International Conference and Exhibition on
High Temperature Electronics Network (HiTEN 2019)

July 8-10, 2019
St. Anne’s College in the University of Oxford
Oxford, United Kingdom

Conference Chairs:

Colin Johnston
Oxford University

F. Patrick McCluskey
University of Maryland

Organizing Committee:

John Fraley, Wolfspeed, a Cree Company | Holger Kappert, Fraunhofer IMS |
Andy Longford, Panda Europe IMAPS UK | Samjid Mannan, King's College London |
Randy Normann, Perma Works | Maithil Pachchigar, Analog Devices | Steve Riches, Tribus-D Ltd |
David Sarraf, TE Connectivity | Jeff Watson, Analog Devices

Premier Sponsors:
HiTEN Premier Sponsor - Presidio Components
4 Premier Spots Available


Corporate Sponsors:

HiTEN Corporate Sponsor - API Technologies
HiTEN Corporate Sponsor - TEKMOS
HiTEN Corporate Sponsor - XREL Semiconductor


Only 7 spaces remain!

Frequency Management Group
AdTech Ceramics
Souriau PA&E
Indium Corporation


HiTEN Conference Focus:

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI).  Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Abstracts are being requested in the following areas:

  • Applications in the Aerospace, Automotive, Oil & Gas, and Geothermal Industries
  • Devices and applications
  • Novel devices
  • ASICs
  • Memories
  • Passive components
  • Power devices
  • MEMS devices
  • Sensors
  • Semiconductor materials
  • Contacts and metallizations
  • Materials
  • Packaging and inter connects
  • Sealants, adhesives, solders
  • Reliability and failure mechanisms
  • Lifetime predictions
  • Accelerated life testing
  • Testing

Those wishing to present a paper at the HiTEN 2019 Conference must submit a 500 word abstract electronically immediately using the on-line submittal form at: All abstracts submitted must represent original, previously unpublished work.  All speakers are required to pay a reduced registration fee. 

Students wishing to present at the High Temperature Electronics Conference must also submit a 500 word abstract electronically immediately; you must check the “YES, I’m a full-time Student” button at the bottom of the submission page after you enter your abstract text in order to be considered for the student competition award.

If your abstract is selected, you will be asked to follow the speaker timeline: - Speaker Acceptance Email (April 9, 2019); - Final Manuscript due (May 24, 2019); - Speaker Registration complete (June 14, 2019); - BIO Submitted (June 28, 2019); and - Slides/Presentation Prepared (on/before July 7, 2019).

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

If you need assistance with the on-line submission form, please email Brian Schieman (


Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check at the ATW/Conference. The selected student must attend the event to present his or her work and receive the award.
The Microelectronics Foundation

Speaker Dates/Information:

HiTEN Speaker Information:

  • Abstracts Deadline Extended to: February 22, 2019
  • Abstract Notification Emails Sent: April 9, 2019
  • Final Manuscript (Proceedings Full Paper) due: May 24, 2019
  • Speaker Registration Deadline: June 14, 2019
  • Early Registration/Room/Food Reservation Deadline: June 14, 2019
  • Speaker BIO Submission Deadline: June 28, 2019
  • Slides/Presentations Prepared on/before: July 7, 2019
    • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop, cloud, or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Final Manuscripts for the HiTEN Proceedings are due May 24, 2019.
Send Your Final Manuscript Via E-Mail to, in PDF format only (PDF can be in color).

Selected Manuscripts from HiTEN will be considered for publishing in the Journal of Microelectronics and Electronic Packaging. Invitations will be made separately. Inquiries can be sent to

Speakers must register for this conference at the reduced speaker rates. Early registration deadline is June 14, 2019; and Room/Food reservation deadline is June 14, 2019. See registration form for detailed information.

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no official "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

Registration Information: (Early Registration Deadline: June 14, 2019) - REGISTER ONLINE

Delegate, Speaker/Chair, and Student registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) Proceedings CD-ROM. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Early Fee
Through 6/14/2019
Advance/Onsite Fee
After 6/14/2019
Delegate (Member/Non-Member)
$700 USD
$800 USD
Speaker / Chair
$500 USD
$600 USD
$225 USD
$350 USD
Tabletop Exhibit (IMAPS Member)
16 Tabletop Spots Available - 9 Remain
$800 USD
$900 USD
Tabletop Exhibit (Non-Member)
16 Tabletop Spots Available - 9 Remain
$900 USD
$975 USD
Premier Sponsorship (Includes Tabletop - Limit 4)
Includes 1 tabletop, 2 session badges, 4 exhibit personnel badges with meals, and advertisements
$3500 USD
$3500 USD
Corporate Sponsorship (Includes Tabletop - Limit 8)
Includes 1 tabletop, 1 session badge, and 2 exhibit personnel badges with meals
$2000 USD
$2000 USD

Register On-line


Housing Reservations: (Room Reservation Deadline: June 14, 2019)


Conference and Official Housing Location:
St. Anne's College
Oxford, UK

Single en-suite room and breakfast rate: £76 per night
Rooms are available between July 7 and July 10th.

Click here to book your room at St. Anne's College online. Enter promotional code HITEN30457.

Single en-suite rooms are available at St. Anne's College Oxford for £76 per night during the HiTEN conference. These collegiate housing accommodations include full English breakfast daily, towels, and toiletries. Please note that only single rooms (one twin bed) are available during this event. Check-in is not available prior to Sunday, July 7th and check-out is not available after July 11th. If you wish to extend your stay in Oxford on either end of the conference, please contact Brianne Lamm ( for a hotel map.

Travel Arrangements

For details on traveling to Oxford from London Heathrow (LHR), London Stansted (STN), or Gatwick Airport (LGW), click here.




  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic