Device Packaging 2019

International Conference and Exhibition on
High Temperature Electronics Network (HiTEN 2017)

July 10-12, 2017
Queens' College
Cambridge, United Kingdom

Conference Chairs:

Colin Johnston
Oxford University

R. Wayne Johnson
Tennessee Tech University

Organizing Committee:

Alison Crossley, University of Oxford (UK)
Andy Longford, Panda Europe IMAPS UK (UK)
Patrick McCluskey, CALCE (US)
Denis Flandre, UCL (B)
Bernd Michel, FHG-IZM (D)
Randy Normann, Perma Works (US)
Bernard Parmentier, Schlumberger (F)
Ovidiu Vermessan, SINTEF (N)
Matthias Werner, NMTC (D)
Wolfgang Wondrak, Daimler Chrysler (D)


Premier Sponsors:
HiTEN Premier Sponsor - Presidio Components
HiTEN Premier Sponsor - Evans Capacitor Company
2 Premier Spots Available


Corporate Sponsors:

HiTEN Corporate Sponsor - Analog Devices
HiTEN Corporate Sponsor - Joule
HiTEN Corporate Sponsor - KEMET
HiTEN Corporate Sponsor - CISSOID
HiTEN Corporate Sponsor - XREL Semiconductor
HiTEN Corporate Sponsor - TEKMOS
HiTEN Corporate Sponsor - Trendsetter Electronics

1 Corporate Spot Available

Tabletop Exhibit Information

2017 Exhibiting Companies
Exhibit Info | Hours | Install | Dismantle | Costs | What's Included

Questions about exhibits?
Brian Schieman, IMAPS,

HiTEN 2017 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society (IMAPS), HiTEN 2017 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HiTEN is silicon and silicon-on-insulator (SOI). Although, HiTEN is not simply a semiconductor focused network. HiTEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Over 150 participants attended the 2015 conference, representing companies such as Baker Hughes, Cissoid S.A., GE, Honeywell, Sandia National Laboratories, Schulmberger, Texas Instruments, TSL and various academic institutions. Delegates hailed from Belgium, China, France, Japan, Germany, Norway, Sweden, the US and the UK.

Thank you to the HiTEN 2017 Sponsors & Exhibitors.
Please be sure to stop by their tabletops during the Conference to learn more…

Exhibiting Organization:


AdTech Ceramics

Analog Devices, Inc.

Charcroft Electronics Ltd.


Evans Capacitor Company

Filtronic Solid State, Inc.

First Run Tools

Frequency Management International

Hi-Rel Group LLC

Indium Corporation

Joule Sales and Marketing


Knowles (UK) Ltd.


Micross Components Ltd.

Microwave Marketing.Com Ltd.

Optim Wafer Services

PandA Europe Limited &
IMAPS UK Chapter

Presidio Components, Inc.


Trendsetter Electronics

TT Semiconductor, Inc

Vorago Technologies

X-REL Semiconductor


Exhibition Information

Exhibit Hours:
Monday, July 10 -- 10:00 am - 7:00 pm
Refreshment Breaks & Wine Reception will be held in the Exhibit Area.

Tuesday, July 11 -- 10:00 am - 3:30 pm
Refreshment Breaks & Wine Reception will be held in the Exhibit Area.

Installation Hours:
Monday, July 10 -- 7:00 am - 10:00 am

Dismantle Hours:
Tuesday, July 11 -- 3:30 pm - 7:00 pm


All packages should be sent to the address below and arrive no earlier than Thursday, July 6:

Queens' College
Attn: Catering/Conference Events Coordinator - Bettina Morber
Silver Street, Cambridge, CB3 9ET, United Kingdom
Phone: +44 (0)1223 335592 or +44(0)1223 746762

IMAPS HiTEN Conference
For the attention of ___, on behalf of [YOUR COMPANY]


Tabletop Registration Fees:*

Through 6/2/17
After 6/2/17
IMAPS Corporate Members

IMAPS reserves the right to refuse any potential exhibitor or advertiser should IMAPS
deem the promotion of a company or organization inappropriate for any reason.

Included with your registration:

• one (1) six foot table
• two (2) chairs
• one (1) Technical Proceedings DOWNLOAD
• one (1) List of Attendees * (sent after the event)
• one (1) Booth Personnel

Additional booth personnel are welcome at an extra cost to cover their meals. Registrations for the full conference are not included, but are available at an additional cost.


Housing Reservations:(Room Reservation Deadline: June 2, 2017)

Conference Location:
Queens' College
Cambridge, CB3 9ET, United Kingdom
Phone: +44 (0)1223 335511


Book your lodging reservation directly with the College today! We have reserved a block of rooms at the College to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates OR MIGHT NOT BE AVAILABLE. IMAPS room blocks at most events historically sell out ahead of the discount deadline, so we encourage you to make your reservations quickly for the best price and availability.



  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic