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International Conference and Exhibition on
High Temperature Electronics Network (HiTEN)

July 18-20, 2011
St. Catherine’s College Oxford
Oxford, United Kingdom

Early Exhibit Deadline: June 23, 2011
Room/Food Reservation Deadline: June 23, 2011

Conference Chairs:

Colin Johnston
Oxford Applied Technology – UK

R. Wayne Johnson
Auburn University

Organizing Committee:

Alison Crossley, University of Oxford (UK)
Andy Longford, Panda Europe IMAPS UK (UK)
Patrick McCluskey, CALCE (US)
Denis Flandre, UCL (B)
Bernd Michel, FHG-IZM (D)
Randy Norman, Perma Works (US)
Bernard Parmentier, Schlumberger (F)
Sascha  Schwarze, Baker Hughes INTEQ (D)
Ovidiu Vermessan, SINTEF (N)
Matthias Werner, NMTC (D)
Wolfgang Wondrak, Daimler Chrysler (D)

Tabletop Exhibit Application

Questions about exhibits?
Michael O'Donoghue, IMAPS,

Brian Schieman, IMAPS,

HiTEN 2011 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics And Packaging Society (IMAPS), HiTEN 2011 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HiTEN is silicon and silicon-on-insulator (SOI). Although, HiTEN is not simply a semiconductor focused network. HiTEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Over 100 participants attended the 2009 conference, representing companies such as Baker Hughes, Cissoid S.A., GE, Honeywell, Sandia National Laboratories, Schulmberger, TSL and various academic institutions. Delegates hailed from Belgium, China, France, Japan, Germany, Norway, Sweden, the US and the UK.

Exhibition Information

Exhibit Hours:
Monday, July 18 -- 10:00 am - 5:30 pm
Refreshment Breaks will be held in the Exhibit Area.

Tuesday, July 19 -- 10:00 am - 4:00 pm
Refreshment Breaks will be held in the Exhibit Area.

Installation Hours:
Monday, July 18 -- 8:00 am - 10:00 am

Dismantle Hours:
Tuesday, July 19 -- 4:00 pm - 6:00 pm

Tabletop Registration Fees:*

  Through 6/23/11 After 6/23/11
IMAPS Corporate Members $575 $675
Non-Members $675 $775

IMAPS reserves the right to refuse any potential exhibitor or advertiser should IMAPS
deem the promotion of a company or organization inappropriate for any reason.

Included with your registration:

• one (1) six foot draped table
• two (2) chairs
• one (1) Technical Proceedings CD-ROM
• one (1) List of Attendees * (sent after the event)
• one (1) Booth Personnel

Additional booth personnel are welcome at an extra cost to cover their meals. Registrations for the full conference are not included, but are available at an additional cost.

Hotel Information: (Room/Food Reservation Deadline: June 23, 2011)

Conference Location:
St. Catherine’s College Oxford
Manor Road
United Kingdom

Delegates Arrival/Check-in:
Delegates are to report to the Porters Lodge upon arrival. Check-in is from 2:00 pm onwards on the day of arrival. If you arrive before this time you can leave your luggage in the safe room at the lodge. The lodge will assign you a room and give you the keys.

The hall will be open at all meal times and delegates can just arrive and be seated. Lunch is served promptly at 1.00 pm and Dinner at 7.00 pm; they are both served meals. Breakfast is more informal, served buffet style from 8.00 am - 9.00 am.


Marketing Feature Available for Exhibitors:

IMAPS will extend to all exhibitors an opportunity to provide an unlimited amount of pages of company products, services and contact information to be included in the Technical Proceedings CD-ROM. These CD-ROMs are provided to all technical conference attendees and are for sale through IMAPS to all industry professionals.

This unique feature will allow exhibiting companies an unlimited amount of promotional material for their products and services that will go well beyond their exposure at the Conference.

There is no charge for this optional feature. However, the deadline (6/17/11) must be met in order to be included.

Submissions should be sent electronically in one (1) file, either PDF or Word, that is easy to open, not password-protected and in a logical format. Any materials not sent in the required format or that arrive after the deadline, may not appear on the CD-ROM.Send files to on or before June 17, 2011.



Corporate Sponsors:

HiTEN Corporate Sponsor - CISSOID

HiTEN Corporate Sponsor - Texas Instruments

HiTEN Corporate Sponsor - Trendsetter Electronics

HiTEN Corporate Sponsor - XREL Semiconductor

HiTEN Corporate Sponsor -  Honeywell

HiTEN Corporate Sponsor - Fairchild Semiconductor

© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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