

 

Register & Book Room/Food On-Line

 

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • GaN Systems
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Qualcomm
  • Quik-Pak
  • Specialty Coating Systems